PCB structure and electronic device
CN224697970UActive Publication Date: 2026-08-28GUANGDONG DESAI SILICON PRASEODYMIUM TECH CO LTD
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Patent Information
- Application Number
- CN202522289626.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-10-29
- Publication Date
- 2026-08-28
- Estimated Expiration
- 2035-10-29
AI Technical Summary
Technical Problem
这种角部下垂会导致元件本体与焊盘平面之间产生不均匀的楔形间隙，进而严重扰乱熔融焊锡的流动、浸润与最终分布，在细间距焊盘设计中，极易引发局部桥接和虚焊并存的复杂缺陷，这对最终产品的可靠性带来挑战
Benefits of technology
本实用新型的PCB结构，通过在焊接窗口的角部区域形成阻焊凸块，为电子元件提供了有效的局部支撑点。这种支撑机制能够在回流焊过程中对元件的翘曲变形产生约束作用，有助于维持元件与焊接焊盘之间的平行关系，为焊锡的均匀分布创造了有利条件。阻焊凸块的设置改变了对熔融焊锡的约束方式，在焊接焊盘周边形成了更精确的阻隔边界。这种设计有助于引导焊锡流向，减少焊锡在相邻焊接焊盘之间形成桥接的可能性，对于细间距元件的焊接质量提升具有积极意义。得益于阻焊凸块与阻焊层的一体式结构，此方案深度契合PCB制造工艺本质。它无需引入额外材料或复杂工序，仅通过对阻焊设计的优化即可实现，具有实施简便、成本极低、与现有生产线完全兼容且可靠性高的突出优点。这种设计通过优化布局而非增加工艺复杂度来解决问题，为提升焊接良率提供了一种较为经济的实施方案。该支撑结构对多种封装形式的微型元件均能提供支持，特别是对那些在回流焊过程中容易发生变形的薄型元件，此设计通过提供机械支撑的方式，有助于提高焊接过程的稳定性和一致性。
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Abstract
The utility model relates to a kind of PCB structure and electronic device, PCB structure includes dielectric substrate and the solder resist layer being set on it, the solder resist layer is opened with the window of exposure at least one pair of soldering pad, for soldering electronic component, the solder resist layer is integrally formed with solder resist bump in the corner of the window by same material and process, the upper surface of the solder resist bump is configured to be able to provide physical support to its body bottom when reflow soldering is carried out to the electronic component, to inhibit the warping of the electronic component.The utility model provides a kind of PCB structure and electronic device with optimized structure and strong practicability.The structure is supported by bump in the specific position of solder resist layer window, effectively alleviates the thermal deformation of component in reflow soldering process, thereby significantly improves the soldering yield and connection reliability of electronic component.
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