A heat dissipation packaging device for a semiconductor chip

Abstract

The utility model relates to chip processing technical field, specifically disclose a semiconductor chip's heat dissipation packaging device, include: packaging device body, the packaging device body workstation top fixed setting has the mounting seat, the mounting seat top fixed setting has the mounting block, the mounting block top is opened and has the mounting groove, the mounting groove inboard wall fixed setting has the mounting panel, the mounting panel outboard wall penetrates and rotates and sets up the rotating block, the utility model discloses through the setting use of heat dissipation subassembly, the air blower blows the cold wind directly to the grinding area through the inclined air blowing pipe, takes away the heat instantaneously, prevents wafer warping and crack, blows the grinding dust away from wafer simultaneously, falls into the annular frame, collects and then pulls out the cleaning one time, avoids secondary scratch, and the adsorption fixing assembly forms the negative pressure and fixes wafer on the support plate, through the rotation component of gear engagement, the support plate drives wafer to rotate to the even heat dissipation of wafer surface, improves the heat dissipation effect.

Description

Technical Field

[0001] This utility model belongs to the field of chip processing technology, and specifically relates to a heat dissipation packaging device for semiconductor chips. Background Technology

[0002] Semiconductor chips are miniaturized circuits based on semiconductor materials such as silicon and gallium arsenide. Through processes such as photolithography, etching, and ion implantation, hundreds of millions of transistors, capacitors, resistors, and their interconnections are fabricated on a wafer to realize functions such as computing, storage, and signal processing. Chip packaging is a complete process of cutting the bare chip and placing it in a ceramic, plastic, or metal shell, leading out electrodes, and protecting it from mechanical, moisture, electromagnetic, and thermal shocks. Its role and significance are to ensure the electrical performance, thermal performance, and reliability of the chip, while also giving the chip an interface that is easy to solder, test, transport in batches, and assemble into a system.

[0003] The chip packaging process includes wafer thinning, wafer dicing, chip bonding, wire bonding or flip-chip bonding, plastic or ceramic encapsulation, laser marking, lead trimming, final testing and tape packaging.

[0004] Wafer thinning machines are used in the chip packaging process to grind and thin the back of the wafer. Existing wafer thinning machines generate heat during the grinding process. This heat can cause localized thermal expansion of the wafer, leading to uneven thickness, warping, and even cracks. At the same time, high temperatures can exacerbate mechanical stress, inducing lattice damage, microcracks, and subsequent delamination failures, reducing chip yield and reliability. Existing wafer thinning machines dissipate heat through temperature control of the wafer stage or liquid cooling of the spindle and grinding wheel. However, this method is not convenient for removing the debris generated during wafer grinding from the wafer while simultaneously dissipating heat, affecting usability. Utility Model Content

[0005] The purpose of this invention is to provide a heat dissipation packaging device for semiconductor chips to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, this utility model provides the following technical solution:

[0007] A heat dissipation packaging device for a semiconductor chip includes: a packaging device body, a mounting base fixedly disposed on the top of the worktable of the packaging device body, a mounting block fixedly disposed on the top of the mounting base, a mounting groove opened on the top of the mounting block, a mounting plate fixedly disposed on the inner side wall of the mounting groove, a rotating block rotatably disposed through the outer side wall of the mounting plate, an adsorption fixing component disposed on the top of the rotating block, and a vertical plate fixedly disposed on the top of the mounting base, with a heat dissipation mechanism disposed on the vertical plate.

[0008] The heat dissipation assembly includes a mounting box fixedly installed on the outer wall of the vertical plate. The mounting box is located above the vertical plate. Multiple air blowing pipes are fixedly installed on the outer wall of the mounting box. One end of the air outlet of the air blowing pipe is inclined downward. An air inlet assembly is provided on the mounting box.

[0009] Preferably, the air inlet assembly includes a blower fixedly installed on the top of the mounting base, an air inlet pipe fixedly installed at the air outlet of the blower, the air outlet end of the air inlet pipe fixedly installed at the bottom of the mounting box, and a collection assembly provided in the mounting groove.

[0010] Preferably, the collecting component includes a stop block fixedly disposed at the bottom of the mounting groove. The stop block is frustum-shaped, hollow at its center, and inclined at its outer side.

