A microstrip coupler

Abstract

The utility model relates to the field of microwave communication technology especially relates to a kind of microstrip coupler.The coupler includes: coupling line and the top layer microstrip line layer, middle multilayer dielectric layer and bottom ground layer connected in sequence;The top layer microstrip line layer includes multiple bending sections, each described bending section is configured as the curve shape corresponding to frequency band and coupling degree;The middle multilayer dielectric layer includes multiple dielectric constant and the dielectric layer combined of different thickness material;Multiple via holes are set on the bottom ground layer, for connecting heat dissipation device;The coupling line is set on the top layer microstrip line layer, and the coupling line includes multiple different length and width microstrip line section. Thus realize the technical effect of miniaturization of microstrip coupler, and improve stability.

Claims

1. A microstrip coupler, characterized in that, include: The coupling line is connected sequentially to the top microstrip line layer, the middle multi-layer dielectric layer, and the bottom ground layer; The top microstrip line layer includes multiple bends, each of which is configured with a curve shape corresponding to the frequency band and coupling degree. The intermediate multilayer dielectric layer comprises multiple dielectric layers composed of materials with different dielectric constants and thicknesses; The bottom ground layer has multiple vias for connecting heat dissipation devices; The coupling line is disposed on the top microstrip line layer, and the coupling line includes multiple microstrip line segments of different lengths and widths.

2. The microstrip coupler according to claim 1, characterized in that, The top microstrip layer comprises microstrip lines made of a silver alloy material.

3. The microstrip coupler according to claim 1, characterized in that, The microstrip segments of the coupling line are connected by a transition structure.

4. The microstrip coupler according to claim 1, characterized in that, The intermediate multilayer dielectric layer includes multiple dielectric layers, and the material of each dielectric layer includes one or more of polytetrafluoroethylene and ceramic composite materials.

5. The microstrip coupler according to claim 1, characterized in that, The bottom grounding layer is made of copper alloy material, and the thickness of the bottom grounding layer is between 0.4 mm and 0.5 mm. The diameter of the vias on the bottom ground layer is 0.35 mm to 0.45 mm.

6. The microstrip coupler according to claim 1, characterized in that, It also includes impedance matching networks; The impedance matching network is set at the input port, output port, and designated signal transmission node of the microstrip coupler.

7. The microstrip coupler according to claim 6, characterized in that, The impedance matching network includes multiple inductors and multiple capacitors, which together form an LC resonant circuit.

8. The microstrip coupler according to claim 1, characterized in that, It also includes adjustable capacitor-inductor arrays; The adjustable capacitor-inductor array is disposed in a designated area of ​​the microstrip line segment.

9. The microstrip coupler according to claim 1, characterized in that, It also includes a microprocessor and a digital-to-analog converter circuit; The microprocessor outputs a control voltage through the digital-to-analog converter circuit based on a preset coupling value or real-time monitored signal parameters.

10. The microstrip coupler according to claim 1, characterized in that, It also includes thermal fins and thermal conductive channels, which are disposed in the housing of the microstrip coupler.

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