Packaging structure of power module
CN224698095UActive Publication Date: 2026-08-28HANGZHOU XINYU SEMICONDUCTOR CO LTD
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Patent Information
- Application Number
- CN202521992790.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Priority Date
- 2025-09-01
- Filing Date
- 2025-09-16
- Publication Date
- 2026-08-28
- Estimated Expiration
- 2035-09-16
AI Technical Summary
Technical Problem
[0005]本实用新型的目的是提供一种功率模块的封装结构，以解决现有技术中存在的产品可靠性差，线路焊接难度高及生产效率低下的问题，增强产品的可靠性和生产效率
Benefits of technology
[0016]本实用新型实施例提供的功率模块的封装结构，通过在壳体中设置连接柱，使得变压器绕组的出线端与对应的连接柱相连，再通过连接柱与电路板对应电连接，显著增强了连接的可靠性；通过模具注塑的方式制作带有连接端和连接引脚的一体成型的壳体，有效避免了额外单独设置引脚和连接端易发生错位等问题；电路板通过预留的导电通孔与壳体的连接端和连接引脚进行连接，可以有效提高连接的可靠性并降低生产难度，上盖与壳体的组装通过固定胶实现固定和密封，避免了灌胶工艺，极大程度上减少了加工所需的时间，提升了产品的生产效率。进一步地，通过在壳体容纳腔内设置定位柱，可精确定位磁环变压器位置，有效防止变压器的晃动，确保绕组与连接柱的稳定连接。
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Smart Images
Figure CN224698095U_ABST
Abstract
The application discloses a packaging structure of a power module, which comprises a shell, a top opening of the shell is provided with a containing cavity in the interior, a transformer is located in the containing cavity of the shell, and a circuit board is arranged on the top of the shell; at least part of the side edges of the shell is provided with connecting columns, the outgoing line ends of the windings of the transformer are connected with the corresponding connecting columns, the circuit board is provided with conductive through holes, and the circuit board is electrically connected with the transformer through the conductive through holes and the connecting columns. By arranging the connecting columns in the shell, the outgoing line ends of the windings of the transformer are connected with the corresponding connecting columns, and then the connecting columns are electrically connected with the corresponding circuit board, so that the connection difficulty is remarkably reduced, the welding can be realized by automatic equipment, the yield and reliability of the product are remarkably improved, the assembly efficiency of the product is improved, and the packaging structure is particularly suitable for large-scale industrial production requirements.
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