Dual alignment bonding apparatus
CN224698249UActive Publication Date: 2026-08-28SABERS CO LTD
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Patent Information
- Application Number
- CN202522078856.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-09-26
- Publication Date
- 2026-08-28
- Estimated Expiration
- 2035-09-26
AI Technical Summary
Technical Problem
[0003]晶圆对准通常有红外对准和片间同轴对准两种方式，红外对准需采用红外光穿透晶圆进而成像并检测偏差，片间同轴对准则是在两个晶圆之间插入光学镜头进而成像并检测偏差，红外对准相比片间同轴对准精度更高，但红外对准会受限于晶圆厚度
Benefits of technology
[0020]本实用新型提供一种双对准键合设备，该双对准键合设备包括主体、红外对准系统和片间同轴对准系统，主体上设有间距可调的两个压头，两个压头彼此靠近的一侧平行且用于吸附晶圆；红外对准系统包括连接于主体的红外对准模块，红外对准模块位于其中一个压头远离另一压头的一侧，用于沿垂直于晶圆的方向发射红外光并采集图像；片间同轴对准系统包括移动平台和片间同轴模块，片间同轴模块通过移动平台连接于主体，移动平台用于驱动片间同轴模块平移，使片间同轴模块至少部分插入两个晶圆之间并采集图像。在双对准键合设备的主体上设置两个压头，压头彼此靠近的一侧平行用于吸附晶圆，两个压头间距可调进而使得两个压头所吸附的晶圆之间距离可调；在主体上设置红外对准模块，红外对准模块位于其中一个压头远离另一压头的一侧，使红外对准模块能沿垂直于晶圆的方向发射红外光并采集图像，实现红外对准；将片间同轴模块通过移动平台连接于主体，调整两个压头之间距离，由移动平台驱动片间同轴模块平移，使片间同轴模块至少部分能插入两个晶圆之间并采集图像，实现片间同轴对准；该双对准键合设备同时搭载了红外对准系统和片间同轴对准系统，能够根据实际需要选择红外对准或片间同轴对准方式进行检测，满足更全面的键合需求。
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Abstract
The utility model belongs to wafer bonding technical field discloses a kind of double alignment bonding equipment.The double alignment bonding equipment includes main body, infrared alignment system and inter wafer coaxial alignment system, two pressure heads are arranged on main body, the side of pressure head each other close parallel is used to adsorb wafer, the distance between two wafers is adjustable by the adjustable distance between two pressure heads;Infrared alignment module is arranged on main body, infrared alignment module can emit infrared light and gather image along the direction perpendicular to wafer, realize infrared alignment;Inter wafer coaxial module is connected to main body by moving platform, the distance between two pressure heads is adjusted, inter wafer coaxial module is translated by moving platform drive, so that inter wafer coaxial module can be inserted between two wafers at least part and gather image, realize inter wafer coaxial alignment;The double alignment bonding equipment is equipped with infrared alignment system and inter wafer coaxial alignment system simultaneously, satisfy more comprehensive bonding demand.
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