Wafer strip machine

Abstract

The utility model provides a kind of wafer film reversing machine, it includes cabinet, its top is equipped with FFU, at least two openings are set in the cabinet side;Wafer carrying mechanism is distributed in the outside of cabinet in row and is one-to-one interfaced with the opening, wafer carrying mechanism has the height-adjustable adsorption platform of placing wafer magazine;Mechanical arm mechanism, located inside cabinet, including linear module, base, mechanical arm and the wafer pick-and-place part of being equipped in the end of mechanical arm;Edge inspection mechanism;Optical code reading assembly, located one side of the edge inspection mechanism, the optical code reading assembly includes camera, lens and light source;Static electricity removing mechanism, including the ion fan of being arranged in one side of the edge inspection mechanism, the air outlet of ion fan is horizontally towards the edge inspection mechanism setting, the optical code reading assembly is higher than the air outlet of ion fan in vertical direction;Control system.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing technology, and in particular to a wafer flipping machine. Background Technology

[0002] In the semiconductor manufacturing industry, wafer flipping machines are key equipment connecting different processes, and their performance directly affects the efficiency and yield of wafer production. As chip manufacturing processes break through to below 7nm and wafer sizes move towards 12 inches or even larger, the industry has placed higher demands on the automation level, operational precision, and environmental adaptability of wafer flipping machines.

[0003] Existing wafer flipping machines generally have the following problems: wafers are extremely sensitive to static electricity (threshold as low as 50V), but the ion fans of traditional flipping equipment mostly adopt a vertical air supply design. The strong airflow directly impacts the wafer, which can easily cause micro-vibrations (amplitude up to 50μm). This not only interferes with the positioning accuracy of the edge-tracking mechanism, but may also cause micro-collisions between the wafer edge and the robotic arm. At the same time, the dust carried by the airflow can easily adhere to the barcode reading lens, causing image blurring and further reducing recognition stability.

[0004] Furthermore, if the cleanliness level inside traditional equipment is not up to standard, dust adhering to the wafer surface may lead to an increase in the defect rate of subsequent photolithography processes. Moreover, the clean airflow circulation design of existing equipment is unreasonable, easily forming eddies in certain areas, making it difficult to maintain a stable clean environment.

[0005] Therefore, it is necessary to design a wafer flipping machine to solve the above problems. Summary of the Invention

[0006] The purpose of this invention is to provide a wafer flipping machine with good equipment cleanliness, high code reading accuracy, and a high degree of automation.

[0007] To achieve the above objectives, this utility model adopts the following technical solution: a wafer flipping machine, comprising: The housing has an FFU on its top and at least two openings on one side of the housing. The wafer carrier mechanism is arranged in rows on the outside of the housing and is connected to the opening one by one. The wafer carrier mechanism has an adjustable adsorption platform for placing wafer cassettes. The robotic arm mechanism, located inside the housing, includes a linear module, a base, a robotic arm, and a wafer pick-and-place section located at the end of the robotic arm; Border patrol agencies; An optical barcode reader component, located on one side of the edge-tracing mechanism, is used to identify the surface ID of the wafer on the edge-tracing mechanism and bind the identification data with the position coordinates output by the edge-tracing mechanism. The optical barcode reader component includes a camera, a lens, and a light source. The static elimination mechanism includes an ion fan disposed on one side of the edge-tracing mechanism, the air outlet of the ion fan being horizontally oriented towards the edge-tracing mechanism, and the optical code reading component being vertically higher than the air outlet of the ion fan. The control system connects to and controls the wafer carrier mechanism, robotic arm mechanism, edge-tracking mechanism, and optical code reading assembly.

[0008] As a further improvement of the present invention, the linear module is arranged along the X-axis, the openings are arranged sequentially along one side of the linear module, and the edge-following mechanism is located at one end of the linear module.

