High-strength composite copper foil

CN224696753UActive Publication Date: 2026-08-28ANHUI FEITUO NEW MATERIALS TECHNOLOGY CO LTD
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Patent Information

Application Number
CN202520827763.7
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-04-28
Publication Date
2026-08-28
Estimated Expiration
2035-04-28

AI Technical Summary

Technical Problem

[0004]本实用新型目的是为了解决现有技术中在涂布过程中复合铜箔的铜层更容易断层,且断层的隐蔽性较高,影响最终锂电池的性能,提供了一种高强复合铜箔通过用双向拉伸改性的高分子基材层作为基材,通过改性技术提高了基材的拉伸强度

Benefits of technology

[0014]本实用新型通过用双向拉伸改性的高分子基材层作为基材,通过改性技术提高了基材的拉伸强度,相比传统的低拉伸强度高延伸率的高分子基材,高分子基材层在拉伸强度方面有显著提升,能够抵抗外力对铜箔的影响,同时保持一定的延展性,这有效避免了铜箔在生产过程中的断裂问题,即使在工艺操作中出现过度拉伸,铜箔也能在接近一定延伸率时直接断裂,而不是出现“隐蔽性断层”问题,这有助于确保后续生产过程中的稳定性,避免了铜层致密性差而不易被发现的潜在问题。

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Abstract

The utility model relates to lithium battery technical field especially, more particularly to a kind of high-strength composite copper foil, the high-strength composite copper foil includes high molecular matrix layer, upper copper plating layer and lower copper plating layer, the upper copper plating layer is set on the high molecular matrix layer upper surface.By using the high molecular matrix layer of two-way stretch modification as substrate, the tensile strength of substrate is improved by modification technology, compared with the high molecular matrix of traditional low tensile strength high elongation, the high molecular matrix layer has significant improvement in tensile strength, can resist the influence of external force on copper foil, while maintaining certain ductility, which effectively avoids the fracture problem of copper foil in production process, even in process operation appears excessive stretching, copper foil can be directly broken when close to certain elongation, instead of appearing "hidden fault" problem, which helps to ensure the stability in subsequent production process, avoids the potential problem that copper layer is not easy to be found due to poor compactness.
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