Wafer cleaning device with self-cleaning
CN224698258UActive Publication Date: 2026-08-28SJ SEMICONDUCTOR (JIANGYIN) CORP
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Patent Information
- Application Number
- CN202522226774.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-10-22
- Publication Date
- 2026-08-28
- Estimated Expiration
- 2035-10-22
AI Technical Summary
Technical Problem
[0004]鉴于以上所述现有技术的缺点，本实用新型的目的在于提供一种具有自清洁的晶圆清洗装置，用于解决现有技术中因晶圆脱落导致晶渣附着于清洗刷而造成后续晶圆表面划伤的问题
Benefits of technology
[0018]通过在清洗刷下方增加清洗刷清洁模块，清洗刷清洁模块包括动力机构、移动杆及喷嘴；动力机构与移动杆连接，喷嘴与移动杆连接，喷嘴出水口面向于清洗刷。晶圆清洗完成取走后，动力机构驱动移动杆在清洗刷延伸方向往返运动，从而带动喷嘴往返运动，同时喷嘴喷高压水冲洗清洗刷表面，有效防止因晶圆脱落后产生的晶渣附着清洗刷表面而造成后续晶圆划伤，减少人工维护，从而提高的生产效率。
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Smart Images
Figure CN224698258U_ABST
Abstract
The utility model provides a kind of wafer cleaning device with self-cleaning, including wafer cleaning module and cleaning brush cleaning module;The wafer cleaning module includes cleaning brush;The cleaning brush cleaning module includes power mechanism, moving rod and nozzle;The power mechanism is connected with the moving rod, the nozzle is connected with the moving rod, and the nozzle water outlet faces the cleaning brush.The power mechanism drives the moving rod to reciprocate in the extension direction of the cleaning brush after wafer cleaning is completed and removed, thereby driving the nozzle reciprocation, while the nozzle sprays high-pressure water to wash the surface of cleaning brush, effectively prevents the subsequent wafer scratch caused by the attachment of slag on the surface of cleaning brush after wafer falls off, reduces manual maintenance, thereby improves production efficiency.
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