A PAmid circuit and package structure
CN224697750UActive Publication Date: 2026-08-28ZHENSHI INFORMATION TECH SHANGHAI CO LTD
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Patent Information
- Application Number
- CN202521297131.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-06-23
- Publication Date
- 2026-08-28
- Estimated Expiration
- 2035-06-23
AI Technical Summary
Technical Problem
[0004]本实用新型提供了一种PAmid电路及封装结构，以解决PAmid电路中的灵活性低和信号传输效率差的问题
Benefits of technology
[0009]根据本实用新型的另一方面，提供了一种PAmid封装结构，包括：基板层、走线层、器件摆放层、保护层和散热层，所述散热层嵌入在所述基板层中，本实用新型任意实施例提供的PAmid电路使用所述PAmid封装结构进行封装。
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Figure CN224697750U_ABST
Abstract
The utility model discloses a kind of PAmid circuit and packaging structure.PAmid circuit includes: external communication interface, first switch module, second switch module, first filter module, second filter module and duplexer module.External communication interface is used to determine the conduction path of first radio frequency signal or second radio frequency signal in the post-circuit according to the duplex transmission property of first radio frequency signal or second radio frequency signal;Duplexer module is used to synchronously emit first radio frequency signal and receive second radio frequency signal;Second switch module is used to transmit first radio frequency signal to radio frequency signal transceiver end or transmit the second radio frequency signal received by radio frequency signal transceiver end to first filter module, second filter module or duplexer module according to the control of external communication interface.The utility model embodiment improves the radio frequency signal transmission efficiency and flexibility of PAmid circuit.
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