A mixed pressure step high-frequency multilayer circuit board

Abstract

The utility model discloses a mixed pressure step high frequency multilayer circuit board, including frame, at least two PCB board, PCB board can be dismantled and installed in frame, metal sheet, metal sheet at least is provided with two and with PCB board one -to -one corresponding setting, metal sheet is fixed with the one side of PCB board and is pasted, ventilation duct, ventilation duct includes vent, and the vent is set between two adjacent metal sheets, one of two adjacent metal sheets is rotatably connected to one side of the vent, and the other of two adjacent metal sheets is rotatably connected to the other side of the vent. The metal sheet of multilayer circuit board provided in the application can absorb the heat in the pasted PCB board, can be elongated according to the heat generated by the PCB board, and the elongation of the metal sheet pasted with the two PCB boards will also be different, which makes the vent connected between the two metal sheets deflect, and the vent is aligned with the PCB board with higher temperature among the two PCB boards, better increasing the utilization rate of flowing air, and improving the cooling effect on the multilayer circuit board.

Description

Technical Field

[0001] This utility model belongs to the field of circuit board technology, specifically relating to a mixed-voltage stepped high-frequency multilayer circuit board. Background Technology

[0002] With the rapid development of the electronics and information industry, electronic products are being updated and replaced at an accelerated pace. Digital computing speeds are increasing, signal frequencies are rising, and requirements for high current and high temperature resistance are becoming more stringent. Electronic products are increasingly moving towards integration, miniaturization, and multifunctionality, which places greater demands on the circuit board industry in terms of technology, processes, and materials. In existing high-frequency multilayer circuit boards, the heat generated by each layer is not uniform. While airflow cooling methods distribute airflow evenly across each circuit board, this can easily lead to localized areas failing to dissipate heat sufficiently, affecting overall heat dissipation efficiency. Utility Model Content

[0003] In order to solve the above-mentioned problems in the existing technology, the purpose of this utility model is to provide a mixed-voltage stepped high-frequency multilayer circuit board.

[0004] The technical solution adopted in this utility model is as follows:

[0005] A mixed-voltage stepped high-frequency multilayer circuit board includes a frame; at least two PCBs, which are detachably mounted on the frame; metal sheets, at least two of which are provided and correspond one-to-one with the PCBs, and the metal sheets are attached and fixed to one side of the PCBs; and a ventilation duct, which includes a ventilation opening, which is provided between two adjacent metal sheets; wherein one of the two adjacent metal sheets is rotatably connected to one side of the ventilation opening, and the other of the two adjacent metal sheets is rotatably connected to the other side of the ventilation opening.

[0006] For example, the metal sheet includes extensions, which are provided in multiple portions and extend to other parts of the PCB board.

[0007] For example, the ventilation duct also includes an air guide duct, one end of which is connected to the ventilation opening and the other end of which is fixedly connected to the frame.

[0008] For example, the metal sheet includes a bonding portion and a bending portion, the bending portion being located at both ends of the bonding portion and bent toward the side away from the PCB board, and the bonding portion being bonded and fixed to one side of the metal sheet.

[0009] For example, the PCB board includes several fixing holes, each of which is fitted with a fixing ring. The PCB board is fixed to the frame by screws passing through the fixing rings.

[0010] For example, a limit component is provided at the connection between the retaining ring and the retaining hole to restrict the retaining ring from moving upward along the axis of the retaining hole.

[0011] For example, the limiting component includes a boss and a groove, one of which is disposed on a retaining ring, and the other of which is disposed on a retaining hole.

[0012] For example, the boss is provided on the fixing ring, and the groove is provided on the fixing hole.

[0013] For example, the retaining ring has several expansion joints arranged radially from the axis of the retaining ring to form a buffer portion inside the retaining ring.

