Semiconductor device
CN224698251UActive Publication Date: 2026-08-28SEMICON TECH INNOVATION CENT(BEIJING) CORP
View PDF 0 Cites 0 Cited by
Patent Information
- Application Number
- CN202522107226.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-09-29
- Publication Date
- 2026-08-28
- Estimated Expiration
- 2035-09-29
AI Technical Summary
Technical Problem
然而，晶圆在加工过程中产生的一些副产物(例如，聚合物、水汽等)会附着在晶圆表面，并在传输通道中逐渐积累，从而对晶圆造成污染
Benefits of technology
[0024]本实用新型实施例提供一种半导体设备，包括：真空传输腔室，用于在真空环境下传输晶圆；至少一个反应腔室，用于对来自所述真空传输腔室的所述晶圆进行工艺处理；传输通道，设置在所述真空传输腔室与反应腔室之间，用于供所述晶圆在所述真空传输腔室与所述反应腔室之间进行传输；至少一个喷嘴，设置在所述传输通道上且与所述传输通道相连通，所述喷嘴用于向所述传输通道内喷气以引入清洁气体；本实施例中，由于在传输通道上设置有喷嘴，且喷嘴与传输通道相连通，便于半导体设备通过喷嘴向传输通道内喷入清洁气体，从而对传输通道的内壁进行清理，进而降低副产物(例如，聚合物、水汽等)在传输通道中大量聚集的概率。
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure CN224698251U_ABST
Abstract
A semiconductor device includes a vacuum transfer chamber for transferring a wafer in a vacuum environment, at least one reaction chamber for processing the wafer from the vacuum transfer chamber, a transfer passage arranged between the vacuum transfer chamber and the reaction chamber for transferring the wafer between the vacuum transfer chamber and the reaction chamber, and at least one nozzle arranged on the transfer passage and in communication with the transfer passage, the nozzle being configured to spray gas into the transfer passage to introduce a cleaning gas. In this embodiment, since the nozzle is arranged on the transfer passage and in communication with the transfer passage, the semiconductor device can spray the cleaning gas into the transfer passage through the nozzle, so as to clean the inner wall of the transfer passage, thereby reducing the probability of the large accumulation of by-products (e.g., polymers, water vapor, etc.) in the transfer passage.
Need to check novelty before this filing date? Find Prior Art