A small-sized camera module based on double-layer cofferdam

Abstract

The utility model relates to a kind of miniaturization camera module based on double-layer cofferdam, comprising: circuit board, install photosensitive chip, photosensitive chip and circuit board are electrically connected by multiple gold wires, and several gold wire bonding areas are formed in the outer periphery of photosensitive chip;Support structure, top is equipped with light transmission hole, side is equipped with several hollow areas, gold wire bonding area is located at hollow area, photosensitive chip is located below light transmission hole;Cofferdam structure, including inner cofferdam, outer cofferdam and filling glue between the two, inner cofferdam is enclosed in support structure to close hollow area, outer cofferdam is enclosed in the edge of circuit board bearing surface;Filter and motor lens group, in turn place in support structure.The utility model double-layer cofferdam design cooperation filling glue of inner cofferdam and outer cofferdam constitutes a multiple sealing protection system, effectively avoid the influence of dust, humidity and mechanical impact on circuit board and electronic components thereon.

Description

Technical Field

[0001] This utility model relates to the field of cameras, and more specifically, to a miniaturized camera module based on a double-layered cofferdam. Background Technology

[0002] With the rapid development of smartphones, autonomous driving, and various IoT devices, the demands and requirements for camera modules, as the core components of visual perception, are increasing. Simultaneously, devices themselves are constantly evolving towards thinner and smaller designs, posing even greater challenges to the miniaturization technology of camera modules, such as miniaturized camera modules with a planar size of less than 10mm*10mm. In camera modules, the gold wires connecting the photosensitive chip and the circuit board are extremely thin and fragile, and their bonding areas are highly susceptible to corrosion from moisture, dust, and chemical contaminants in the environment, leading to circuit corrosion, short circuits, or gold wire breakage, thus causing the entire module to fail. Related technologies involve injection molding a package module onto the circuit board to protect the gold wires and simultaneously serve as a support structure for the motor and lens assembly. However, in practical applications, it has been found that this method not only requires mold making, increasing costs, but also results in a very large overall package module size to ensure support, which is detrimental to the miniaturization of camera modules. Utility Model Content

[0003] In view of this, the present invention provides a miniaturized camera module based on a double-layer cofferdam that can effectively reduce the size of the camera module and ensure sealing.

[0004] The objective of this utility model is achieved through the following technical solution: A miniaturized camera module based on a double-layer cofferdam includes: A circuit board has a carrier surface on which a photosensitive chip is mounted. The photosensitive chip is electrically connected to the circuit board via multiple gold wires, and several gold wire bonding areas are formed on the outer periphery of the photosensitive chip. A support structure is provided on the bearing surface of the circuit board. The top of the support structure is provided with a light-transmitting hole and the side is provided with several hollow areas. The gold wire bonding area is located in the hollow area and the photosensitive chip is located below the light-transmitting hole. The cofferdam structure includes an inner cofferdam, an outer cofferdam, and filler glue between the two. The inner cofferdam is provided at the support structure to close the hollow area, and the outer cofferdam is provided at the edge of the circuit board bearing surface. The filter and motor lens assembly are placed on the support structure from bottom to top.

[0005] In the aforementioned technical solution, the double-layered cofferdam design, consisting of an inner and outer cofferdam, combined with filler adhesive, forms a multi-layered sealing and protection system. The inner cofferdam directly seals the hollowed-out area of ​​the support structure, effectively isolating the photosensitive chip from dust, moisture, and other contaminants. The outer cofferdam forms a final barrier at the edge of the circuit board, further enhancing the overall airtightness and moisture resistance of the module. Secondly, the filler adhesive between the inner and outer cofferdams not only provides a seal but also bonds the two cofferdams into a robust whole. This structure significantly enhances the mechanical strength of the cofferdam section, enabling it to better withstand external stress, impact, and vibration, protecting the fragile gold wire connections, and reducing the risk of failure due to physical damage.

