A suction and pressure integrated tool for processing a circuit board

Abstract

The utility model relates to a kind of suction and pressure integrated tool for circuit board processing, the utility model effectively solves the problem that traditional circuit board fixing tool is easy to cause indentation or damage to board surface, and the fixing effect is not good.The suction and pressure integrated tool for circuit board processing is through the synergistic effect of mesh suction and pressure mechanism and auxiliary pressing mechanism, both utilize negative pressure adsorption to evenly disperse fixing force, avoid local stress damage workpiece, and further strengthen the fixing effect of edge and four corners by mechanical pressing, especially suitable for high vibration or high-precision processing scene, greatly improve the stability and reliability of workpiece fixation;By pipeline plugging mechanism, the opening and closing control of specific suction mesh is realized, so as to adapt to different shapes, sizes or workpieces with openings, improve energy utilization and process adaptability, better fixing effect can be achieved on circuit board workpiece, effectively reduce the vibration or deviation of workpiece in the processing process, thereby reducing the scrap rate and improving overall production efficiency.

Description

Technical Field

[0001] This utility model belongs to the field of circuit board processing tooling technology, specifically relating to a suction and pressure integrated tooling for circuit board processing. Background Technology

[0002] With the rapid development of the electronics industry, circuit board processing, as a key link in electronic product manufacturing, has placed higher demands on processing precision and efficiency. During circuit board processing, it is often necessary to fix the circuit board in place to prevent displacement during drilling, milling, or soldering processes, which could affect processing quality.

[0003] Traditional fixing methods mostly employ mechanical clamping or vacuum adsorption, but these have certain limitations: mechanical clamping can easily cause indentations or damage to the board surface, especially unsuitable for thin or flexible circuit boards; while ordinary vacuum adsorption fixtures often have uneven adsorption force distribution, resulting in poor adsorption performance on irregularly shaped or unevenly structured circuit boards, easily leading to processing deviations; furthermore, existing suction and pressing fixtures are usually structurally fixed, unable to flexibly adjust the adsorption area according to different workpiece shapes, thus having poor applicability. Therefore, there is an urgent need for a circuit board fixing fixture that can integrate adsorption and clamping functions, with uniform adsorption force distribution and local adjustment capabilities, to meet the requirements of high-precision and high-efficiency processing. Utility Model Content

[0004] In view of the above situation and to overcome the defects of the prior art, this utility model provides a suction and pressure integrated tooling for circuit board processing. This suction and pressure integrated tooling for circuit board processing not only uses negative pressure to evenly disperse the fixing force and avoid excessive local stress from damaging the workpiece, but also further strengthens the fixing effect of the edges and four corners through mechanical clamping. It is especially suitable for high vibration or high precision processing scenarios, and greatly improves the stability and reliability of workpiece fixing.

[0005] A pressure-absorbing integrated tooling for circuit board processing includes a base. The upper surface of the base has a placement groove for placing the workpiece, and the inner bottom wall of the placement groove has a mesh suction mechanism for clamping the workpiece. The inner bottom wall of the placement groove also has an adsorption mesh for assisting in clamping the workpiece. The interior of the base has a suction pipe mechanism that can communicate with the mesh suction mechanism and the adsorption mesh. The side of the base is provided with a pipe sealing mechanism that can control the opening and closing of the suction pipe mechanism. The four corners of the base are provided with auxiliary clamping mechanisms for clamping the workpiece.

[0006] Preferably, the mesh suction mechanism includes a suction hole and a mesh negative pressure groove. The mesh negative pressure groove is formed on the inner bottom wall of the placement groove, and the suction hole is formed in the middle of the mesh negative pressure groove and communicates with the suction pipe mechanism.

[0007] Preferably, the number of adsorption mesh holes is several sets, and all sets of adsorption mesh holes are opened on the inner bottom wall of the placement groove and are all connected to the suction pipe mechanism.

