Batch dicing apparatus for chip production
CN224698240UActive Publication Date: 2026-08-28CHONGQING HANA ELECTRONICS CO LTD
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Patent Information
- Application Number
- CN202521903174.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-09-04
- Publication Date
- 2026-08-28
- Estimated Expiration
- 2035-09-04
AI Technical Summary
Technical Problem
[0003]目前的芯片切料装置大多自动化和智能化程度较低,需要大量的人工操作和干预
Benefits of technology
该用于芯片生产的批量切料装置,通过驱动活动板在滑板上移动,带动两个夹持组件同步滑动,其中一个夹持组件精准定位芯片定位槽上的芯片阵列,将其稳固夹取并平稳转移至放置槽内;切料组件将芯片阵列切割使多个芯片和治具分离,另一夹持组件启动治具进行夹取。随后,磁块精准吸附已分离的多个芯片,并通过活动板移动将多个芯片移动至传输组件上,本装置通过高度集成的自动化与智能化设计,大幅减少人工操作环节,显著降低人为干预风险,从而全面提升产品品质和生产效能。
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Figure CN224698240U_ABST
Abstract
The utility model relates to a kind of batch cutting device for chip production, including workbench, workbench top is provided with cutting platform, the top surface of workbench opposite two sides of cutting platform is respectively provided with chip positioning slot and transmission assembly, workbench top is also provided with slide, slide extends along the length direction of workbench, slide is slidably matched with movable plate, movable plate relative top relative two sides are evenly provided with clamping assembly.The technical scheme, by driving movable plate to move on slide, drive two clamping assemblies to slide synchronously, one of clamping assemblies is placed in the placement slot by clamping the chip array on chip positioning slot, another clamping assembly cooperates with magnetic block and is clamped after cutting respectively with multiple chips, and multiple chips are moved to transmission assembly by movable plate movement, the device is designed by high integration of automation and intelligence, substantially reduces manual operation link, significantly reduces human intervention risk, to comprehensively improve product quality and production efficiency.
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