Split bushing for a wafer passage, wafer passage assembly comprising the split bushing, and semiconductor process apparatus
CN224698231UActive Publication Date: 2026-08-28JIANGSU MICROVIA NANO EQUIP TECH CO LTD
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Patent Information
- Application Number
- CN202521542135.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-07-22
- Publication Date
- 2026-08-28
- Estimated Expiration
- 2035-07-22
AI Technical Summary
Technical Problem
但是，在传片通道内安装和拆卸一体式衬套时，衬套会被机台的加热盘阻挡，因此在安装和拆卸衬套的时候需要同步安装和拆卸机台的加热盘，这使得安装和拆卸衬套的操作流程较为复杂、繁琐且需要消耗大量的时间，进而影响机台的正常运行，降低生产效率
Benefits of technology
[0034]首先，当在传片通道内安装了分体式衬套之后，当需要清理粉尘时，只需要将分体式衬套取下并清洁，不需要直接清理传片通道，因而清洁更方便，有利于防止粉尘落在晶圆上，因而有利于保证了产品质量、提高合格率。
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Figure CN224698231U_ABST
Abstract
The application relates to a split bushing for a wafer passage, a wafer passage assembly comprising the split bushing and a semiconductor process equipment. The split bushing comprises a first part having a flat middle part and a first side part and a second side part respectively extending from two ends of the middle part; a second part having a first end part and a second end part capable of being clamped to the first side part and the second side part of the first part, so that the first part and the second part can be fixed together by clamping to form a ring body, and the ring body can be sealingly fixed in the wafer passage; wherein the second part comprises at least two components which are detachably connected together. The split bushing can effectively solve the problems of dust accumulation in the wafer passage, difficult cleaning and easy peeling.
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