[0009] As a further improvement of this utility model, the ion fan, the edge-following mechanism and the optical code reading component are arranged sequentially along the Y-axis.

[0010] As a further improvement of the present invention, the invention also includes a transfer component, which includes a bracket, a Y-axis linear module disposed on the bracket, and a lifting component disposed on the Y-axis linear module. The optical code reading component is disposed on the lifting component and moves along the Y-axis and Z-axis directions under the drive of the transfer component.

[0011] As a further improvement of the present invention, the optical code reading assembly also includes a cover with a lower opening located on the outside of the camera and lens.

[0012] As a further improvement of this utility model, the lifting component is mounted on the Y-axis linear module via a vertical mounting plate, and the light source is located at the lower end of the vertical mounting plate.

[0013] As a further improvement of the present invention, the lifting assembly is a Z-axis displacement stage, including a base, a fixed part with a groove, a movable stage with a guide rail, a gear and rack drive component located between the fixed part and the movable stage, a handwheel connected to the gear and rack drive component, and a locking screw that locks the fixed part and the movable stage together. The guide rail cooperates with the groove, and the movable stage moves in the Z-axis direction under the drive of the gear and rack drive component.

[0014] As a further improvement of the present invention, the static elimination mechanism further includes an ion air bar disposed inside the opening of the housing, the ion air bar being located above the opening, and the static elimination range of the ion air bar covering the opening.

[0015] As can be seen from the above technical solutions, this wafer flipping machine improves the wafer static electricity removal effect while effectively ensuring the accuracy of optical code reading by optimizing the position layout of the static electricity removal mechanism, robotic arm mechanism, edge-tracking mechanism, and optical code reading component, resulting in a significant enhancement of overall performance. In terms of static electricity elimination, the targeted layout of the ion fan plays a crucial role. The ion fan is positioned on one side of the edge-checking mechanism, with its outlet horizontally facing the mechanism. This design allows the ion air to directly and evenly cover the wafer surface on the edge-checking mechanism. When the wafer is in a state of being inspected or positioned during edge checking, the horizontally blowing ion air can quickly neutralize the static charge generated on the wafer surface due to friction and contact separation, significantly reducing the risk of electrostatic adsorption of dust and particles, while avoiding potential damage to the delicate circuitry inside the wafer caused by electrostatic discharge. Compared to traditional distributed or non-directional static electricity elimination solutions, this layout makes the ion air action more focused and efficient, significantly improving the static electricity elimination rate on the wafer surface and providing a more stable and safe electrostatic environment for subsequent wafer handling, handling, and transfer processes. Meanwhile, the specific positioning of the ion fan, the edge-tracing mechanism, and the optical barcode reader perfectly resolves the potential conflict between static electricity removal and barcode reading accuracy. The optical barcode reader is located on one side of the edge-tracing mechanism and is vertically higher than the ion fan's outlet; this design cleverly avoids interference from the ion airflow during the barcode reading process. The horizontally exiting ion airflow primarily acts on the sides and lower surface of the wafer, avoiding direct impact on the camera, lens, and light source located above, thus preventing lens shake and light source refraction deviations caused by airflow disturbances. Therefore, while the ion airflow continuously removes static electricity, the optical barcode reader can still accurately identify the wafer surface ID and stably output identification data bound to the edge-tracing mechanism's position coordinates, effectively ensuring barcode reading accuracy and stability, and significantly reducing the misread rate.

[0016] In addition, combined with the clean airflow environment provided by the FFU (Fan Filter Unit) on the top of the housing, the ion wind generated by the ion fan forms a directional and clean antistatic airflow field in the clean space, further reducing the impact of impurities in the external environment on the wafer and code reading components. This ensures that the antistatic effect and code reading accuracy are doubly guaranteed in a clean and stable environment, greatly improving the overall operational reliability of the equipment and the quality of wafer processing. Attached Figure Description

[0017] Figure 1 This is a perspective view of a wafer flipping machine according to an embodiment of the present invention.