[0006] Therefore, the design of the double-layer cofferdam and filler effectively avoids the impact of dust, moisture and mechanical shock on the circuit board and its electronic components. It can effectively resist the breakage of gold wires caused by vibration or external force, improve connection reliability, and thus greatly enhance the long-term working reliability of the camera module in harsh environments.

[0007] Alternatively, in one possible implementation, the outer cofferdam is located between the circuit board bearing surface and the bottom surface of the motor lens assembly, and is used to fill the gap between them.

[0008] In the above technical solution, the outer cofferdam fills the gap between the circuit board bearing surface and the bottom surface of the motor lens assembly, which is equivalent to forming a solid "structural adhesive layer" between the lens motor and the circuit board. This not only plays a sealing role, but also firmly bonds the motor lens assembly, support structure, and circuit board into a unified rigid whole. This greatly enhances the mechanical strength of the camera module, effectively resists torsional and shear stress, and prevents relative displacement or delamination between components during drops or compression.

[0009] Optionally, in one possible implementation, the circuit board is further provided with a plurality of electronic components, and there is a clearance gap between the electronic components and the gold wire bonding area.

[0010] In the above technical solution, during the assembly of the camera module, multiple electronic components need to be accurately soldered or mounted onto the circuit board and rationally arranged with the gold wire bonding area. The clearance between the electronic components and the gold wire bonding area provides a clear installation reference for the assembly personnel, enabling them to more easily place the electronic components in the correct position and avoid collisions or interference with the gold wire due to improper installation.

[0011] Alternatively, in one possible implementation, a plurality of the electronic components are located between the inner dike and the outer layer, and the filler adhesive covers the electronic components.

[0012] In the aforementioned technical solution, key electronic components are positioned between the inner and outer cofferdams and completely covered by filler adhesive, constructing a comprehensive protection system. This ensures that the electronic components are simultaneously protected by physical structure, chemical sealing, and mechanical stress. This "triple protection" significantly enhances the reliability of the entire subsystem.

[0013] Optionally, in one possible implementation, the support structure includes a ring beam and a plurality of support columns. The ring beam is mounted above the gold wire bonding area via the plurality of support columns. The first end of each support column is fixed to the ring beam, and the second end is fixed to the circuit board. The hollow area is formed between two adjacent support columns.

[0014] In the above technical solution, the ring beam is erected above the gold wire bonding area by multiple support columns. This connection and support method abandons the traditional bulky support structure and effectively reduces the space occupied by the support structure in the horizontal and vertical directions, thereby significantly reducing the size of the support lens structure and enabling the entire camera module to develop towards miniaturization.

[0015] Alternatively, in one possible implementation, the inner cofferdam is located at any of the inner, outer, or bottom sides of the ring beam.

[0016] In the above technical solution, the camera module contains a variety of optical components, such as some electronic components on the circuit board, and the variability of the cofferdam position can better adapt to the layout of these components.

[0017] Alternatively, in one possible implementation, the top of the inner cofferdam is flush with or protrudes from the side of the ring beam away from the support column.

[0018] In the above technical solution, the inner cofferdam can work together with the support columns and ring beams to support the lens assembly. That is, the inner cofferdam has both the functions of shading and support, which can effectively distribute the pressure borne by the support columns and ring beams. This allows the size of the ring beam to be further simplified, that is, the width or length of the ring beam can be reduced. After the size of the ring beam is simplified, the space occupied by the camera module in the XY plane is further reduced, thereby further compressing the volume of the camera module and better adapting to the needs of miniaturized application scenarios.

[0019] Optionally, in one possible implementation, the ring beam includes multiple connecting segments, which are connected end to end to form a closed ring structure or are spaced apart to form an open ring structure; when the ring beam is an open ring structure, each connecting segment is provided with one or more supporting columns.