[0008] Preferably, the suction pipe mechanism includes a main suction duct, branch suction ducts, and suction grooves. The main suction duct is horizontally opened inside the base, and the suction holes are vertically corresponding to and connected to the main suction duct. Branch suction ducts are opened inside the base at the locations corresponding to each adsorption mesh hole, and each branch suction duct is connected to the main suction duct. Suction grooves are opened at the ends of each branch suction duct at the locations vertically corresponding to each adsorption mesh hole. The suction grooves are connected to the adsorption mesh holes above them and are all connected to the main suction duct through the branch suction ducts.

[0009] Preferably, the pipe sealing mechanism includes a sealing plate and a tie rod. The tie rod is laterally fixed to the side of the sealing plate and passes through the side of the base. The sealing plate passes through the interior of the branch suction and pressure duct.

[0010] Preferably, the number of pipe sealing mechanisms is the same as the number of adsorption mesh holes, and several pipe sealing mechanisms are respectively installed inside the branch suction and pressure air ducts that are connected to the three sets of adsorption mesh holes.

[0011] Preferably, the auxiliary clamping mechanism includes a sleeve, a spring, a connecting rod, and a clamping plate. The sleeve is fixedly connected to the side of the base, and the connecting rod is vertically inserted inside the sleeve. The spring is fixedly connected to the bottom end of the connecting rod, and its bottom end is fixedly connected to the inner bottom wall of the sleeve. The clamping plate is rotatably connected to the top of the connecting rod and can be clamped onto the upper surface of the base.

[0012] Preferably, the number of auxiliary pressing mechanisms is four, and the four auxiliary pressing mechanisms are respectively arranged at the four corners of the base.

[0013] The beneficial effects of the above technical solution are as follows: This integrated suction and clamping fixture for circuit board processing utilizes the synergistic effect of a mesh suction and clamping mechanism. It employs negative pressure adsorption to evenly distribute the fixing force, preventing excessive local stress from damaging the workpiece. Mechanical clamping further strengthens the fixing effect at the edges and corners, making it particularly suitable for high-vibration or high-precision processing scenarios, significantly improving the stability and reliability of workpiece fixation. A pipe sealing mechanism allows for selective closure of some branch suction ducts, enabling control over the opening and closing of specific adsorption mesh openings. This adapts to workpieces of different shapes, sizes, or with openings, preventing negative pressure leakage and improving energy efficiency and process adaptability. The externally adjustable four-corner auxiliary clamping mechanism accommodates workpieces of varying thicknesses, enhancing the fixture's versatility and ease of operation. It provides better fixation for circuit board workpieces, effectively reducing vibration or displacement during processing, thus lowering the scrap rate and reducing manual adjustment time, thereby improving overall production efficiency. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the overall structure of this utility model; Figure 2 This is a schematic diagram of the disassembled state of the auxiliary pressing mechanism of this utility model; Figure 3 This is a schematic diagram of the cross-sectional state of the base of this utility model.

[0015] In the diagram: 1. Base; 2. Placement slot; 3. Mesh suction mechanism; 301. Suction hole; 302. Mesh negative pressure groove; 4. Adsorption mesh; 5. Suction pipe mechanism; 501. Main suction duct; 502. Branch suction duct; 503. Suction groove; 6. Pipe sealing mechanism; 601. Sealing plate; 602. Tie rod; 7. Auxiliary pressing mechanism; 701. Sleeve; 702. Spring; 703. Connecting rod; 704. Pressing plate. Detailed Implementation

[0016] The foregoing and other technical contents, features and effects of this utility model are described in conjunction with the appendix below. Figures 1 to 3 The embodiments are described in detail below.

