Die-cast aluminum full-gel-filled semi-enclosed integrated waterproof controller
Patent Information
- Application Number
- CN202522114388.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-09-30
- Publication Date
- 2026-08-28
- Estimated Expiration
- 2035-09-30
AI Technical Summary
传统控制器多采用拼接式外壳结构,存在接缝多、密封性差的问题,易导致水分或灰尘从缝隙内侵入,进而影响电路稳定性和使用寿命
[0013] 1. By integrating the built-in heat dissipation steps with the external heat dissipation fins, the heat dissipation area is increased, the heat conduction path is optimized, and the heat-generating components such as transistors are tightly fitted to the heat dissipation structure, which significantly improves heat dissipation efficiency and ensures stable operation of the controller for a long time.
Smart Images

Figure CN224698151U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of controller technology, specifically a die-cast aluminum fully potted semi-enclosed integrated waterproof controller. Background Technology
[0002] In industrial control, outdoor equipment, and humid environments, controllers often face multiple challenges, including waterproofing, dustproofing, and heat dissipation. Traditional controllers often use a modular housing structure, resulting in numerous seams and poor sealing, making them susceptible to moisture or dust intrusion, which can affect circuit stability and lifespan. Furthermore, high-power electronic components (such as transistors) generate significant heat during operation. Since most controllers lack internal heat dissipation mechanisms, inadequate heat dissipation can severely impact controller performance and even lead to malfunctions.
[0003] In summary, a controller solution with efficient heat dissipation and excellent waterproof performance is needed. Utility Model Content
[0004] The purpose of this invention is to provide a die-cast aluminum fully potted semi-enclosed integrated waterproof controller to solve the problems mentioned in the background art.
[0005] To achieve the above objectives, this utility model provides the following technical solution: a die-cast aluminum fully potted semi-enclosed integrated waterproof controller, comprising:
[0006] The device comprises a die-cast housing and a circuit board fixed inside the die-cast housing with sealant. Several heat dissipation fins are fixed on the die-cast housing, and heat dissipation steps are fixed inside the die-cast housing. The heat dissipation steps are in contact with the circuit board. Several transistors are fixed on the circuit board, and pressure strips are provided at the bottom of each transistor. A clamping mechanism is provided between the pressure strips and the transistors. The clamping mechanism includes limiting blocks at both ends of the pressure strips. Limiting grooves corresponding to the limiting blocks are opened on both sides of the circuit board. The limiting blocks and the pressure strips are connected by a reset component. Grooves are opened on both sides of the die-cast housing, and rubber plugs can be engaged in the grooves.
[0007] Preferably, the rubber plug has a circular hole through which a wire harness passes. The rubber plug also has a groove that can engage with a groove on the die-cast shell. The rubber plug facilitates the fixing of the wire harness and also seals the wire harness, improving the overall sealing performance of the die-cast shell.
[0008] Preferably, an insulating cloth is provided between the heat dissipation step and the circuit board, and the insulating cloth is fixed to the heat dissipation step to prevent leakage.
[0009] Preferably, the transistor is fixed to the circuit board by a pressure strip. The transistor has a through hole, and a screw is installed in the through hole. The screw can pass through the transistor to fix the transistor to the circuit board, ensuring that the transistor is in close contact with the heat dissipation step. The pressure of the pressure strip should be moderate to ensure that it is firmly fixed without damaging the transistor.
[0010] Preferably, the heat dissipation fins pass through the die-cast shell and contact the heat dissipation steps, which facilitates heat dissipation of the circuit board.
[0011] Preferably, the reset component further includes a U-shaped plate fixed to the top of the pressure bar. A fixing post is fixed inside the U-shaped plate, and a sliding plate passes through the fixing post. One side of the sliding plate abuts against the inner wall of the U-shaped plate, and a connecting plate is fixed to the other side of the sliding plate. The connecting plate is fixedly connected to the limiting block. A spring is sleeved on the fixing post, and the spring is located at the top of the sliding plate. Pulling the limiting block upward causes the limiting block to slide on the fixing post through the connecting plate, while simultaneously squeezing the spring. After the limiting block is moved to the top of the circuit board and aligned with the limiting groove, the limiting block is released. Under the action of the spring, the limiting block will enter the limiting groove. At this time, the pressure bar will squeeze the transistor. At the same time, the pressure bar will ensure that the pressure on each transistor is the same. The cooperation between the pressure bar and the screw can ensure that the transistor is in close contact with the heat dissipation step. At the same time, this fixing method is firm and reliable, improving the stability of transistor operation.
[0012] Compared with the prior art, the beneficial effects of this utility model are:
[0013] 1. By integrating the built-in heat dissipation steps with the external heat dissipation fins, the heat dissipation area is increased, the heat conduction path is optimized, and the heat-generating components such as transistors are tightly fitted to the heat dissipation structure, which significantly improves heat dissipation efficiency and ensures stable operation of the controller for a long time.