[0020] In the above technical solutions, the different shapes of the ring beam structures allow the support and cofferdam structures to be customized according to the overall design of the camera module and the installation space. For example, the closed ring beam structure is suitable for camera modules with high requirements for structural integrity and stability and relatively regular installation space; while the open ring beam structure can be used when space is limited or when special coordination with other components is required. By reasonably adjusting the position and length of the connecting sections and the distribution of the support columns, a perfect match between the structure and the space can be achieved, improving space utilization.

[0021] Alternatively, in one possible implementation, the support column and the ring beam may be made of the same or different materials.

[0022] In the above technical solution, using different materials for the support columns and ring beams makes the design of the support structure more flexible, allowing for flexible combinations to suit different usage scenarios and needs. For example, high-strength materials can be used for the support columns, emphasizing vertical support stability; while lightweight materials can be used for the ring beams, emphasizing horizontal structural integrity. In other words, the support columns and ring beams can be selected with appropriate materials according to different stress requirements, significantly reducing the overall weight while ensuring strength.

[0023] Optionally, in one possible implementation, a groove is provided on the support structure inside the light-transmitting hole, and the filter is fitted into the groove.

[0024] In the above technical solution, the groove provides a high-precision mechanical positioning reference for the filter. During assembly, the filter can be passively and accurately snapped into the predetermined position, improving assembly efficiency; at the same time, the depth design of the groove allows the upper surface of the filter to be slightly lower than or flush with the top surface of the support structure, thus reducing the overall assembly height of the camera module and further reducing the size of the camera module. Attached Figure Description

[0025] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0026] Figure 1 This is an exploded view of the overall structure of one embodiment.

[0027] Figure 2 This is an exploded view of support structure 4 in one embodiment.

[0028] Figure 3 This is a top view of a portion of the structure of an implementation.

[0029] Reference numerals: 1-Circuit board; 11-Electronic components; 2-Photosensitive chip; 3-Gold wire; 30-Gold wire bonding area; 4-Support structure; 41-Ring beam; 410-Connecting section; 411-Light transmission hole; 412-Gate; 42-Support column; 421-Hollowed-out area; 5-Dyke structure; 51-Inner dike; 52-Outer dike; 53-Filling adhesive; 6-Filter; 7-Motor and lens assembly. Detailed Implementation

[0030] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0031] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0032] Please refer to Figures 1-3 .

[0033] This embodiment provides a miniaturized camera module based on a double-layer cofferdam, including: a circuit board 1, a support structure 4, a cofferdam structure 5, a filter 6, and a motor lens assembly; the circuit board 1 has a bearing surface, on which a photosensitive chip 2 is mounted, and the photosensitive chip 2 is electrically connected to the circuit board 1 by multiple gold wires 3, and several gold wire bonding areas 30 are formed on the outer periphery of the photosensitive chip 2; the support structure 4 is disposed on the bearing surface of the circuit board 1, and the top of the support structure 4 is provided with a light-transmitting hole 411, and the side is provided with several hollow areas 421, the gold wire bonding areas 30 are located at the hollow areas 421, and the photosensitive chip 2 is located below the light-transmitting hole 411; the cofferdam structure 5 includes an inner cofferdam 51, an outer cofferdam 52, and a filler 53 filling the space between the two, the inner cofferdam 51 surrounds the support structure 4 to close the hollow areas 421, and the outer cofferdam 52 surrounds the edge of the bearing surface of the circuit board 1; the filter 6 and the motor lens assembly are placed on the support structure 4 from bottom to top.

[0034] In this embodiment, the double-layered cofferdam design of the inner cofferdam 51 and the outer cofferdam 52, combined with the filler adhesive 53, constitutes a multi-layered sealing and protection system. The inner cofferdam 51 directly seals the hollow area 421 of the support structure 4, effectively isolating the photosensitive chip 2 from dust, moisture, and other contaminants. The outer cofferdam 52 forms a final barrier at the edge of the circuit board 1, further improving the overall airtightness and moisture resistance of the module. Furthermore, the filler adhesive 53, filled between the inner and outer cofferdams 52, not only provides a seal but also bonds the two cofferdams into a robust whole. This structure significantly enhances the mechanical strength of the cofferdam section, enabling it to better withstand external stress, impact, and vibration, protecting the fragile gold wire 3 connection, and reducing the risk of failure due to physical damage.

