Wafer carrier device
CN224698261UActive Publication Date: 2026-08-28CHONGQING XINHUI MATERIALS TECHNOLOGY CO LTD
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Patent Information
- Application Number
- CN202521895252.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-09-03
- Publication Date
- 2026-08-28
- Estimated Expiration
- 2035-09-03
AI Technical Summary
Benefits of technology
[0016]本实用新型实施例提供了一种晶圆承载装置。该晶圆承载装置包括由多个支撑单元构成的阵列结构。这些支撑单元沿预设方向间隔布置，相邻支撑单元之间限定出多个用于容纳晶圆的容纳空间。每个支撑单元均设有多个沿竖向方向分布的支撑区域，且各支撑区域在水平方向上具有不同的延伸尺寸。通过在同一支撑单元内引入多个在竖向和横向方向上均呈差异化分布的支撑区域，该结构能够根据晶圆尺寸的不同，使其自动匹配至适当的支撑高度和支撑宽度，实现对不同尺寸晶圆的稳定承托。因此，该晶圆承载装置从根本上克服了传统晶圆承载装置结构单一、尺寸适配范围有限的问题，在无需更换夹具的情况下即可兼容多种规格晶圆，显著提升了晶圆承载装置的通用性、柔性化水平以及整体生产效率。
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Abstract
The utility model discloses an embodiment provides a kind of wafer bearing device, the wafer bearing device includes multiple support units, the multiple support units are spaced apart from each other, to define the containing space between two adjacent support units, wherein, each support unit has the first support area and the second support area for supporting wafer contained in the containing space, the second support area is above the first support area in vertical direction, and the extension range of the second support area in horizontal direction is greater than the extension range of the first support area in horizontal direction.The wafer bearing device is improved in size adaptability, structural stability and multi-product compatibility.
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