[0014] The beneficial effects of this utility model are as follows:

[0015] The metal sheets in the multilayer circuit board provided in this application can absorb heat from the bonded PCB board. They can elongate according to the heat generated by the PCB board. Since the heat generated by two adjacent PCB boards is different, the elongation of the metal sheets bonded to the two PCB boards will also be different, causing the ventilation openings connected between the two metal sheets to deflect. This allows the ventilation openings to be aimed at the PCB board with the higher temperature, using the flowing air to remove the heat generated by the PCB board. The concentrated effect of the flowing air can better increase the utilization rate of the flowing air and improve the cooling effect on the multilayer circuit board. Attached Figure Description

[0016] The present invention will now be described in further detail with reference to the accompanying drawings and specific implementation methods.

[0017] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0018] Figure 2 yes Figure 1 A partial cross-sectional structural diagram;

[0019] Figure 3 yes Figure 1 Schematic diagram of the structure at point A;

[0020] Figure 4 yes Figure 3 A schematic diagram of the split cross-sectional structure.

[0021] In the diagram: 100-frame, 200-PCB board, 210-fixing hole, 300-metal sheet, 310-extension, 320-fitting part, 330-bending part, 400-ventilation duct, 410-vent, 420-air guide tube, 500-limiting component, 510-bore, 520-groove, 600-fixing ring, 610-expansion joint, 620-buffer part. Detailed Implementation

[0022] In the following description, numerous details are provided to enable a thorough understanding of this application. However, those skilled in the art will appreciate that the following description merely illustrates preferred embodiments of the application, and that the application can be implemented without one or more of these details. Furthermore, to avoid confusion with this application, some technical features well-known in the art have not been described in detail.

[0023] To fully understand the embodiments of this application, detailed structures will be presented in the following description. Obviously, the implementation of the embodiments of this application is not limited to the specific details familiar to those skilled in the art. The preferred embodiments of this application are described in detail below; however, in addition to these detailed descriptions, this application may have other embodiments.

[0024] See also Figures 1 to 4 This application provides a mixed-voltage stepped high-frequency multilayer circuit board, including a frame 100; at least two PCBs 200, which are detachably mounted on the frame 100; metal sheets 300, at least two of which are provided and correspond one-to-one with the PCBs 200, and the metal sheets 300 are attached and fixed to one side of the PCBs 200; and a ventilation duct 400, which includes a ventilation opening 410, which is disposed between two adjacent metal sheets 300; wherein one of the two adjacent metal sheets 300 is rotatably connected to one side of the ventilation opening 410, and the other of the two adjacent metal sheets 300 is rotatably connected to the other side of the ventilation opening 410.

[0025] The metal sheet 300 can absorb the heat in the bonded PCB board 200 and can elongate according to the heat generated by the PCB board 200. Since the heat generated by the two adjacent PCB boards 200 is different, the elongation of the metal sheet 300 bonded to the two PCB boards 200 will also be different, causing the vent 410 connected between the two metal sheets 300 to deflect, thereby directing the vent 410 towards the PCB board 200 with the higher temperature. The flowing air carries away the heat generated by the PCB board 200. The concentrated effect of the flowing air can better increase the utilization rate of the flowing air and improve the cooling effect on the multilayer circuit board.

[0026] See also Figure 1 In some embodiments, the metal sheet 300 includes an extension 310, which is provided in multiple portions and extends to other parts of the PCB board 200.

[0027] The extension 310 of the metal sheet 300 extends toward other parts of the PCB board 200, which can better absorb the heat generated by the PCB board 200, so that the metal sheet 300 can be extended to different lengths according to the heat generated by the PCB board 200.

[0028] See also Figure 1 In some embodiments, the ventilation duct 400 further includes an air guide duct 420, one end of which is connected to the ventilation opening 410, and the other end of which is fixedly connected to the frame 100.

[0029] The air duct 420 can direct the air outside the frame 100 to the vent 410. The other end of the air duct 420 is fixed to the frame 100 and is used to install ventilation equipment or circulate air.

[0030] See also Figure 1 In some embodiments, the metal sheet 300 includes a bonding portion 320 and a bending portion 330. The bending portion 330 is located at both ends of the bonding portion 320 and is bent toward the side away from the PCB board 200. The bonding portion 320 is bonded and fixed to one side of the metal sheet 300.

