A circuit board etching spraying device
Patent Information
- Application Number
- CN202521787148.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-08-21
- Publication Date
- 2026-08-28
- Estimated Expiration
- 2035-08-21
AI Technical Summary
[0003]蚀刻均匀性不足:现有喷淋装置多采用单方向固定喷头设计,蚀刻液仅能从线路板单侧或单一角度喷射,导致基板表面蚀刻液覆盖不均——边缘区域蚀刻液流速快、反应充分,中心区域易形成“积液死角”,最终造成线路边缘毛糙、线宽偏差超差(通常±0.05mm以上),尤其对高密度互联(HDI)线路板的精细线路(线宽<0.1mm)适配性差
[0012]与现有技术相比,本实用新型的有益效果是:该一种线路板蚀刻喷淋装置的设置,结构设计合理;
Smart Images

Figure CN224697995U_ABST
Abstract
Claims
1. A circuit board etching spraying device, comprising an etching machine body (1), characterized in that, The etching machine body (1) is equipped with an etching bucket (2) at the bottom of its interior, and a spraying mechanism (6) is equipped at the top of the etching bucket (2) inside the etching machine body (1). The spraying mechanism (6) includes a fixing frame (7) installed on the inner walls of both sides of the etching machine body (1). The inner walls of the two fixing frames (7) are equipped with spray pipes (8). The top and side walls of the spray pipes (8) are vertically installed with adapter pipes (9). The ends of the adapter pipes (9) at the top and the ends of the adapter pipes (9) on the side walls are vertically installed with spray etching pipes (10). The sidewall of the spray etching pipe (10) is uniformly and equidistantly equipped with connecting pipes (12). The top end of the connecting pipe (12) is equipped with a high-pressure pipe (14). The end of the high-pressure pipe (14) is equipped with an etching nozzle (15). A sealing cap (13) is installed between the high-pressure pipe (14) and the connecting pipe (12).
2. The circuit board etching spraying device according to claim 1, characterized in that, The connecting pipe (12) is inserted into the lower end of the sealing cap (13), and the high-pressure pipe (14) is inserted into the top end of the sealing cap (13). The sealing cap (13) has an internal thread (19) inside, and the connecting pipe (21) has an external thread (20) on its outer wall. The internal thread (19) and the external thread (20) are matched. The end of the high-pressure pipe (14) is provided with a filter ring (15), and a filter screen (16) is embedded inside the filter ring (15).
3. The circuit board etching spraying device according to claim 2, characterized in that, The end of the high-pressure pipe (14) is provided with a limiting ring plate (18) inside the sealing cover (13). The outer diameter of the limiting ring plate (18) is larger than the inner diameter of the opening of the sealing cover (13). A bearing ring (17) is installed on the outside of the high-pressure pipe (14) behind the filter ring (15). The bearing ring (17) is connected to the filter ring (15).
4. The circuit board etching spraying device according to claim 1, characterized in that, Circuit board clamps (11) are installed on the inner walls of the top two end connectors (9).
5. The circuit board etching spraying device according to claim 1, characterized in that, The bottom of the etching machine body (1) is equipped with a high-pressure pump (3), the output end of the high-pressure pump (3) is equipped with a liquid delivery pipe (4), and the end of the liquid delivery pipe (4) is connected to a spray pipe (8).
6. The circuit board etching spraying device according to claim 1, characterized in that, The bottom end of the etching bucket (2) is equipped with a drain pipe (5), and the end of the drain pipe (5) is provided with a valve.