A processing apparatus for a transfer cavity and a semiconductor device
CN224698234UActive Publication Date: 2026-08-28PIOTECH (SHANGHAI) CO LTD
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Patent Information
- Application Number
- CN202521726546.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-08-13
- Publication Date
- 2026-08-28
- Estimated Expiration
- 2035-08-13
AI Technical Summary
Technical Problem
因此，各个模块机械硬件对接的时候往往可能存在密封不良或者产生污染颗粒的问题
Benefits of technology
[0006]为了克服现有技术存在的上述缺陷，本实用新型提供了一种传输腔及半导体器件的加工设备，通过将多个腔室集成到一体式主体，降低各腔体的安装难度，并提升多腔体传输腔的整体密封性，以兼顾半导体器件加工设备的加工效率和所能达到的真空度。
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Figure CN224698234U_ABST
Abstract
The utility model provides a kind of transmission cavity and a kind of processing equipment of semiconductor device.The transmission cavity includes integrated main body and integrated cover body.The integrated cover body is detachably sealed and connected the top surface of integrated main body.The integrated main body has closed bottom surface and side surface, and open top surface, and is separated into first transmission sub-cavity, second transmission sub-cavity and buffer sub-cavity.The first end of the first transmission sub-cavity is equipped with first interface, for connecting load lock chamber, and its second end is connected the first end of buffer sub-cavity via slit valve.The second end of the buffer sub-cavity is connected the first end of second transmission sub-cavity.At least one third end of the first transmission sub-cavity and at least one second end of the second transmission sub-cavity are equipped with multiple second interfaces, for connecting multiple process cavities.
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