High-thermal-conductivity LED lamp bead convenient to install
CN224698214UActive Publication Date: 2026-08-28ZHEJIANG FEITIAN OPTOELECTRONICS CO LTD
View PDF 0 Cites 0 Cited by
Patent Information
- Application Number
- CN202521979174.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-09-13
- Publication Date
- 2026-08-28
- Estimated Expiration
- 2035-09-13
AI Technical Summary
Technical Problem
当LED灯珠尺寸不断缩小,传统分布在两侧的焊脚会导致焊脚密度急剧升高,连锡短路的风险呈指数级增长,使得小尺寸灯珠的制作难度大幅提升,进而限制了线路板模组朝着小型化、低成本方向发展
Benefits of technology
[0012]1.基板表面设置专门的安装腔用于固定发光芯片,相比传统直接将芯片粘贴在基板平面的方式,安装腔能够对发光芯片形成周向限位,有效避免了灯珠在运输、安装及使用过程中因振动、冲击导致的芯片偏移或脱落问题,显著提升了灯珠内部结构的稳定性,延长了产品的使用寿命。电极结构采用若干对称设置在基板底部的引脚,且一端的两个引脚从基板侧面延伸,该设计打破了传统引脚仅从底部引出的局限。侧面延伸的引脚可直接与外部电路的侧面接线端子实现快速对接,无需额外调整灯珠安装角度或使用转接结构,简化了装配流程,提高了安装效率。对称设置的电极引脚不仅起到导电作用,还能作为辅助散热通道,将发光芯片工作时产生的热量通过引脚传导至外部电路或散热结构中。
✦ Generated by Eureka AI based on patent content.
Smart Images

Figure CN224698214U_ABST
Abstract
The utility model discloses a high heat conduction convenient installation's LED lamp pearl, aims at providing a kind of high heat conduction, strong welding reliability and structural stability for LED lamp pearl's welding leg, and its technical scheme main points are including substrate, electrode structure and light emitting chip, the surface of substrate is equipped with the mounting cavity for fixed light emitting chip, the mounting cavity is equipped with the lens and is equipped with the encapsulation for the encapsulation protection of light emitting chip, the electrode structure includes several symmetrically arranged pin in substrate bottom and with light emitting chip electric connection, wherein two pins of one end extend from substrate side surface, for realizing electric connection with external circuit. The utility model is applicable to LED lamp pearl technical field.
Need to check novelty before this filing date? Find Prior Art