[0018] Figure 2 for Figure 1 A three-dimensional view of the wafer fracturing machine from another angle (part of the machine casing omitted).

[0019] Figure 3 for Figure 2 A 3D view of the robotic arm mechanism.

[0020] Figure 4 for Figure 2 A three-dimensional view of the central patrol mechanism, optical code reading components, and ion fan.

[0021] Figure 5 for Figure 4 A 3D view of the optical barcode reader component.

[0022] Figure 6 for Figure 4 Top view of the Z-axis displacement stage. Detailed Implementation

[0023] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be described in detail below with reference to the accompanying drawings and specific embodiments.

[0024] Please refer to Figure 1 and Figure 2 As shown, this utility model provides a wafer flipping machine, which includes a housing 10, a wafer carrier mechanism 20, a robotic arm mechanism 30, an edge-following mechanism 40, an optical code reader assembly 50, an electrostatic discharge mechanism 60, a transfer mechanism 70, and a control system. The control system is connected to and controls the actions of the wafer carrier mechanism 20, the robotic arm mechanism 30, the edge-following mechanism 40, the optical code reader assembly 50, the electrostatic discharge mechanism 60, and the transfer mechanism 70.

[0025] The housing 10 provides a clean space for wafer transfer, and has an FFU 12 on its top. Four openings 11 are formed on one side of the housing 10. Wafer carrier mechanisms 20 are arranged in rows on the outside of the housing 10 and dock with each opening 11. Each wafer carrier mechanism 20 has a height-adjustable adsorption platform for placing wafer cassettes. The wafer carrier mechanism 20 can be a conventional wafer SMIF (Standard Mechanical Interface), using a compatible wafer cassette for loading and unloading wafers. The wafer cassette is also selected from conventional SMIFpod switch boxes. The SMIFpod switch box is placed on the wafer SMIF adsorption platform and docks with the openings 11. Its detailed structure and working principle are not described here.

[0026] Please refer to Figure 2 and Figure 3 As shown, the robotic arm mechanism 30 is located inside the housing 10 and includes a linear module 31, a base 32, a robotic arm 33, and a wafer pick-and-place section 34 located at the end of the robotic arm 33. Specifically, the linear module 31 is arranged along the X-axis direction, and the openings 11 of the housing 10 are arranged sequentially along one side of the linear module 31.

[0027] Please refer to Figure 2 and Figure 4 As shown, the edge-following mechanism 40 is located at one end of the linear module 31 and is used to locate the center position of the wafer through the wafer V-groove. In this embodiment, the edge-following mechanism 40 adopts an edge-following device in the prior art, and its detailed structure will not be described in detail here. The edge-following mechanism 40 is mounted in the housing by a bracket 41.

[0028] The optical barcode reader 50 is located on one side of the edge-tracing mechanism 40 and is used to identify the surface ID of the wafer on the edge-tracing mechanism 40 and bind the identification data to the position coordinates output by the edge-tracing mechanism 40. The optical barcode reader includes a camera 51, a lens 52, a light source 53 arranged sequentially from top to bottom, and a cover with a lower opening located outside the camera 51 and the lens 52; the optical barcode reader also includes

[0029] Please refer to Figure 4 and Figure 5 As shown, preferably, the optical barcode reader 50 is mounted inside the housing via a transfer assembly 70. The transfer assembly 70 includes a bracket 71, a Y-axis linear module 72 mounted on the bracket 71, a vertical mounting plate 73, and a lifting assembly 74 mounted on the mounting plate 73. The optical barcode reader 50 is mounted on the lifting assembly 74, and moves along the Y-axis and Z-axis directions under the drive of the transfer assembly 70.