[0035] Therefore, the design of the double-layer cofferdam and filler 53 effectively prevents the circuit board 1 and its electronic components 11 from being affected by dust, moisture and mechanical impact. It can effectively resist the breakage of the gold wire 3 caused by vibration or external force, improve the connection reliability, and thus greatly enhance the long-term working reliability of the camera module in harsh environments.

[0036] Specifically, in this embodiment, both the inner cofferdam 51 and the outer cofferdam 52 are annular structures. The two cofferdams can be integrally formed by local connecting ribs of the same material, or they can be formed independently and then fixed by adhesive to ensure that the area between them forms a closed filling space. The inner and outer cofferdams 52 can be made of the same or different materials, including but not limited to polymer light-shielding adhesives that combine light-shielding and sealing properties, high-strength and light-shielding metal-coated ceramics, or high-temperature resistant and easily moldable semiconductor packaging cofferdam resins, etc.

[0037] In this embodiment, the outer cofferdam 52 is located between the bearing surface of the circuit board 1 and the bottom surface of the motor lens assembly, and is used to fill the gap between them. The outer cofferdam 52 fills the gap between the bearing surface of the circuit board 1 and the bottom surface of the motor lens assembly, effectively forming a robust "structural adhesive layer" between the lens motor and the circuit board 1. This not only provides a seal but also firmly bonds the motor lens assembly, the support structure 4, and the circuit board 1 into a unified, rigid whole. This greatly enhances the mechanical strength of the camera module, effectively resisting torsional and shear stresses and preventing relative displacement or delamination between components during drops or compression.

[0038] The circuit board 1 in this embodiment is also provided with a plurality of electronic components 11, and there is a clearance gap between the electronic components 11 and the gold wire bonding area 30.

[0039] During the assembly of the camera module, multiple electronic components 11 need to be accurately soldered or mounted onto the circuit board 1 and arranged reasonably with the gold wires 3. The clearance between the electronic components 11 and the gold wire bonding area 30 provides a clear installation reference for the assemblers, making it easier for them to place the electronic components 11 in the correct position and avoid collisions or interference with the gold wires 3 due to improper installation.

[0040] In this embodiment, multiple electronic components 11 are located between the inner cofferdam 51 and the outer cofferdam, and the filler adhesive 53 covers the electronic components 11. By arranging the key electronic components 11 between the inner cofferdam 51 and the outer cofferdam 52 and completely covering them with the filler adhesive 53, a comprehensive protection system is constructed. This ensures that the electronic components 11 are simultaneously protected by physical structure, chemical sealing, and mechanical stress. This "triple protection" greatly improves the reliability of the entire subsystem.

[0041] It should be noted that in this embodiment, the outer ring of the filling range of the filler adhesive 53 covers the gold wire bonding area 30, the area where the electronic components 11 are located, and the gap between the two layers of dikes. The bottom of the filling layer formed by the filler adhesive 53 is attached to the surface of the circuit board 1, and the top is lower than or flush with the top of the support structure 4, so as not to affect the assembly of the filter 6 and the motor lens assembly.

[0042] Among them, filler adhesive 53 can be selected according to actual performance requirements. For example, epoxy resin adhesive with high strength and high adhesion is suitable for scenarios that require improved structural strength, and has good temperature resistance and insulation. Silicone with good flexibility and vibration resistance is suitable for high vibration environments and can buffer the impact of external forces on gold wire 3 and capacitors. Polyurethane adhesive with strong water resistance and aging resistance is suitable for humid environments and can effectively block moisture intrusion. UV curing adhesive with fast curing speed and high precision is suitable for scenarios that require rapid assembly and can be cured by ultraviolet irradiation. In addition, if auxiliary electrical connection between electronic components 11 and circuit board 1 is required, conductive adhesive (containing metal particles, such as silver paste or copper paste) can be selected. If auxiliary heat dissipation is required, thermally conductive silicone adhesive (containing thermally conductive fillers, such as alumina or boron nitride) can be selected.

