Centering buffer device for multi-size wafers
CN224698285UActive Publication Date: 2026-08-28BEIJING REJE AUTOMATION
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Patent Information
- Application Number
- CN202522112786.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-09-30
- Publication Date
- 2026-08-28
- Estimated Expiration
- 2035-09-30
AI Technical Summary
Technical Problem
目前常见的晶圆对中装置，采用两侧夹持的方式进行晶圆的对中，晶圆校准精度低，影响后续操作的准确性，且难以实现多片晶圆的同时对中操作，存在晶圆对中校准精度和效率低下的问题
Benefits of technology
[0029]本实用新型提供的用于多尺寸晶圆的对中缓存装置，用于晶圆生产过程中多尺寸晶圆传片过程中的对中缓存，采用由中心圆盘和连杆组成的曲柄机构与对中机构连接，通过中心圆盘转动实现对中机构的动作，具有结构简单、操作方便的优点；对中机构设置为至少三组，利用三点定圆原理实现支架上晶圆的对中校正，具有良好的定位精度；不同尺寸的晶圆通过第一、第二尺寸晶圆支架设置在中心圆盘上方，大大降低了晶圆对中缓存装置占用的体积大小，可满足设备小型化、轻量化要求，具有良好的应用前景。
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Abstract
The utility model relates to a kind of centering buffer device for multiple size wafers, including base, further include: crank mechanism, set on base, crank mechanism includes center disc and multiple connecting rods, the hinged end of connecting rod with center disc, the center disc connecting end of multiple connecting rods is on the same circumference;Driving mechanism is connected with center disc, for driving center disc rotation;Wafer support, oppositely set on the both sides of center disc, including support riser and support plate, for supporting first size wafer and second size wafer and setting in the upper of center disc;At least three groups of centering mechanism, one end of centering mechanism is connected with connecting rod, suitable for rotating with center disc, so that centering mechanism is along center disc radial and approaches or is far from center disc.The utility model has the characteristics of high centering accuracy and simple structure, meets the requirements of equipment miniaturization and light weight.
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