Wafer etching apparatus

Abstract

The application provides a wafer etching device, and relates to the technical field of semiconductor manufacturing. The device comprises an etching cavity, a ring-shaped supporting assembly arranged in the etching cavity and used for supporting a wafer, a conveying member arranged in the etching cavity and used for conveying the wafer to the ring-shaped supporting assembly, a laser detection assembly arranged in the etching cavity and used for detecting the actual distance between the wafer edge and the sidewall of the ring-shaped supporting assembly, and a controller electrically connected with the ring-shaped supporting assembly, the laser detection assembly and the conveying member. The controller is preset with a standard distance, and whether the wafer is aligned with the ring-shaped supporting assembly is determined according to the actual distance and the standard distance. When it is determined that the wafer is not aligned with the ring-shaped supporting assembly, the controller controls the conveying member to adjust the position of the wafer. The wafer can be accurately aligned on the ring-shaped supporting assembly in the etching process, so that the precision and uniformity of the etching process are improved.

Claims

1. A wafer etching apparatus, characterized in that, include: Etching cavity; An annular support assembly is disposed within the etching cavity to support the wafer; A conveyor, disposed within the etching cavity, is used to convey the wafer to the annular support assembly; A laser detection component, disposed within the etching cavity, is used to detect the actual distance between the wafer edge and the sidewall of the annular support component; The controller is electrically connected to the annular support assembly, the laser detection assembly, and the conveyor. The controller has a preset standard distance and determines whether the wafer is aligned with the annular support assembly based on the actual distance and the standard distance. When it is determined that the wafer is not aligned, the controller controls the conveyor to adjust the position of the wafer.

2. The wafer etching equipment according to claim 1, characterized in that, The laser detection component includes; A first laser emitter is disposed on the sidewall of the etching cavity and is at the same horizontal plane as the conveying component. It is used to emit laser light toward the side of the wafer and generate first distance data between the wafer and the first laser emitter. The second laser emitter is disposed on the sidewall of the etching cavity, located below the first laser emitter and at the same level as the annular support assembly, for emitting laser light toward the sidewall of the annular support assembly and generating second distance data between the sidewall of the annular support assembly and the second laser emitter; A data processor, electrically connected to the controller, is used to receive the first distance data and the second distance data, and to calculate the actual distance between the wafer and the sidewall of the annular support assembly based on the first distance data and the second distance data.

3. The wafer etching equipment according to claim 2, characterized in that, The annular support assembly includes: A support stage, disposed within the etching cavity, is used to support the wafer; An edge ring is provided around the edge of the support platform, and the second laser emitter is on the same horizontal plane as the edge ring; A lifting pin, mounted on the support platform and electrically connected to the controller, is used to receive the wafer being transported by the conveyor and to drive the wafer to rise and fall.

4. The wafer etching equipment according to claim 3, characterized in that, The first laser emitter is slidably connected to the sidewall of the etching cavity. When the lifting pin moves the wafer up and down, the first laser emitter moves up and down synchronously.

5. The wafer etching equipment according to claim 3, characterized in that, The controller includes: A location determination unit; used to receive the actual distance and compare the actual distance with a preset standard distance; When the actual distance is equal to the standard distance, it is determined that the wafer is aligned with the annular support assembly; When the actual distance is not equal to the standard distance, it is determined that the wafer and the annular support assembly are not aligned.

6. The wafer etching apparatus according to claim 5, characterized in that, The controller also includes: A distance calculation unit is used to receive the actual distance and calculate the calibration value of the wafer based on the actual distance and the standard distance.

7. The wafer etching apparatus according to claim 6, characterized in that, The controller also includes: A control execution unit is configured to receive the calibration value, generate a control command based on the calibration value, and send the control command to the transmission component and the lifting pin. The rising pin raises the wafer to the conveyor according to the control command; The transporter adjusts the wafer position according to the control command.

8. The wafer etching apparatus according to any one of claims 1-7, characterized in that, It also includes an alarm component connected to the controller. When it is determined that the wafer is not aligned with the annular support component, the controller controls the alarm component to issue an alarm message.

9. The wafer etching apparatus according to claim 8, characterized in that, The alarm component includes: A buzzer is connected to the controller. When it is determined that the wafer is not aligned with the annular support assembly, the controller controls the buzzer to sound.

10. The wafer etching apparatus according to claim 8, characterized in that, The alarm component also includes: A warning light, connected to the controller, is used to flash when the controller determines that the wafer is not aligned with the annular support assembly.

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