[0043] Understandably, different methods can be used to inject and fill the adhesive 53 depending on its properties. For example: Dispensing injection: Injecting point by point through the pre-reserved injection port (diameter set to 0.1-0.5mm) in the double-layered dike using a precision dispensing machine; suitable for high-viscosity adhesives, allowing control over the injection volume. Potting injection: Tilting or inverting the camera module and injecting the entire module through the injection port; suitable for low-viscosity adhesives, ensuring rapid filling of gaps. Vacuum potting: Injecting the adhesive in a vacuum environment to avoid air bubbles; suitable for scenarios requiring high filling density (such as dense areas of gold wire 3). Centrifugal injection: Placing the camera module in a centrifuge, using centrifugal force to evenly fill corner areas; suitable for filling gaps in complex structures. Step-by-step injection: First injecting low-viscosity adhesive to fill the gaps in the gold wire 3, then injecting high-viscosity adhesive to cover the electronic components 11, balancing delicate areas with overall strength.

[0044] In this embodiment, the support structure 4 includes a ring beam 41 and multiple support columns 42. The ring beam 41 is mounted above the gold wire bonding area 30 via the multiple support columns 42. The first end of each support column 42 is fixed to the ring beam 41, and the second end is fixed to the circuit board 1. A hollow area 421 is formed between two adjacent support columns 42. In this embodiment, the inner cofferdam 51 surrounds the outer periphery of the photosensitive chip 2 and together with the ring beam 41 and the support columns 42, forms a four-sided enclosed space, within which the photosensitive chip 2 is installed.

[0045] The ring beam 41 is erected above the gold wire bonding area 30 by multiple support columns 42. This connection and support method abandons the traditional bulky support structure 4, effectively reducing the space occupied by the support structure 4 in the horizontal and vertical directions, thereby significantly reducing the size of the support lens structure and enabling the entire camera module to develop towards miniaturization.

[0046] Specifically, this embodiment takes a rectangular photosensitive chip 2 as an example. The photosensitive chip 2 is installed in the middle of the circuit board 1, and multiple gold wires 3 are arranged on opposite sides of the photosensitive chip 2, forming two gold wire bonding areas 30 on opposite sides of the photosensitive chip 2. The cross-sections of the ring beam 41 and the support column 42 can be circular, square, polygonal, or other irregular shapes, which can be selected according to the internal space and support requirements of the camera module. The support column 42 and the ring beam 41 constitute the support structure 4. The support column 42 provides vertical support, and the ring beam 41 enhances horizontal stability.

[0047] In this embodiment, the inner cofferdam 51 is located at any position on the inner side, outer side, or bottom of the ring beam 41. It can be understood that the inner cofferdam 51 is located on the inner side of all support columns 42, or on the outer side of all support columns 42, or between any two adjacent support columns 42. The camera module includes various optical elements, such as electronic components 11 on the circuit board 1, and the variability in the position of the inner cofferdam 51 can better adapt to the layout of these elements.

[0048] It should be noted that the top of the inner cofferdam 51 is flush with or protrudes from the side of the ring beam 41 away from the support column 42. The inner cofferdam 51 can be a multi-layered structure of semi-solid adhesive. The height of the inner cofferdam 51 can be determined according to the actual height of the hollow area 421, and it is necessary to ensure that the inner cofferdam 51 can completely cover the hollow area 421 after curing.

[0049] The inner cofferdam 51, together with the support column 42 and the ring beam 41, can support the lens assembly. That is, the inner cofferdam 51 has the functions of both light shielding and support, which can effectively distribute the pressure borne by the support column 42 and the ring beam 41. This allows the size of the ring beam 41 to be further simplified, that is, the width or length of the ring beam 41 can be reduced. After the size of the ring beam 41 is simplified, the space occupied by the camera module in the XY plane is further reduced, thereby further compressing the volume of the camera module and better adapting to the needs of miniaturized application scenarios.