[0011] Preferably, the inner sidewall of the mounting groove is provided with an annular groove, and an annular frame is provided in the annular groove. The inner radius of the annular frame is connected to the radius of the bottom of the stop block, and two symmetrically arranged pull blocks are fixedly provided on the outer sidewall of the annular frame.

[0012] Preferably, the adsorption and fixing assembly includes a vacuum groove starting at the top of the rotating block, a support plate fixedly disposed on the top of the rotating block, a plurality of exhaust holes being opened at the center of the support plate, a sealing assembly being disposed between the rotating block and the support plate, an exhaust pipe being passed through and fixedly disposed on the mounting block, a vacuum pump being connected to the end of the exhaust pipe, the vacuum pump being fixedly disposed on the top of the mounting base, the top of the exhaust pipe being rotatably connected to the bottom of the rotating block, an opening being opened at the bottom of the vacuum groove, the exhaust pipe and the vacuum groove being connected through the opening, and a rotating assembly being disposed on the mounting plate.

[0013] Preferably, the sealing assembly includes an annular block fixedly disposed at the bottom of the support plate, the shape of the annular block being adapted to the vacuum groove, a sealing ring being fixedly connected to the outer wall of the annular block, and the outer wall of the sealing ring and the inner wall of the vacuum groove being in tight contact.

[0014] Preferably, the rotating assembly includes a motor fixedly mounted on the outer wall of the mounting plate, a first gear fixedly sleeved on the outer wall of the rotating block, a rotating shaft rotatably mounted at the output end of the motor, a second gear fixedly mounted on the top of the rotating shaft, and the second gear and the first gear meshing with each other.

[0015] Compared with the prior art, the beneficial effects of this utility model are:

[0016] By utilizing the heat dissipation components, the blower directs cool air through the inclined air duct directly to the grinding area, instantly removing heat and preventing wafer warping and cracking. Simultaneously, it blows grinding debris away from the wafer, causing it to fall into the annular frame for collection and removal in one go, preventing secondary scratches. Furthermore, the adsorption and fixing components create negative pressure to secure the wafer to the support plate. Through a gear-engaged rotating component, the support plate rotates at low speed, causing the wafer to rotate as well. This facilitates uniform heat dissipation from the wafer surface by the heat dissipation mechanism, improving the overall heat dissipation effect. Attached Figure Description

[0017] Figure 1 This is one of the perspective views of this utility model;

[0018] Figure 2 This is a second perspective view of the present utility model;

[0019] Figure 3 This is a schematic diagram of the connection structure between the mounting base and the main body of the packaging device in this utility model;

[0020] Figure 4 This is a bottom view of the support plate in this utility model;

[0021] Figure 5 This is a schematic diagram of the rotating assembly in this utility model;

[0022] Figure 6 This is a schematic diagram of the structure of the collecting component in this utility model;

[0023] In the diagram: 1. Encapsulation device body; 2. Mounting base; 3. Mounting block; 4. Mounting plate; 5. Rotating block; 6. Vertical plate; 7. Mounting box; 8. Air blowing pipe; 9. Blower; 10. Air inlet pipe; 11. Support plate; 12. Exhaust pipe; 13. Vacuum pump; 14. Annular block; 15. Sealing ring; 16. First gear; 17. Motor; 18. Rotating shaft; 19. Second gear; 20. Stop block; 21. Annular frame; 22. Pull block. Detailed Implementation

[0024] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0025] Example 1:

[0026] Please see Figure 1 - Figure 6As shown, a heat dissipation packaging device for a semiconductor chip includes: a packaging device body 1, a mounting base 2 fixedly disposed on the top of the worktable of the packaging device body 1, a mounting block 3 fixedly disposed on the top of the mounting base 2, a mounting groove opened on the top of the mounting block 3, a mounting plate 4 fixedly disposed on the inner side wall of the mounting groove, a rotating block 5 rotatably disposed through the outer side wall of the mounting plate 4, an adsorption fixing component disposed on the top of the rotating block 5, and a vertical plate 6 fixedly disposed on the top of the mounting base 2, with a heat dissipation mechanism disposed on the vertical plate 6;

[0027] The heat dissipation assembly includes a mounting box 7 fixedly installed on the outer wall of the vertical plate 6. The mounting box 7 is located above the vertical plate 6. Multiple air blowing pipes 8 are fixedly installed on the outer wall of the mounting box 7. One end of the air outlet of the air blowing pipe 8 is inclined downward. An air inlet assembly is provided on the mounting box 7.