[0030] The lifting assembly 74 is mounted on the Y-axis linear module 72 via a vertical mounting plate 73, and the light source 53 is located at the lower end of the vertical mounting plate 73. Please refer to... Figure 6 As shown, the lifting assembly 74 is preferably a Z-axis displacement stage, including a base 741, a fixed part 742 with a groove, a movable stage 743 with a guide rail, a gear and rack drive 744 disposed between the fixed part 742 and the movable stage 743, a handwheel 745 connected to the gear and rack drive 744, and a locking screw 746 that locks the fixed part 742 and the movable stage 743 together. The guide rail cooperates with the groove, and the movable stage 743 moves in the Z-axis direction under the drive of the gear and rack drive 744.

[0031] The static eliminator 60 includes an ion fan 61 disposed on one side of the edge-tracking mechanism 40 and an ion bar 62 disposed inside the opening 11 of the housing 10. The ion fan 61, the edge-tracking mechanism 40, and the optical code reader assembly 50 are arranged sequentially along the Y-axis. The ion fan 61 is mounted inside the housing via a bracket 61 and is used to eliminate static electricity generated during wafer positioning. The outlet of the ion fan 61 is horizontally oriented towards the edge-tracking mechanism 40, and the optical code reader assembly 50 is vertically higher than the outlet of the ion fan 61. The optical code reader component 50 is vertically higher than the air outlet of the ion fan 61, and the three components are arranged sequentially along the Y-axis, forming a spatial layout with "no horizontal overlap and vertical height difference": Horizontally, the air outlet of the ion fan 61 is offset from the lens and light source of the optical code reader component 50 along the Y-axis, preventing the ion wind from directly impacting the optical path of the code reader component; vertically, the air outlet is lower than the code reader component, so that the ion wind mainly acts on the lower middle area of ​​the wafer, while the camera lens of the code reader component focuses on the ID surface of the wafer from above, and the areas of action of the two are completely separated in space. This design ensures that the light propagation of the light source is not affected by airflow disturbances, and the wafer ID image captured by the camera is clear and stable, effectively avoiding problems such as image blurring and spot shift caused by ion wind.

[0032] In addition, the ion fan 61 is independently installed via bracket 611, and is independently installed along with the edge-tracing mechanism 40 and the optical code reading component 50. Therefore, the vibration of the ion fan and the edge-tracing mechanism is absorbed by their respective mounting brackets and will not be transmitted to the optical code reading component, so that the optical code reading component is always in a stable working environment. The camera continuously acquires clear and stable wafer surface ID images, and the light propagation path of the light source will not be shifted due to vibration. The code reading accuracy and data reliability are fundamentally guaranteed, effectively reducing the risk of code reading failure or misreading caused by vibration.

[0033] The ionizer 62 is positioned above the opening 11, and its static-eliminating range covers the opening 11. This configuration forms an "electrostatic protection barrier" for the critical process of wafers entering and leaving the housing. When the robotic arm picks up or places a wafer through the opening, the wafer will be within the effective range of the ionizer 62 as it passes through the opening. The ion flow generated by the ionizer 62 can quickly neutralize the static charge newly generated on the wafer during the transfer process (such as when it rubs against the tray or when it comes into contact with the robotic arm's pick-up and place section), preventing static electricity from accumulating on the wafer surface.

[0034] The terms used herein, such as “up,” “down,” “front,” “back,” “left,” and “right,” indicating relative spatial positions, are for illustrative purposes to describe the relationship of one feature relative to another, as shown in the accompanying drawings. It is understood that, depending on the product's placement, these terms may be intended to include different orientations besides those shown in the figures, and should not be construed as limiting the claims.

[0035] Furthermore, the above embodiments are only used to illustrate the present utility model and are not intended to limit the technical solutions described in the present utility model. The understanding of this specification should be based on those skilled in the art. Although the present utility model has been described in detail with reference to the above embodiments, those skilled in the art should understand that they can still make modifications or equivalent substitutions to the present utility model. All technical solutions and improvements that do not depart from the spirit and scope of the present utility model should be covered within the scope of the claims of the present utility model.

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