[0014] 2. It adopts a semi-enclosed integrated structure with a reasonable internal layout. The transistor and heat dissipation structure can be tightly fitted through the cooperation of pressure strips and reset components. The rubber plug design facilitates the introduction and fixation of wire harnesses, simplifies the assembly process, and improves production efficiency. Attached Figure Description
[0015] Figure 1 This is a schematic diagram of the overall structure of this utility model;
[0016] Figure 2 This is a schematic diagram of the interior of the die-cast shell of this utility model;
[0017] Figure 3 This is an exploded view of the structure of this utility model;
[0018] Figure 4 This is a partial structural schematic diagram of the present invention;
[0019] Figure 5This is a schematic diagram of the resetting component structure of this utility model.
[0020] In the diagram: 1. Heat dissipation fins; 2. Die-cast shell; 3. Rubber plug; 4. Wiring harness; 5. Circuit board; 6. Groove; 7. Sealant; 8. Pressure strip; 9. Transistor; 10. Perforation; 11. Groove; 12. Heat dissipation step; 13. Insulating cloth; 14. Limiting groove; 15. Connecting plate; 16. Limiting block; 17. U-shaped plate; 18. Spring; 19. Sliding plate; 20. Fixing post. Detailed Implementation
[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0022] Please see Figures 1 to 5 One embodiment of this utility model provides: a die-cast aluminum fully potted semi-enclosed integrated waterproof controller, comprising:
[0023] The die-cast shell 2 and the circuit board 5 are fixed inside the die-cast shell 2 by sealant 7. Several heat dissipation fins 1 are fixed on the die-cast shell 2. Heat dissipation steps 12 are fixed inside the die-cast shell 2 and are attached to the circuit board 5. Several transistors 9 are fixed on the circuit board 5. Pressure strips 8 are provided at the bottom of the transistors 9. A clamping mechanism is provided between the pressure strips 8 and the transistors 9. The clamping mechanism includes limiting blocks 16 provided at both ends of the pressure strips 8. Limiting grooves 14 corresponding to the limiting blocks 16 are opened on both sides of the circuit board 5. The limiting blocks 16 and the pressure strips 8 are connected by a reset component. Grooves 11 are opened on both sides of the die-cast shell 2. Rubber plugs 3 can be snapped into the grooves 11. The die-cast shell 2 is a die-cast shell 2 formed in one die-casting. The die-casting process ensures the integrity and dimensional accuracy of the cavity structure, avoids gaps that may occur in spliced structures, fundamentally improves the sealing foundation of the internal cavity of the die-cast shell 2, and lays a solid structural foundation for subsequent waterproofing treatment. At the same time, the pressure strip 8 can be quickly installed through the reset component, and the pressure strip 8 exerts the same pressure on each transistor 9.
[0024] It is worth noting that the rubber plug 3 has a round hole through which the wire harness 4 passes. The rubber plug 3 also has a groove 6 that can be engaged with the groove 6 on the die-cast shell 2. The rubber plug facilitates the fixing of the wire harness 4 and also seals the wire harness 4, improving the overall sealing performance of the die-cast shell 2. The wire harness 4 passes through the rubber plug 3, which can effectively prevent moisture from seeping in from the wire inlet and prevent the wire from loosening or falling off during use.
[0025] Furthermore, an insulating cloth 13 is provided between the heat dissipation step 12 and the circuit board 5. The insulating cloth 13 is fixed to the heat dissipation step 12 to prevent leakage.
[0026] Meanwhile, transistor 9 is fixed to circuit board 5 by pressure strip 8. Transistor 9 has a through hole 10 with a screw inserted through it, allowing the screw to pass through and secure the transistor 9 to circuit board 5. This ensures a tight fit between transistor 9 and heat dissipation step 12. The pressure of pressure strip 8 must be moderate, ensuring a secure fixation without damaging transistor 9. Transistor 9 is fixed to heat dissipation step 12 by pressure strip 8 and screws. The cooperation between pressure strip 8 and screws ensures close contact between transistor 9 and heat dissipation step 12, and this fixing method is robust and reliable, improving the operational stability of transistor 9.
[0027] Furthermore, the heat dissipation fin 1 passes through the die-cast shell 2 and contacts the heat dissipation step 12, facilitating heat dissipation for the circuit board 5. The heat dissipation fin 1 on the die-cast shell 2 further increases the heat dissipation area. The heat dissipation fin 1 and the die-cast shell 2 are integrally formed, which can efficiently conduct heat out of the cavity, accelerate the exchange of heat with the external environment, effectively reduce the internal temperature of the controller, and ensure the normal operation of electronic components.
