Electronic component housing assembly potting apparatus

Abstract

The utility model relates to automatic technology field especially electronic component shell equipment of assembling glue filling, including feeding mechanism, shell feeding mechanism, coding mechanism, preassembly mechanism, transfer mechanism, pressure equipment, tray mechanism and glue filling system, preassembly mechanism includes preassembly rotation module, rotation base plate and two groups of preassembly clamping module, rotation base plate sets up on preassembly rotation module, two groups of preassembly clamping module are oppositely arranged at both sides of rotation base plate, shell feeding mechanism is used for loading to preassembly clamping module with shell, preassembly rotation module is used for driving rotation base plate to drive preassembly clamping module rotation, feeding mechanism is used for electronic component feeding and feeding to the shell in preassembly clamping module. The utility model is applied to electric reactor production, and has shown the outstanding technical effect in the assembly precision, quality control, glue filling effect and production logistics etc.

Claims

1. An electronic component housing assembly and potting equipment, characterized in that: The system includes a feeding mechanism, a shell feeding mechanism, a marking mechanism, a pre-assembly mechanism, a transfer mechanism, a pressing mechanism, a tray-loading mechanism, and a dispensing system. The pre-assembly mechanism includes a pre-assembly rotating module, a rotating substrate, and two sets of pre-assembly clamping modules. The rotating substrate is mounted on the pre-assembly rotating module, and the two sets of pre-assembly clamping modules are positioned opposite each other on both sides of the rotating substrate. The shell feeding mechanism feeds shells toward the pre-assembly clamping modules. The pre-assembly rotating module drives the rotating substrate to rotate the pre-assembly clamping modules. The feeding mechanism feeds electronic components into the shells on the pre-assembly clamping modules. The marking mechanism marks the shells from the shell feeding mechanism. The transfer mechanism transfers the shells from the pre-assembly clamping module to the pre-assembly clamping modules. After the electronic components are assembled, the housing is gripped and sequentially transferred to the pre-assembly clamping module, the pressing mechanism, and the tray-sinking mechanism. The pressing mechanism is used to press and fix the electronic components inside the housing, and the tray-sinking mechanism is used to place the housing containing the electronic components onto a tray. The glue-filling system includes a glue-filling conveyor line, a primary glue-filling mechanism, and a secondary glue-filling mechanism. One end of the glue-filling conveyor line is connected to the tray-sinking mechanism. The tray-sinking mechanism is equipped with a tray for placing the assembled electronic components onto the tray. The glue-filling conveyor line is used for positioning and conveying the tray, and sequentially conveys the tray through the primary glue-filling mechanism and the secondary glue-filling mechanism. The primary glue-filling mechanism and the secondary glue-filling mechanism respectively perform primary glue-filling and secondary glue-filling on the housing.

2. The electronic component housing assembly and potting equipment according to claim 1, characterized in that: The feeding mechanism includes a receiving module and a picking and loading module. The receiving module is used to receive front-end electronic components, and the picking and loading module is used to pick up electronic components from the receiving module and load them into the housing. The receiving module includes a receiving transmission module, a receiving lifting module, and a receiving clamping module. The receiving transmission module is used to drive the receiving lifting module to move longitudinally, and the receiving clamping module is mounted on the receiving lifting module to receive electronic components provided by the front-end device. The material loading module includes a horizontal transmission support, a loading transmission module, a loading lifting module, and an assembly clamping module. The assembly clamping module is provided with an assembly buffer module connected to the loading lifting module. The loading transmission module is mounted on the horizontal transmission support, and the loading lifting module is mounted on the loading transmission module. The assembly clamping module is used to grab electronic components from the material receiving clamping module. During loading, the outer casing is buffered by the assembly buffer module.

