High-efficiency heat-dissipation high-density double-sided PCB

Abstract

The utility model discloses a kind of high-density double-sided PCBs of high-efficiency heat dissipation, and it relates to high-density double-sided PCBs field.A kind of high-density double-sided PCBs of high-efficiency heat dissipation, including PCB main body, the top and bottom of PCB main body are provided with base layer board, the side of base layer board away from PCB main body is provided with copper foil layer, the side of copper foil layer away from base layer board is provided with insulating layer, the base layer board includes aluminum substrate, the outer surface of aluminum substrate is provided with polyimide layer, and the copper foil layer includes glass fiber cloth.The utility model provides a kind of high-density double-sided PCBs of high-efficiency heat dissipation, and it is a kind of metal base copper-clad plate with good heat dissipation function by the setting of base layer board, by its high thermal conductivity, can effectively dissipate heat, especially suitable for high power density electronic equipment, further improve the heat dissipation efficiency of PCB main body, increase the use intensity of PCB main body.

Claims

1. A high-efficiency heat dissipation, high-density double-sided PCB circuit board, comprising a PCB circuit board body (1), characterized in that: The PCB circuit board body (1) is provided with a base plate (2) at the top and bottom. A copper foil layer (3) is provided on the side of the base plate (2) away from the PCB circuit board body (1). An insulating layer (4) is provided on the side of the copper foil layer (3) away from the base plate (2). The base plate (2) includes an aluminum substrate (21), and a polyimide layer (22) is disposed on the outer surface of the aluminum substrate (21); The copper foil layer (3) includes a glass fiber cloth (31), and a phenolic acid test paper layer (32) is provided on the outer surface of the glass fiber cloth (31); The insulating layer (4) includes a polytetrafluoroethylene layer (41), the outer surface of which is provided with a mica layer (42), and the outer surface of which is provided with a pad layer (43).

2. The high-efficiency heat dissipation, high-density double-sided PCB circuit board according to claim 1, characterized in that, The outer surface of the aluminum substrate (21) is bonded to the inner surface of the polyimide layer (22).

3. The high-efficiency heat dissipation, high-density double-sided PCB circuit board according to claim 1, characterized in that, The outer surface of the glass fiber cloth (31) is bonded to the inner surface of the phenolic acid test paper layer (32).

4. The high-efficiency heat dissipation high-density double-sided PCB circuit board according to claim 1, characterized in that, The outer surface of the polytetrafluoroethylene layer (41) is bonded to the inner surface of the mica layer (42).

5. The high-efficiency heat dissipation, high-density double-sided PCB circuit board according to claim 1, characterized in that, The outer surface of the mica layer (42) is bonded to the inner surface of the pad layer (43).

6. The high-efficiency heat dissipation high-density double-sided PCB circuit board according to claim 1, characterized in that, The thickness of the copper foil layer (3) is less than the thickness of the base plate (2).

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