[0028] Finally, the reset component also includes a U-shaped plate 17 fixed to the top of the pressure bar 8. A fixing post 20 is fixed inside the U-shaped plate 17, and a sliding plate 19 passes through the fixing post 20. One side of the sliding plate 19 abuts against the inner wall of the U-shaped plate 17, and a connecting plate 15 is fixed to the other side of the sliding plate 17. The connecting plate 15 is fixedly connected to the limiting block 16. A spring 18 is sleeved on the fixing post 20. The spring 18 is located on the top of the sliding plate 19. Pulling the limiting block 16 upward, the limiting block 16 drives the sliding plate 19 to slide on the fixing post 20 through the connecting plate 15. At the same time, it squeezes the spring 18, moves the limiting block 16 to the top of the circuit board 5 and aligns it with the limiting groove 14. Then, the limiting block 16 is released. Under the action of the spring 18, the limiting block 16 will enter the limiting groove 14. At this time, the pressure bar 8 will squeeze the transistor 9. At the same time, the pressure bar 8 will ensure that the pressure on each transistor 9 is the same. The cooperation between the pressure bar 8 and the screw can ensure that the transistor 9 is in close contact with the heat dissipation step 12. At the same time, this fixing method is firm and reliable, which improves the stability of the transistor 9.
[0029] During operation, transistors 9 are secured to the heat dissipation step 12 at the bottom of the die-cast shell 2 using pressure strips 8 and screws, ensuring a tight fit between transistors 9 and the heat dissipation step 12. Pulling the limiting block 16 upwards causes the limiting block 16 to slide the sliding plate 19 on the fixing post 20 via the connecting plate 15, simultaneously compressing the spring 18. This moves the limiting block 16 to the top of the circuit board 5 and aligns it with the limiting groove 14. Releasing the limiting block 16 allows it to enter the limiting groove 14 under the action of the spring 18. At this point, the pressure strip 8 compresses the transistors 9, ensuring proper contact between each transistor. The pressure of tube 9 is the same. The cooperation between the pressure strip 8 and the screw ensures that the transistor 9 is in close contact with the heat dissipation step 12. It is necessary to ensure that the fixation is firm but not to damage the transistor 9. Arrange the two power wires and three phase wires and pass them through the rubber plug 3 to ensure that the circuit is firmly fixed and well sealed. After completing the installation of the above components and fixing of the circuit, mix the special sealant 7 according to the specified ratio and then slowly pour it into the semi-enclosed die-cast shell 2 cavity until the entire cavity is filled. Ensure that the sealant 7 fills all gaps. After the sealant 7 is completely cured, the assembly of the entire controller is completed.
[0030] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.
Claims
1. A die-cast aluminum fully potted semi-enclosed integrated waterproof controller, comprising a die-cast shell (2) and a circuit board (5) fixed inside the die-cast shell (2) by sealant (7), characterized in that, The die-cast shell (2) is fixed with several heat dissipation fins (1), and the die-cast shell (2) is fixed with a heat dissipation step (12). The heat dissipation step (12) is attached to the circuit board (5). The circuit board (5) is fixed with several transistors (9). The bottom of the transistors (9) is provided with a pressure strip (8). A clamping mechanism is provided between the pressure strip (8) and the transistors (9). The clamping mechanism includes a limiting block (16) provided at both ends of the pressure strip (8). The circuit board (5) is provided with a limiting groove (14) corresponding to the limiting block (16) on both sides. The limiting block (16) and the pressure strip (8) are connected by a reset component. The die-cast shell (2) is provided with a groove (11) on both sides. A rubber plug (3) can be snapped into the groove (11).
2. The die-cast aluminum fully potted semi-enclosed integrated waterproof controller according to claim 1, characterized in that: The rubber plug (3) has a round hole, through which a wire harness (4) passes. The rubber plug (3) has a groove (6), which can be engaged with the groove (6) on the die-cast shell (2).
3. The die-cast aluminum fully potted semi-enclosed integrated waterproof controller according to claim 2, characterized in that: An insulating cloth (13) is provided between the heat dissipation step (12) and the circuit board (5), and the insulating cloth (13) is fixed to the heat dissipation step (12).
4. The die-cast aluminum fully potted semi-enclosed integrated waterproof controller according to claim 3, characterized in that: The transistor (9) is fixed to the circuit board (5) by a pressure bar (8). A through hole (10) is provided on the transistor (9), and a screw is provided in the through hole (10). The screw can pass through the transistor (9).
5. The die-cast aluminum fully potted semi-enclosed integrated waterproof controller according to claim 4, characterized in that: The heat dissipation fin (1) passes through the die-cast shell (2) and comes into contact with the heat dissipation step (12).
6. The die-cast aluminum fully potted semi-enclosed integrated waterproof controller according to claim 1, characterized in that: The reset component also includes a U-shaped plate (17) fixed to the top of the pressure strip (8). A fixing post (20) is fixed inside the U-shaped plate (17). A sliding plate (19) passes through the fixing post (20). One side of the sliding plate (19) abuts against the inner wall of the U-shaped plate (17). A connecting plate (15) is fixed to the other side of the sliding plate (19). The connecting plate (15) is fixedly connected to the limiting block (16). A spring (18) is sleeved on the fixing post (20). The spring (18) is located at the top of the sliding plate (19).