[0031] The extension portion 310 of the metal sheet 300 is disposed adjacent to the bonding portion 320 and is bonded to one side of the PCB board 200. It absorbs the heat generated by the PCB board 200 and transfers it to the bending portion 330. The bending portion 330 extends its length according to the heat transferred to it.

[0032] See also Figure 4 In some embodiments, the PCB board 200 includes a plurality of fixing holes 210, and a fixing ring 600 is embedded in each fixing hole 210. The PCB board 200 is fixed to the frame 100 by screws passing through the fixing rings 600.

[0033] When fixing the PCB board 200 with screws, the screws first pass through the fixing ring 600 and are connected to the frame 100 by threads. The screws and the frame 100 are clamped on both sides of the PCB board 200 to fix the PCB board 200 to the frame 100.

[0034] See also Figures 2 to 3 In some embodiments, a limit component 500 is provided at the connection between the retaining ring 600 and the retaining hole 210 to limit the upward movement of the retaining ring 600 along the axis of the retaining hole 210.

[0035] By setting a constraint between the fixing ring 600 and the fixing hole 210, the relative movement between the fixing hole 210 and the fixing ring 600 can be restricted in the axial direction of the fixing hole 210, thereby preventing the fixing ring 600 from falling out of the fixing hole 210, so as to ensure that the PCB board 200 can be fixed to the frame 100 with screws.

[0036] In this embodiment, there are no specific restrictions on the structure of the limiting component 500. It is only necessary to restrict the movement of the fixing hole 210 and the fixing ring 600 in the axial direction of the fixing hole 210. The specific structure of the limiting component 500 can be set according to the actual situation on site.

[0037] See also Figure 4 In some embodiments, the limiting component 500 includes a boss 510 and a groove 520, one of which is disposed on the fixing ring 600, and the other of which is disposed on the fixing hole 210.

[0038] Based on one embodiment, this embodiment provides a limiting component 500, wherein the boss 510 and the groove 520 are configured to match, and when the fixing ring 600 is embedded in the fixing hole 210, the boss 510 can be locked in the groove 520 so that the fixing ring 600 can be fixed in the fixing hole 210.

[0039] In this embodiment, there is no restriction on whether the boss 510 and the groove 520 are specifically installed in the fixing ring 600 or the fixing hole 210. As long as the boss 510 can be locked in the groove 520 to restrict the movement of the fixing hole 210 and the fixing ring 600 in the axial direction of the fixing hole 210, the specific installation method can be adjusted according to the actual situation on site.

[0040] See also Figure 4 In some embodiments, the boss 510 is disposed on the fixing ring 600, and the groove 520 is disposed on the fixing hole 210.

[0041] This embodiment provides a method for installing the boss 510 and the groove 520 in the previous embodiment. The boss 510 is set on the fixing ring 600, and the groove 520 is set on the fixing hole 210.

[0042] See also Figures 2 to 4 In some embodiments, the retaining ring 600 has several expansion slots 610, which are radially arranged from the axis of the retaining ring 600 to form a buffer portion 620 inside the retaining ring 600.

[0043] The radially arranged expansion joints 610 divide the inner side of the fixing ring 600 into several buffer parts 620. During the process of fixing the PCB board 200, the screws screwed on the frame 100 act on the buffer parts 620, thereby using the clamping force between the screws and the frame 100 to fix the PCB board 200 to the frame 100.

[0044] Since the force applied to the screws on the frame 100 is different each time, the force applied to the buffer part 620 will also be different. Even if the screws are over-tightened and the buffer part 620 is deformed, the expansion joint 610 can provide space for the deformed buffer part 620, thus preventing the fixing hole 210 from being squeezed and protecting the PCB board 200 from damage.

[0045] This utility model is not limited to the above-mentioned optional embodiments. Anyone can derive other forms of products under the guidance of this utility model. However, regardless of any changes made in its shape or structure, any technical solution that falls within the scope of the claims of this utility model shall be protected by this utility model.

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