Multi-functional water jet for PCB thick plate

Abstract

The utility model discloses a kind of multifunctional water knives for PCB thick plate, comprising: U-shaped support, cover plate, baffle and spray plate, U-shaped support is provided with first panel, second panel and three panel of spray panel, first panel and second panel are perpendicular to spray panel, spray panel is provided with spray hole;Cover plate is set to the port of U-shaped support, and is connected with first panel and second panel, and water inlet is provided on cover plate;Baffle is set to the both sides of U-shaped support;Spray plate includes connecting plate and water guide component, water guide component is perpendicular to connecting plate, and connecting plate and first panel or second panel are connected, the device is set by different water guide component, water guide component sets at least two two different forms of water head, vortex is generated in soaking sink using the eddy current principle of water, and hole filling capacity is better, so that water or other cleaning liquid is more easily into the small hole of PCB board, blind hole, it is favorable to remove glue residue, copper wire residue, improve the performance and reliability of circuit board.

Description

Technical Field

[0001] This utility model relates to the field of PCB board cleaning technology, specifically to a multi-functional water jet for thick PCB boards. Background Technology

[0002] PCB board cleaning is a crucial process in electronics manufacturing, removing soldering residues and contaminants to ensure circuit board performance and reliability. Cleaning methods can be categorized into manual and automatic based on equipment type: Manual cleaning uses high-pressure air guns and soft brushes to remove large particles of contaminants, followed by wiping with organic solvents such as alcohol and acetone to remove flux residues. Finally, it is rinsed with deionized water and dried. Automatic cleaning utilizes ultrasonic cleaners, dry ice cleaners, and other equipment, supporting fully automatic / semi-automatic modes. It efficiently removes flux, solder dross, and other contaminants, suitable for industrial production environments.

[0003] However, PCBs contain blind vias and pinholes, especially thicker PCBs of 2.00mm and above. These blind vias are deeper, and traditional manual or automatic cleaning methods cannot remove the adhesive residue inside them. This results in thicker PCBs not being thoroughly cleaned, affecting circuit performance and reliability. Utility Model Content

[0004] Therefore, it is necessary to address the problem that residues in small holes and blind holes of PCBs, especially those thicker than 2.00mm, cannot be cleaned properly. A multi-functional water jet for thick PCBs should be proposed. By setting different shapes for the water outlet, various water flow patterns can be generated to clean various residues in blind holes and small holes, thereby improving the reliability of the circuit.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: A multi-functional waterjet cutter for thick PCB boards includes: The U-shaped bracket has three panels: a first panel, a second panel, and a spray panel. The first panel and the second panel are perpendicular to the spray panel, and the spray panel is provided with spray holes. A cover plate is disposed at the port of the U-shaped bracket and connected to the first panel and the second panel. A water inlet is provided on the cover plate. A baffle is provided on both sides of the U-shaped bracket, and is connected with the U-shaped bracket and the cover plate to form a storage space for water. A spray plate includes a connecting plate and a water guiding component. The water guiding component is perpendicular to the connecting plate. The connecting plate is attached to a first panel or a second panel. The water guiding component is provided with at least two water guiding heads of different shapes: a first water guiding head and a second water guiding head. The first water guiding head is a planar water guiding head, and the second water guiding head is a curved water guiding head. The first water guiding head and the second water guiding head are arranged alternately and spaced apart.

[0006] In some embodiments, the first water inlet head is parallel to the spray plate, and the second water inlet head is at an angle to the spray plate.

[0007] In some embodiments, the length of the first water inlet head is greater than the length of the second water inlet head.

[0008] In some embodiments, the spray plate includes: The first spray plate includes a first connecting surface and a first water guiding component, wherein the first connecting surface and the first water guiding component are perpendicular, and the first connecting surface is attached to the first panel. The second spray plate includes a second connecting surface and a second water guiding component. The second connecting surface and the second water guiding component are perpendicular to each other, and the second connecting surface is attached to the second panel.

[0009] In some embodiments, the spray panel is provided with at least two types of spray holes.

[0010] In some embodiments, the spray panel is provided with a first spray hole and a second spray hole, wherein the first spray hole is linear and the second spray hole is V-shaped.

[0011] In some embodiments, the first spray hole and the second spray hole are arranged alternately.

[0012] In some embodiments, the water inlet is circular.

[0013] In some embodiments, a connecting plate is provided within the accommodating space, and the connecting plate is connected to the inner walls of the first panel and the second panel.

[0014] In some embodiments, the connecting plate is located above the water inlet and is spaced apart from the cover plate.

