Chip laser transfer device
CN224698250UActive Publication Date: 2026-08-28陈弥彰
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Patent Information
- Application Number
- CN202522088307.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-09-28
- Publication Date
- 2026-08-28
- Estimated Expiration
- 2035-09-28
AI Technical Summary
Technical Problem
[0003]然而，随着芯片的尺寸微缩化和集成度的提高，对高密度或不均匀排列的多个芯片进行转移时，现有芯片转移装置在定位与对准环节，由于机械运动平台的累积误差和振动等因素，影响装置的定位精度、稳定性以及一致性，从而产生组件错位、转移失误或加工偏差的问题，影响量产效率与产品质量
Benefits of technology
[0022]本实用新型的积极进步效果在于：
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure CN224698250U_ABST
Abstract
The utility model provides a kind of chip laser transfer device, it is used to transfer chip on source substrate to target substrate, chip laser transfer device includes base, fixed frame of fixed connection on base, and the upper platform of transmission connection with fixed frame, and upper platform can be moved along Z direction perpendicular to source substrate relative to fixed frame;Upper platform is equipped with the light outlet of laser processing system;Chip laser transfer device further includes laser ranging mechanism and moving mechanism, and laser ranging mechanism is used to measure the interval of source substrate and target substrate, and the ranging probe of laser ranging mechanism is connected to upper platform by moving mechanism, and moving mechanism is used to realize ranging probe to move in the plane perpendicular to Z direction, to make ranging probe selectively move into or move out the area corresponding with light outlet, without moving upper platform, the interval measurement between source substrate and target substrate is realized, to improve overall processing accuracy, stability and consistency.
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