Anti-walk tooling and laminator
CN224698199UActive Publication Date: 2026-08-28ELITE SOLAR CO LTD
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Patent Information
- Application Number
- CN202522127598.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-09-30
- Publication Date
- 2026-08-28
- Estimated Expiration
- 2035-09-30
AI Technical Summary
Technical Problem
[0004]基于此,有必要针对现有的无主栅叠层电池存在的串移问题,提供一种防串移工装和层压机
Benefits of technology
[0025]上述防串移工装和层压机,通过第一夹持单元与第二夹持单元之间产生相对运动,来调整第一夹持件和第二夹持件形成的夹持空间的大小,例如第一夹持件至少部分的相对第二夹持件靠近,来减小夹持空间,能够精准且牢固地夹持焊带,确保焊带在层压等工艺过程中位置稳定,不会轻易发生位移。通过夹持机构对焊带进行约束固定,极大地增强了焊带的抗位移能力,抵抗层压过程中因封装胶膜流动引起的剪切力,避免了光伏组件在层压过程中因焊带位移而导致的电池串移位问题,降低串移风险,保证了光伏组件的生产质量和性能稳定性,降低不良品率,具有显著的经济效益。同时,也能够根据焊带的规格,对应调整夹持空间的大小,夹持不同规格的焊带,提升其通用性。层压完成后,第一夹持件相对第二夹持件远离,从而可以轻松剪除焊带并移除工装,避免了胶体固定焊带所引发的污染或损伤电池片表面的问题。
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Abstract
The application relates to an anti-stringing tool and a laminating machine. The size of a clamping space formed by a first clamping piece and a second clamping piece is adjusted by relative movement between the first clamping unit and the second clamping unit, for example, the first clamping piece is close to the second clamping piece to reduce the clamping space, so that the solder strip can be accurately and firmly clamped, and the position of the solder strip is stable during the laminating process and cannot be easily displaced. The solder strip is constrained and fixed by the clamping mechanism, which greatly enhances the anti-displacement ability of the solder strip, resists the shear force caused by the flow of the packaging adhesive film during the laminating process, avoids the battery string displacement problem caused by the displacement of the solder strip during the laminating process of the photovoltaic module, reduces the string displacement risk, ensures the production quality and performance stability of the photovoltaic module, reduces the defective product rate, and has significant economic benefits. At the same time, the size of the clamping space can be adjusted according to the specifications of the solder strip, different specifications of the solder strip can be clamped, and the universality is improved.
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