[0015] This device uses different water-guiding components, with at least two different types of water-guiding heads arranged alternately. Utilizing the principle of water eddies, it generates vortices in the immersion tank, resulting in better hole-filling capability. This allows water or other cleaning solutions to more easily enter the small holes and blind holes of thick PCB boards, which is beneficial for removing glue residue and copper wire residue, cleaning the PCB board thoroughly, and improving the performance and reliability of the circuit. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] in: Figure 1 This is a partial exploded view of a multi-functional water jet for thick PCB boards according to an embodiment of this utility model; Figure 2 This is a first-view three-dimensional structural diagram of a multi-functional water jet for thick PCB boards according to an embodiment of the present invention; Figure 3 This is a second-view three-dimensional structural diagram of a multi-functional water jet for thick PCB boards according to an embodiment of this utility model; Figure 4 This is a schematic diagram of the internal three-dimensional structure of a multi-functional water jet for thick PCB boards, as described in an embodiment of this utility model.

[0018] Figure Identification 1. U-shaped bracket; 11. First panel; 12. Second panel; 13. Spray panel; 131. Spray hole; 1311. First spray hole; 1312. Second spray hole; 2. Cover plate; 21. Water inlet; 3. Baffle; 4. Spray plate; 41. Connecting plate; 42. Water intake assembly; 421. First water intake head; 422. Second water intake head; 43. First spray plate; 431. First connecting surface; 432. First water intake assembly; 44. Second spray plate; 441. Second connecting surface; 442. Second water intake assembly; 5. Support plate. Detailed Implementation

[0019] To facilitate understanding of this utility model, a more detailed description is provided below with reference to the accompanying drawings and specific embodiments. Unless otherwise defined, all technical and scientific terms used in this specification have the same meaning as commonly understood by one of ordinary skill in the art to which this utility model pertains. The terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to limit the scope of this utility model.

[0020] To address the problem of incomplete cleaning of residues in small holes and blind holes of PCBs, especially thicker PCBs, in existing technologies, the following will combine [the following text is incomplete and likely refers to a separate section]... Figures 1 to 4 This invention provides a detailed description of a multi-functional water jet cutter for thick PCB boards, as provided in the embodiments of this utility model.

[0021] Please see Figure 1 , Figure 2 and Figure 3 , Figure 1 This is a partial exploded view of a multi-functional water jet for thick PCB boards according to an embodiment of this utility model; Figure 2 This is a first-view three-dimensional structural diagram of a multi-functional water jet for thick PCB boards according to an embodiment of the present invention; Figure 3 This is a second-view three-dimensional structural diagram of a multi-functional water jet for thick PCB boards, as described in an embodiment of this utility model.

[0022] A multi-functional waterjet cutter for thick PCB boards includes: The U-shaped bracket 1 is provided with three panels: a first panel 11, a second panel 12, and a spray panel 13. The first panel 11 and the second panel 12 are perpendicular to the spray panel 13, and the spray panel is provided with spray holes 131. Cover plate 2, the cover plate 2 is disposed at the port of the U-shaped bracket 1 and connected to the first panel 11 and the second panel 12, and the cover plate 2 is provided with a water inlet 21; Baffles 3 are disposed on both sides of the U-shaped bracket 1 and are connected with the U-shaped bracket 1 and the cover plate 2 to form a water storage space; The spray plate 4 includes a connecting plate 41 and a water guiding component 42. The water guiding component 42 is perpendicular to the connecting plate 41. The connecting plate 41 is attached to the first panel 11 or the second panel 12. The water guiding component 42 is provided with at least two water guiding heads of different shapes, namely a first water guiding head 421 and a second water guiding head 422. The first water guiding head 421 is a planar water guiding head, and the second water guiding head 422 is a curved water guiding head. The first water guiding head 421 and the second water guiding head 422 are arranged alternately and are spaced apart.

[0023] Specifically, standard PCB thicknesses include 0.70mm, 0.80mm, 0.95mm, 1.00mm, 1.27mm, 1.5mm, 1.60mm, 2.00mm, 2.40mm, 3.00mm, 3.20mm, 3.50mm, 4.00mm, and 6.40mm. PCBs thicker than 2.00mm are generally considered thick boards. Thick PCBs are mainly used for equipment that carries high current or high power. For thick PCBs, which have blind holes and small holes, traditional manual brushing or automatic cleaning methods have limited effectiveness and cannot remove internal residues.

[0024] Water eddies are a natural phenomenon. The principle is that when water flow is obstructed by an obstacle, the water speed slows down and the direction of flow changes, forming a vortex. The shape and size of the obstacle, as well as the speed of the water flow, affect the size of the vortex. This device utilizes the principle of water eddies, using nozzles of various shapes to create water flows of various shapes, including eddies, to remove residue from blind holes and small holes on thick PCB boards.