[0017] This embodiment provides a suction-and-press integrated tooling for circuit board processing, as shown in the attached figure. Figure 1-3As shown, the device includes a base 1. The upper surface of the base 1 has a placement groove 2 for placing workpieces, and the inner bottom wall of the placement groove 2 has a mesh suction mechanism 3 for clamping the workpieces. The circuit board workpieces to be processed can be placed in the placement groove 2. The placement groove 2 can be designed according to the shape and structure of the circuit board to be processed, so that the placement groove 2 is compatible with the structure of the circuit board. The mesh suction mechanism 3 is the main structure for clamping the circuit board. The inner bottom wall of the placement groove 2 also has adsorption mesh holes 4 for auxiliary clamping of the workpieces. The base 1 has a suction pipe mechanism 5 that can communicate with the mesh suction mechanism 3 and the adsorption mesh holes 4. The air outlet of the suction pipe mechanism 5 can be connected to an external negative pressure pipe. A negative pressure is generated inside the suction pipe mechanism 5 through the external negative pressure pipe, thereby generating negative pressure in both the mesh suction mechanism 3 and the adsorption mesh holes 4, thus clamping the workpieces placed in the placement groove 2. The circuit board workpiece in the groove 2 is firmly suctioned to prevent the circuit board from moving during processing and affecting the processing quality. The mesh suction mechanism 3 and the adsorption mesh 4 can evenly disperse the adsorption force, avoiding excessive local stress that could damage the workpiece. The side of the base 1 is provided with a pipe sealing mechanism 6 that can control the opening and closing of the suction pipe mechanism 5. The pipe sealing mechanism 6 can selectively close some branch suction air ducts 502, realizing the opening and closing control of specific adsorption mesh 4, thereby adapting to workpieces of different shapes, sizes or with openings, avoiding negative pressure leakage, and improving energy consumption efficiency and process adaptability. The four corners of the base 1 are provided with auxiliary clamping mechanisms 7 that can clamp the workpiece. The auxiliary clamping mechanisms 7 can adapt to the clamping requirements of workpieces of different thicknesses, improve the versatility and ease of operation of the tooling, and can better fix the circuit board workpiece, effectively reducing the vibration or displacement of the workpiece during processing.

[0018] In one optional embodiment, the mesh suction mechanism 3 includes a suction hole 301 and a mesh negative pressure groove 302. The mesh negative pressure groove 302 is formed on the inner bottom wall of the placement groove 2, and the suction hole 301 is formed in the middle of the mesh negative pressure groove 302 and communicates with the suction pipe mechanism 5. The mesh negative pressure groove 302 is a mesh-like communicating groove. When a circuit board is placed on top, the circuit board blocks the mesh negative pressure groove 302. When air is sucked in through the suction hole 301, a negative pressure is generated inside the mesh negative pressure groove 302, thereby sucking the circuit board tightly. The mesh design can increase the contact area with the circuit board, so that the stress on the part of the circuit board in contact with the negative pressure area is relatively even, avoiding damage to the circuit board.

[0019] In one optional embodiment, the number of adsorption meshes 4 is several sets, and all sets of adsorption meshes 4 are opened on the inner bottom wall of the placement groove 2 and are all connected to the suction pipe mechanism 5. By setting multiple sets of adsorption meshes 4, the adsorption range of the circuit board can be increased, which makes it easier to apply negative pressure to multiple parts of the circuit board, thereby making the circuit board more firmly fixed. It is especially suitable for high vibration or high precision processing scenarios, and greatly improves the stability and reliability of workpiece fixing.

[0020] In one optional embodiment, the suction pipe mechanism 5 includes a main suction duct 501, branch suction ducts 502, and suction grooves 503. The main suction duct 501 is horizontally opened inside the base 1, and the suction holes 301 are vertically corresponding to and connected to the main suction duct 501. The air outlet of the main suction duct 501 can be connected to an external negative pressure pipe or negative pressure device. Branch suction ducts 502 are opened inside the base 1 at the locations corresponding to each adsorption mesh 4, and each branch suction duct 502 is connected to the main suction duct 501. The ends of each branch suction duct 502 are vertically corresponding to each adsorption mesh 4. All parts are provided with suction grooves 503, which are connected to the adsorption mesh 4 above them and are connected to the main suction duct 501 through branch suction air ducts 502. By continuously generating negative pressure in the main suction air duct 501 through external equipment, negative pressure can be generated in each branch suction air duct 502 and suction groove 503, so that the suction holes 301 and each adsorption mesh 4 can firmly hold the circuit board placed above. Through the synergistic effect of the mesh negative pressure grooves 302 and adsorption mesh 4, the fixing force can be evenly dispersed by negative pressure adsorption, avoiding excessive local stress that could damage the workpiece, and improving the fixing effect of the circuit board.

