Wafer backside cleaning and detection integrated mechanism

Abstract

The utility model discloses a wafer backside cleaning detection integrated mechanism, including installation bottom plate, the vacuum platform for placing the wafer is equipped with in the installation bottom plate middle part, the one side of installation bottom plate is equipped with the first electric jar, the movable end of first electric jar is installed through the support and is equipped with the blowing dust collection mechanism, the blowing dust collection mechanism includes the air knife and dust collection knife, and the air knife and dust collection knife are driven from above reciprocatingly to sweep the wafer surface through the first electric jar to blow and suck the impurity of wafer surface, the other side of installation bottom plate is equipped with XYZ three axial displacement components through the support, is equipped with visual detection mechanism on XYZ three axial displacement components, and visual detection mechanism is moved and is adjusted along Y axle, X axle and Z axle respectively through XYZ three axial displacement components, to carry out all -round photographing detection to wafer surface, the utility model discloses, has the characteristics of non -contact cleaning and real -time monitoring cleaning effect.

Images