[0028] As can be seen from the above, the wafer is placed on the top of the support plate 11 and fixed by the adsorption fixing component. The wafer and the polishing disc on the packaging device body 1 are eccentrically set. The packaging device body 1 is a wafer thinning machine. The packaging device body 1 drives the polishing disc to move downward and contact the wafer. Then, the wafer is thinned and polished by rotating the polishing disc at high speed.

[0029] The rotating component drives the support plate 11 to rotate at a low speed, thereby causing the wafer to rotate. Since the wafer and the polishing disc are eccentrically positioned, the polished parts of the wafer will be continuously exposed during rotation. The air intake component delivers cold air to the mounting box 7, and then blows it onto the exposed wafer through the air blower 8. This facilitates the cooling of the polished parts of the wafer and also helps to blow away debris, preventing debris from remaining on the wafer surface and causing secondary scratches.

[0030] Specifically, regarding the aforementioned air intake assembly, the air intake assembly includes a blower 9 fixedly installed on the top of the mounting base 2, an air intake pipe 10 fixedly installed at the air outlet of the blower 9, the air outlet end of the air intake pipe 10 fixedly installed at the bottom of the mounting box 7, and a collection component is provided in the mounting groove.

[0031] The collection component includes a stop block 20 fixedly installed at the bottom of the mounting groove. The stop block 20 is frustoconical in shape, hollow at the center, and inclined at the outer side.

[0032] An annular groove is provided on the inner side wall of the mounting slot, and an annular frame 21 is provided in the annular groove. The inner radius of the annular frame 21 is connected to the radius of the bottom of the stop block 20. Two symmetrically arranged pull blocks 22 are fixedly provided on the outer side wall of the annular frame 21.

[0033] As can be seen from the above, the wafer is placed eccentrically on the support plate 11. The support plate 11 is firmly adsorbed by the negative pressure generated by the vacuum pump 13 through the exhaust pipe 12, vacuum tank and exhaust hole, ensuring that the wafer will not slip during the thinning process. The transmission component drives the rotating block 5 to rotate slowly with the support plate 11, so that each area on the back of the wafer (the wafer is placed on the support plate 11 with the back side facing up) passes through the polishing disc in sequence, avoiding local overheating.

[0034] The high-pressure cold air generated by the blower 9 is blown directly onto the back of the wafer being polished through the air inlet pipe 10, the mounting box 7, and the inclined air blowing pipe 8. It instantly removes the grinding heat and blows the debris away from the back of the wafer. The debris is collected by the annular frame 21 and blocked by the baffle 20 to prevent the debris from entering the center of the mounting slot and becoming difficult to clean. The debris is pulled out and cleaned in one go with the annular frame 21 to avoid secondary scratches.

[0035] Example 2:

[0036] Specifically, regarding the aforementioned adsorption and fixation components, refer to... Figure 2 , Figure 4 , Figure 5 and Figure 6 As shown, the adsorption and fixing assembly includes a vacuum groove starting at the top of the rotating block 5. A support plate 11 is fixedly installed on the top of the rotating block 5. Multiple exhaust holes are opened at the center of the support plate 11. A sealing assembly is provided between the rotating block 5 and the support plate 11. An exhaust pipe 12 is installed through and fixedly installed on the mounting block 3. A vacuum pump 13 is connected to the end of the exhaust pipe 12. The vacuum pump 13 is fixedly installed on the top of the mounting base 2. The top of the exhaust pipe 12 is rotatably connected to the bottom of the rotating block 5. An opening is opened at the bottom of the vacuum groove. The exhaust pipe 12 and the vacuum groove are connected through the opening. A rotating assembly is provided on the mounting plate 4.

[0037] The sealing assembly includes an annular block 14 fixedly disposed at the bottom of the support plate 11. The shape of the annular block 14 is adapted to the vacuum groove. A sealing ring 15 is fixedly connected to the outer wall of the annular block 14. The outer wall of the sealing ring 15 and the inner wall of the vacuum groove are in tight contact.

[0038] The rotating assembly includes a motor 17 fixedly mounted on the outer wall of the mounting plate 4, a first gear 16 fixedly sleeved on the outer wall of the rotating block 5, a rotating shaft 18 rotatably mounted at the output end of the motor 17, a second gear 19 fixedly mounted on the top of the rotating shaft 18, and the second gear 19 and the first gear 16 meshing with each other.