[0025] In this application scenario, the water jet is placed in a soaking tank. When water is sprayed from the spray nozzle 131, it is affected by the guide plate (spray plate 4), generating various liquid vortexes and agitations similar to tornadoes and whirlpools. Furthermore, the cleaning solution used is not limited to water, but also includes various cleaning solutions and their aqueous solutions.

[0026] Beneficial effects: The water sprayed from this type of water jet creates a vortex in the soaking tank, making it easier for the liquid to enter the holes of the PCB board, especially blind holes and small holes. It has better filling ability for thick PCB boards, resulting in better cleaning effect. It can effectively clean thick PCB boards, such as important processes in PCB board manufacturing such as removing glue residue and melting copper wires, and can effectively prevent the holes from being without copper, thus improving circuit performance and reliability.

[0027] In one embodiment, the first water inlet head 421 is parallel to the spray plate 4, and the second water inlet head 422 is at an angle to the spray plate 4.

[0028] Specifically, the first water inlet 421 and the second water inlet 422 change the speed and direction of the water flow, creating a speed difference between the water flows, which can generate two different water flows, and thus create a vortex.

[0029] In one embodiment, the length of the first water inlet head 421 is greater than the length of the second water inlet head 422.

[0030] Specifically, the length of the object obstructing the water flow affects the water flow path, causes flow around the object, and impacts structural stability. When the obstruction is short, the water flow will either pass directly over it or be diverted to both sides; when the obstruction is long, the water flow will be guided to flow in a specific direction. Short objects tend to cause localized eddies and scouring because water is more likely to seep from the edges or bottom, while long objects may change the main flow direction.

[0031] By setting the first water inlet head 421 and the second water inlet head 422 to different lengths, it is beneficial to generate different eddies to achieve cleaning of small holes and blind holes.

[0032] In one embodiment, the spray plate 4 includes: The first spray plate 43 includes a first connecting surface 431 and a first water guiding component 432. The first connecting surface 431 and the first water guiding component 432 are perpendicular to each other, and the first connecting surface 431 is attached to the first panel 11. The second spray plate 44 includes a second connecting surface 441 and a second water guiding component 442. The second connecting surface 441 and the second water guiding component 442 are perpendicular to each other, and the second connecting surface 441 is attached to the second panel 12.

[0033] Specifically, setting up two sets of spray plates 4 helps maintain balance and improves cleaning efficiency.

[0034] In one embodiment, the spray panel 13 is provided with at least two types of spray holes 131.

[0035] Specifically, setting at least two types of spray nozzles helps to generate multiple water flows and improve cleaning efficiency.

[0036] In one embodiment, the spray panel 13 is provided with a first spray hole 1311 and a second spray hole 1312, wherein the first spray hole 1311 is linear and the second spray hole 1312 is V-shaped.

[0037] Specifically, the water flows from the first spray hole 1311 and the second spray hole 1312 will interact to produce different water flows.

[0038] In one embodiment, the first spray hole 1311 and the second spray hole 1312 are arranged alternately.

[0039] Please see Figure 4 , Figure 4 This is a schematic diagram of the internal three-dimensional structure of a multi-functional water jet for thick PCB boards, as described in an embodiment of this utility model.

[0040] In one embodiment, the inlet 21 is circular.

[0041] Specifically, the inlet can be round or other shapes, but round is preferred as it helps to generate more regular vortices.

[0042] In one embodiment, a support plate 5 is provided within the accommodating space, and the support plate 5 is connected to the inner walls of the first panel 11 and the second panel 12.

[0043] Specifically, the support plate 5 provides fixed support for the U-shaped bracket 1.

[0044] In one embodiment, the support plate 5 is located above the outlet 21 and is spaced apart from the cover plate 2.

[0045] Specifically, the connecting plate 41 also obstructs the water flow at the inlet, changes the direction of the water flow, and helps to form multiple water flows.

[0046] This device features different water inlets 21 and at least two sets of water guiding components 42, each with at least two water inlets. A support plate 5 is installed within the accommodating space. Utilizing the principle of water eddy currents, a vortex is generated in the immersion tank, resulting in better hole filling capability. This allows water or other cleaning solutions to more easily enter the small holes and blind holes of the PCB thick board, facilitating the removal of adhesive residue and copper wire residue. The two sets of spray plates 4 help maintain balance and improve cleaning efficiency. The water flow from the first spray hole 131 and the second spray hole 1312 interacts to generate different water flows, resulting in a better cleaning effect, especially effective in cleaning thick PCB boards, thus improving circuit performance and reliability.

[0047] The above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Under the concept of this utility model, the technical features of the above embodiments or different embodiments can also be combined, the steps can be implemented in any order, and there are many other variations of different aspects of this utility model as described above. For the sake of brevity, they are not provided in detail. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. These modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this utility model.

Images