[0021] In one optional embodiment, the pipe sealing mechanism 6 includes a sealing plate 601 and a pull rod 602. The pull rod 602 is laterally fixed to the side of the sealing plate 601 and passes through the side of the base 1. The sealing plate 601 passes through the interior of the branch suction duct 502. The pull rod 602 can control whether the sealing plate 601 seals its corresponding branch suction duct 502, thereby realizing the opening and closing control of specific adsorption mesh 4, adapting to workpieces of different shapes, sizes or with openings, avoiding negative pressure leakage, and improving energy consumption utilization and process adaptability.

[0022] In one optional embodiment, the number of pipe sealing mechanisms 6 is the same as the number of adsorption mesh 4, and several pipe sealing mechanisms 6 are respectively installed inside the branch suction and pressure air duct 502 that communicates with the three sets of adsorption mesh 4. The three sets of pipe sealing mechanisms 6 can be controlled independently, so that the adsorption effect of the corresponding adsorption mesh 4 can be selectively controlled according to the state of the workpiece, which is convenient for fixing different parts of the circuit board or fixing circuit boards of different shapes.

[0023] In one optional embodiment, the auxiliary clamping mechanism 7 includes a sleeve 701, a spring 702, a connecting rod 703, and a clamping plate 704. The sleeve 701 is fixedly connected to the side of the base 1, and the connecting rod 703 is vertically inserted inside the sleeve 701. The spring 702 is fixedly connected to the bottom end of the connecting rod 703, and its bottom end is fixedly connected to the inner bottom wall of the sleeve 701. The clamping plate 704 is rotatably connected to the top of the connecting rod 703 and can be clamped onto the upper surface of the base 1. There are four auxiliary clamping mechanisms 7, and the four auxiliary clamping mechanisms 7 are respectively arranged at the four corners of the base 1. The clamping plate 704 can rotate at the top of the connecting rod 703, which can adapt to the clamping requirements of workpieces of different thicknesses. After the circuit board is placed in the placement slot 2, the clamping plates 704 at the four corners can be pulled upwards, and the clamping plates 704 can be rotated to a position that can press the circuit board. Under the action of the spring 702, the clamping plates 704 are pressed onto the top of the circuit board, thereby further improving the fixing effect of the circuit board.

[0024] In summary, the steps for using this tumbler integrated tooling for circuit board processing are as follows: 1. Place the circuit board workpiece to be processed into the placement groove 2 on the upper surface of the base 1, ensuring that its position is accurate and compatible with the groove structure; if certain areas of the workpiece do not need to be adsorbed or need to avoid the openings on its back, push the corresponding pull rod 602 inward to drive the sealing plate 601 to block the branch suction and pressure air duct 502 connected to the adsorption mesh 4 of that area; if it is necessary to activate the adsorption function of a certain area, pull the pull rod 602 outward to make the sealing plate 601 leave the blocked position and open the corresponding branch suction and pressure air duct 502. 2. Start the external negative pressure equipment. The negative pressure is transmitted through the main suction air duct 501 to the negative pressure through the suction holes 301 and form a uniform negative pressure field in the mesh negative pressure groove 302, which sucks up a large area in the middle of the workpiece; and the negative pressure passes through the main suction air duct 501, the corresponding branch suction air duct 502 and the suction groove 503 in sequence, so that the adsorption mesh 4 sucks up specific points of the workpiece. 3. Pull up the connecting rod 703 and rotate the clamping plate 704 to above the edge or corner of the workpiece. Then release the connecting rod 703. Under the rebound force of the spring 702, the clamping plate 704 will press smoothly and forcefully against the surface of the workpiece. Repeat this operation to ensure that all four corners are reliably clamped. Then start processing the circuit board. 4. After processing, first pull up each clamping plate 704 and rotate it away from the workpiece to release the mechanical clamping; turn off the external negative pressure equipment, release the negative pressure adsorption, and take the processed circuit board workpiece out of the placement slot 2.