3. The electronic component housing assembly and potting equipment according to claim 1, characterized in that: The outer shell feeding mechanism includes a direct vibration feeding track, an outer shell feeding gripping module, and a coding and positioning module; the direct vibration feeding track is used for direct vibration feeding of the outer shell, the outer shell feeding gripping module is used to grip the outer shell from the direct vibration feeding track and move it sequentially to the coding and positioning module and the pre-assembly clamping module, and the coding mechanism includes a laser coding machine for laser coding the outer shell on the coding and positioning module; The front end of the linear vibratory feeding track is provided with a shell positioning seat for positioning the shell at the front end. The shell feeding gripping module includes a shell gripping transmission module, a shell gripping lifting module, and a shell gripping module. Two sets of shell gripping modules are provided and are set on the shell gripping lifting module. The shell gripping lifting module is set on the shell gripping transmission module. The shell gripping module is used to grip the shell from the shell positioning seat and alternately place it in the coding positioning module and the pre-assembly clamping module.

4. The electronic component housing assembly and potting equipment according to claim 1, characterized in that: The pre-assembled clamping module includes a clamping base plate, an assembly positioning groove, and an assembly pressing cylinder. The clamping base plate is disposed on the rotating base plate, the assembly positioning groove is disposed on the clamping base plate, and the assembly pressing cylinder is used to press and fix the outer shell onto the assembly positioning groove.

5. The electronic component housing assembly and potting equipment according to claim 1, characterized in that: The transfer mechanism includes a transfer bracket, a transfer transmission module, a transfer pushing module, a transfer lifting module, and a transfer clamping module. The transfer transmission module is mounted on the transfer bracket, the transfer pushing module is mounted on the transfer transmission module, the transfer lifting module is mounted on the transfer pushing module, and the transfer clamping module is mounted on the transfer lifting module. Two sets of transfer clamping modules are provided to sequentially transfer the housing containing electronic components to the pre-assembly clamping module, the pressing mechanism, and the tray mechanism.

6. The electronic component housing assembly and potting equipment according to claim 1, characterized in that: The pressing mechanism includes a pressing base, a pressing clamping module, and a secondary pressing module. The pressing clamping module is mounted on the pressing base. The secondary pressing module includes a pressing drive cylinder and a pressing block. The pressing clamping module is used to clamp and fix the housing. The pressing drive cylinder is used to drive the pressing block to press the electronic components into the housing.

7. The electronic component housing assembly and potting equipment according to claim 1, characterized in that: The tray-setting mechanism includes a tray-setting transfer module and a tray-setting robot. The tray-setting transfer module is used to receive the products transferred by the transfer mechanism, the tray-setting transfer module is used to transfer the products to the area below the tray-setting robot, and the tray-setting robot is used to place the products on the tray. The tray transfer module includes a transfer and unloading fixture and a transfer transmission cylinder. The transfer and unloading fixture is mounted on the transfer transmission cylinder for fixing and conveying products. The tray manipulator includes an XYZ transmission module and a product clamping cylinder. The product clamping cylinder is used to clamp the product and, under the action of the XYZ transmission module, moves the product toward the tray.

8. The electronic component housing assembly and potting equipment according to claim 1, characterized in that: The glue dispensing conveyor line is equipped with a positioning and lifting module. The positioning and lifting module is provided in multiple sets and corresponds to the tray-sinking mechanism, the primary glue dispensing mechanism and the secondary glue dispensing mechanism respectively. The positioning and lifting module is used for positioning and lifting the tray for positioning tray-sinking and glue dispensing.

9. The electronic component housing assembly and potting equipment according to claim 8, characterized in that: The primary dispensing mechanism includes a first dispensing system, a first dispensing robot, and a first dispensing head. The first dispensing robot is an XYZ transmission robot to drive the first dispensing head to move in relation to the material tray in order to dispense glue to the electronic components. The first dispensing system is used to supply glue to the first dispensing head.

10. The electronic component housing assembly and potting equipment according to claim 9, characterized in that: The secondary dispensing mechanism includes a second dispensing system, a second dispensing robot, and a second dispensing head. The second dispensing robot is an XYZ transmission robot to drive the second dispensing head to move in relation to the material tray in order to dispense glue to the electronic components. The second dispensing system is used to supply glue to the second dispensing head.

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