[0039] As can be seen from the above, the vacuum pump 13 continuously draws air through the exhaust pipe 12, the inlet and the vacuum tank, forming a uniform negative pressure on the surface of the support plate 11, and the wafer is stably adsorbed. The annular block 14 and the sealing ring 15 form a seal to prevent vacuum leakage. The motor 17 drives the rotating shaft 18 to rotate, and through the second gear 19 meshing with the first gear 16, it drives the rotating block 5 and the support plate 11 to rotate at a low speed, so that the polished part on the back of the wafer can be continuously exposed for heat dissipation and cleaning of debris.

[0040] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A heat dissipation packaging device for a semiconductor chip, characterized in that, include: The packaging device body (1) has a mounting base (2) fixedly installed on the top of the workbench of the packaging device body (1), a mounting block (3) fixedly installed on the top of the mounting base (2), a mounting groove is opened on the top of the mounting block (3), a mounting plate (4) is fixedly installed on the inner side wall of the mounting groove, a rotating block (5) is rotatably installed through the outer side wall of the mounting plate (4), an adsorption fixing component is provided on the top of the rotating block (5), a vertical plate (6) is fixedly installed on the top of the mounting base (2), and a heat dissipation mechanism is provided on the vertical plate (6); The heat dissipation assembly includes a mounting box (7) fixedly mounted on the outer wall of the vertical plate (6). The mounting box (7) is located above the vertical plate (6). Multiple air blowing pipes (8) are fixedly mounted on the outer wall of the mounting box (7). One end of the air outlet of the air blowing pipe (8) is inclined downward. An air inlet assembly is provided on the mounting box (7).

2. The heat dissipation packaging device for a semiconductor chip according to claim 1, characterized in that: The air intake assembly includes a blower (9) fixedly installed on the top of the mounting base (2), an air intake pipe (10) fixedly installed at the air outlet of the blower (9), the air outlet end of the air intake pipe (10) fixedly installed at the bottom of the mounting box (7), and a collection assembly is provided in the mounting groove.

3. The heat dissipation packaging device for a semiconductor chip according to claim 2, characterized in that: The collecting component includes a stop block (20) fixedly installed at the bottom of the mounting groove. The stop block (20) is frustum shaped, hollow at the center, and inclined at the outer side.

4. The heat dissipation packaging device for a semiconductor chip according to claim 3, characterized in that: The inner sidewall of the mounting groove is provided with an annular groove, and an annular frame (21) is provided in the annular groove. The inner radius of the annular frame (21) is connected to the radius of the bottom of the stop block (20). Two symmetrically arranged pull blocks (22) are fixedly provided on the outer sidewall of the annular frame (21).

5. The heat dissipation packaging device for a semiconductor chip according to claim 1, characterized in that: The adsorption and fixing assembly includes a vacuum groove starting at the top of the rotating block (5), a support plate (11) fixedly installed on the top of the rotating block (5), a plurality of exhaust holes being opened at the center of the support plate (11), a sealing assembly being provided between the rotating block (5) and the support plate (11), an exhaust pipe (12) being installed through and fixedly installed on the mounting block (3), a vacuum pump (13) being connected to the end of the exhaust pipe (12), the vacuum pump (13) being fixedly installed on the top of the mounting base (2), the top of the exhaust pipe (12) being rotatably connected to the bottom of the rotating block (5), an opening being opened at the bottom of the vacuum groove, the exhaust pipe (12) and the vacuum groove being connected through the opening, and a rotating assembly being provided on the mounting plate (4).

6. The heat dissipation packaging device for a semiconductor chip according to claim 5, characterized in that: The sealing assembly includes an annular block (14) fixedly disposed at the bottom of the support plate (11). The shape of the annular block (14) is adapted to the vacuum groove. A sealing ring (15) is fixedly connected to the outer wall of the annular block (14). The outer wall of the sealing ring (15) and the inner wall of the vacuum groove are in tight contact.

7. The heat dissipation packaging device for a semiconductor chip according to claim 5, characterized in that: The rotating assembly includes a motor (17) fixedly mounted on the outer wall of the mounting plate (4), a first gear (16) fixedly sleeved on the outer wall of the rotating block (5), a rotating shaft (18) rotatably mounted at the output end of the motor (17), a second gear (19) fixedly mounted on the top of the rotating shaft (18), and the second gear (19) and the first gear (16) meshing with each other.

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