[0025] The above description is only for illustrating the present utility model. It should be understood that the present utility model is not limited to the above embodiments, and various modifications that conform to the concept of the present utility model are within the protection scope of the present utility model.

Claims

1. A pressure-feed integrated tooling for circuit board processing, comprising a base (1), characterized in that: The upper surface of the base (1) is provided with a placement groove (2) for placing the workpiece, and the inner bottom wall of the placement groove (2) is provided with a mesh suction mechanism (3) for clamping the workpiece. The inner bottom wall of the placement groove (2) is also provided with an adsorption mesh (4) for assisting in clamping the workpiece. The interior of the base (1) is provided with a suction pipe mechanism (5) that can communicate with the mesh suction mechanism (3) and the adsorption mesh (4). The side of the base (1) is provided with a pipe sealing mechanism (6) that can control the opening and closing of the suction pipe mechanism (5). The four corners of the base (1) are provided with auxiliary clamping mechanisms (7) for clamping the workpiece.

2. The pressure-sensing integrated tooling for circuit board processing according to claim 1, characterized in that: The mesh suction mechanism (3) includes a suction hole (301) and a mesh negative pressure groove (302). The mesh negative pressure groove (302) is opened on the inner bottom wall of the placement groove (2), and the suction hole (301) is opened in the middle of the mesh negative pressure groove (302) and communicates with the suction pipe mechanism (5).

3. The pressure-sensing integrated tooling for circuit board processing according to claim 1, characterized in that: The number of adsorption meshes (4) is several sets, and several sets of adsorption meshes (4) are all opened on the inner bottom wall of the placement groove (2) and are all connected to the suction pipe mechanism (5).

4. The pressure-sensing integrated tooling for circuit board processing according to claim 2, characterized in that: The suction pipe mechanism (5) includes a main suction duct (501), a branch suction duct (502), and a suction groove (503). The main suction duct (501) is opened horizontally inside the base (1), and the suction holes (301) are vertically corresponding to and connected to the main suction duct (501). The base (1) is provided with branch suction ducts (502) at the corresponding parts of each adsorption mesh (4), and each branch suction duct (502) is connected to the main suction duct (501). Each branch suction duct (502) is provided with a suction groove (503) at the end of each branch suction duct (502) at the vertically corresponding part of each adsorption mesh (4). The suction groove (503) is connected to the adsorption mesh (4) above it and is connected to the main suction duct (501) through the branch suction duct (502).

5. The pressure-sensing integrated tooling for circuit board processing according to claim 4, characterized in that: The pipe sealing mechanism (6) includes a sealing plate (601) and a pull rod (602). The pull rod (602) is horizontally fixedly connected to the side of the sealing plate (601) and passes through the side of the base (1). The sealing plate (601) passes through the inside of the branch suction duct (502).

6. The pressure-sensing integrated tooling for circuit board processing according to claim 4, characterized in that: The number of pipe sealing mechanisms (6) is the same as the number of adsorption mesh (4), and several pipe sealing mechanisms (6) are respectively installed inside the branch suction and pressure air duct (502) connected to the three sets of adsorption mesh (4).

7. The pressure-sensing integrated tooling for circuit board processing according to claim 1, characterized in that: The auxiliary pressing mechanism (7) includes a sleeve (701), a spring (702), a connecting rod (703), and a pressing plate (704). The sleeve (701) is fixedly connected to the side of the base (1), and the connecting rod (703) is vertically inserted inside the sleeve (701). The spring (702) is fixedly connected to the bottom end of the connecting rod (703), and its bottom end is fixedly connected to the inner bottom wall of the sleeve (701). The pressing plate (704) is rotatably connected to the top of the connecting rod (703) and can be pressed against the upper surface of the base (1).

8. The pressure-sensing integrated tooling for circuit board processing according to claim 1, characterized in that: The number of auxiliary pressing mechanisms (7) is four, and the four auxiliary pressing mechanisms (7) are respectively located at the four corners of the base (1).

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