[0050] Understandably, in addition to its dustproof and light-shielding functions, the inner cofferdam 51 in this embodiment also provides auxiliary support for the motor lens assembly. Specifically, a material combining light-shielding properties and structural strength is selected, such as a modified epoxy resin-based light-shielding adhesive with added reinforcing components. After curing, it has suitable hardness and rigidity, capable of bearing part of the weight of the motor lens assembly, thereby reducing the stress load on the support column 42. It also possesses a certain degree of elasticity, which can buffer stress under vibration or impact conditions, preventing structural damage caused by hard contact. The top of the inner cofferdam 51 forms a surface contact connection with the bottom of the motor lens assembly. Through surface contact, pressure is dispersed, bearing part of the vertical force of the motor lens assembly. Working in conjunction with the support column 42 and the ring beam 41, it achieves multi-point stress dispersion, thereby improving the overall structural stability.

[0051] In this embodiment, the ring beam 41 includes multiple connecting segments 410, which are connected end to end to form a closed ring structure or are spaced apart to form an open ring structure. When the ring beam 41 is an open ring structure, each connecting segment 410 is provided with one or more support columns 42. The multiple connecting segments 410 together enclose a light-transmitting hole 411.

[0052] The different shapes of the ring beams 41 allow the support and cofferdam structures 5 to be customized according to the overall design and installation space of the camera module. For example, the closed ring beam 41 is suitable for camera modules with high requirements for structural integrity and stability and relatively regular installation space; while the open ring beam 41 can be used when space is limited or when special coordination with other components is required. By reasonably adjusting the position and length of the connecting section 410 and the distribution of the support columns 42, a perfect match between the structure and the space can be achieved, improving space utilization.

[0053] It should be noted that the support column 42 and the ring beam 41 may be made of the same or different materials. The support column 42 and the ring beam 41 are independently installed structures, that is, the support column 42 and the ring beam 41 are separate structures that are independently molded and then assembled.

[0054] Using different materials for the support column 42 and the ring beam 41 makes the design of the support structure 4 more flexible, allowing for flexible combinations to suit different usage scenarios and needs. For example, the support column 42 can be made of high-strength materials such as titanium alloys or ceramics, emphasizing vertical support stability; while the ring beam 41 can be made of lightweight materials such as engineering plastics or carbon fiber composites, emphasizing horizontal structural integrity. In other words, the support column 42 and the ring beam 41 can be matched with appropriate materials according to different stress requirements, significantly reducing the overall weight while ensuring strength.

[0055] Independently designed support columns 42 and ring beams 41 can be made of suitable materials according to different stress requirements. Compared with a single material in a one-piece structure, this significantly reduces the overall weight while ensuring strength. Secondly, the design is more flexible. The support column 42 can be individually adjusted according to the distribution of the gold wires 3 on the circuit board 1. For example, the support column 42 that avoids the gold wire bonding area 30 can have its height or cross-section locally adjusted. The ring beam 41 can have its contour adjusted according to the layout of the motor and lens assembly. This effectively solves the limitations caused by the "integral molding" of a one-piece structure, makes it easier to avoid key internal areas, and can adapt to more different types of camera modules. Thirdly, independent design can simplify unnecessary structures. For example, the ring beam 41 can retain only the key stress-bearing sections, thereby further reducing the space occupied and helping to further miniaturize the camera module.

[0056] In this embodiment, a groove 412 is provided on the support structure 4 inside the light-transmitting hole 411, and the filter 6 is fitted into the groove 412. The groove 412 provides a high-precision mechanical positioning reference for the filter 6. During assembly, the filter 6 can be passively and accurately fitted into the predetermined position, improving assembly efficiency; at the same time, the depth design of the groove 412 allows the upper surface of the filter 6 to be slightly lower than or flush with the top surface of the support structure 4, thus reducing the assembly height of the entire camera module and further reducing the size of the camera module.

[0057] The groove 412 is formed on the upper surface of the support structure and can be continuous or segmented. It can be formed using methods such as vertical slotting (groove wall perpendicular to the beam ring surface), acute-angled beveled slotting (groove wall angled at 30°-60° to the beam ring surface), or obtuse-angled beveled slotting (groove wall angled at 120°-150° to the beam ring surface). The groove depth is 1 / 3 of the filter 6 thickness to the overall filter 6 thickness to ensure stability while avoiding obstruction of the effective photosensitive area. The groove width is slightly larger than the edge thickness of the filter 6, leaving a 0.01-0.05mm assembly gap, which can be filled with light-shielding adhesive to enhance fixation and sealing. Furthermore, protrusions of 0.1-0.3mm high or localized material thickening can be provided along the groove wall of the groove 412 to compensate for the impact of the slotting on the strength of the support structure 4, ensuring that the support structure 4 can stably support the weight of the motor assembly and optical lens assembly.

[0058] In the description of this utility model, it should be understood that terms such as "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", and "outer" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0059] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0060] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A miniaturized camera module based on a double-layer cofferdam, characterized in that, include: A circuit board has a carrier surface on which a photosensitive chip is mounted. The photosensitive chip is electrically connected to the circuit board via multiple gold wires, and several gold wire bonding areas are formed on the outer periphery of the photosensitive chip. A support structure is provided on the bearing surface of the circuit board. The top of the support structure is provided with a light-transmitting hole and the side is provided with several hollow areas. The gold wire bonding area is located in the hollow area and the photosensitive chip is located below the light-transmitting hole. The cofferdam structure includes an inner cofferdam, an outer cofferdam, and filler adhesive between the two. The inner cofferdam is provided at the support structure to close the hollow area, and the outer cofferdam is provided at the edge of the circuit board bearing surface. The filter and motor lens assembly are placed on the support structure from bottom to top.

2. The miniaturized camera module based on a double-layer cofferdam according to claim 1, characterized in that, The outer cofferdam is located between the circuit board bearing surface and the bottom surface of the motor lens assembly, and is used to fill the gap between them.

3. The miniaturized camera module based on a double-layer cofferdam according to claim 1, characterized in that, The circuit board is also provided with multiple electronic components, and there is a clearance gap between the electronic components and the gold wire bonding area.

4. The miniaturized camera module based on a double-layer cofferdam according to claim 3, characterized in that, Multiple electronic components are located between the inner layer and the outer layer, and the filler adhesive covers the electronic components.

5. The miniaturized camera module based on a double-layer cofferdam according to claim 1, characterized in that, The support structure includes a ring beam and multiple support columns. The ring beam is mounted above the gold wire bonding area via the multiple support columns. The first end of each support column is fixed to the ring beam, and the second end is fixed to the circuit board. The hollow area is formed between two adjacent support columns.

6. The miniaturized camera module based on a double-layer cofferdam according to claim 5, characterized in that, The inner cofferdam is located at any position on the inner side, outer side, or bottom of the ring beam.

7. The miniaturized camera module based on a double-layer cofferdam according to claim 5, characterized in that, The top of the inner cofferdam is flush with or protrudes from the side of the ring beam away from the support column.

8. The miniaturized camera module based on a double-layer cofferdam according to claim 5, characterized in that, The ring beam includes multiple connecting segments, which are connected end to end to form a closed ring structure or are spaced apart to form an open ring structure. When the ring beam is an open ring structure, each connecting segment is provided with one or more supporting columns.

9. The miniaturized camera module based on a double-layer cofferdam according to any one of claims 5-8, characterized in that, The support column and the ring beam may be made of the same or different materials.

10. The miniaturized camera module based on a double-layer cofferdam according to claim 1, characterized in that, The support structure has a groove located inside the light-transmitting hole, and the filter is fitted into the groove.

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