A three-chip package assembly

Abstract

A three-chip packaging assembly, characterized in that: comprising, the utility model discloses a three-chip packaging assembly, and the arch bridge type support is arranged on the packaging base, the first chip lower surface is attached to the arch bridge type support through the first adhesive layer, one end of the cantilever beam type interconnection support is fixed to the upper surface of the first chip through the second adhesive layer, and the other end extends laterally and is suspended on one side of the arch bridge type support, the upper surface of the second chip is attached to the lower surface of the other end of the cantilever beam type interconnection support, and the lower surface of the third chip is attached to the upper surface of the second chip. The three-chip packaging structure adopts the innovative arch bridge type support to bear the first chip, and is suspendedly connected with the second chip through the cantilever beam interconnection support integrated with the re-distribution layer, and the third chip is stacked on the second chip, and stress buffer material is filled in the key interface and is integrally molded in the top to dissipate heat.

Description

Technical Field

[0001] This utility model relates to the technical field of packaging components, and in particular to a three-chip packaging component. Background Technology

[0002] With the rapid development of integrated circuit technology, semiconductor devices are evolving towards higher performance, smaller size, higher integration, and lower power consumption. In particular, the explosive growth in fields such as artificial intelligence, 5G communication, and high-performance computing has placed extreme demands on processor computing power and data throughput. To achieve stronger functionality within limited physical space, multi-chip packaging technologies, such as 2.5D / 3D packaging, chip-on-chip stacking, and system-in-package (SiP), have become key paths for industry development.

[0003] In existing multi-chip stacking packaging technologies, the heat generated by high-power main chips is difficult to effectively dissipate using traditional molding compounds. Adding a separate metal heatsink increases process complexity, cost, and interface thermal resistance, and may lead to excessive package size. Vertical interconnects are highly complex; when integrating chips with different functions in three dimensions, traditional wire bonding methods face problems such as wire-arc interference and poor parasitic parameters, while technologies like through-silicon vias are prohibitively expensive. Thermomechanical stress management is a major challenge. The mismatch in thermal expansion coefficients of different materials under varying temperatures can generate significant stress at the chip and interconnect points, easily leading to chip cracking or interface delamination, severely impacting package reliability. Utility Model Content

[0004] In view of the problems existing in the above-mentioned three-chip packaging components, this utility model is proposed.

[0005] Therefore, the purpose of this utility model is to provide a three-chip packaging component, which is to provide a three-chip packaging component designed with an arch bridge support and a cantilever beam interconnect bracket.

[0006] To solve the above-mentioned technical problems, this utility model provides the following technical solution: It includes an encapsulation shell, which comprises an encapsulation base and encapsulation sidewalls, wherein an arch-bridge type support is disposed on the encapsulation base; and...

[0007] The lower surface of the first chip is attached to the arch-shaped support body through a first adhesive layer;

[0008] A cantilever beam interconnect bracket, one end of which is fixed to the upper surface of the first chip by a second adhesive layer, and the other end of which extends laterally and is suspended on one side of the arch bridge support.

[0009] The second chip has its upper surface attached to the lower surface of the other end of the cantilever beam interconnect bracket;

[0010] The lower surface of the third chip is attached to the upper surface of the second chip.

[0011] As a preferred embodiment of the three-chip packaging assembly of this utility model, the arch bridge support includes a support platform and an arched sidewall, and there is a cavity between the support platform and the packaging base.

[0012] As a preferred embodiment of the three-chip packaging component of this utility model, the arch bridge support is a frame structure with arched ridges formed by stamping or etching of metal material.

[0013] As a preferred embodiment of the three-chip packaging assembly of this utility model, the cantilever beam interconnect bracket has an integrated redistribution layer inside and a surface provided with pads for wire bonding.

[0014] In a preferred embodiment of the three-chip packaging assembly of this utility model, a stress buffer bridge is disposed above the packaging base, and the upper part of the stress buffer bridge abuts against the third chip.

[0015] In a preferred embodiment of the three-chip packaging assembly of this utility model, the stress buffer bridge is made of an elastic compressible material.

[0016] As a preferred embodiment of the three-chip packaging assembly of this utility model, the stress buffer bridge is made of silicone gel or flexible epoxy resin and is formed by dispensing process.

[0017] As a preferred embodiment of the three-chip packaging assembly of this utility model, a protective cover is disposed above the packaging shell, and the protective cover is molded with an integrally formed heat dissipation tooth structure.

[0018] As a preferred embodiment of the three-chip packaging component of this utility model, the heat dissipation tooth structure is made of epoxy molding compound, and its fin structure is directly formed in the packaging molding process.

[0019] As a preferred embodiment of the three-chip packaging component of this utility model, the first adhesive layer is sintered silver paste or high thermal conductivity insulating adhesive, and the second adhesive layer is sintered silver paste or anisotropic conductive adhesive.

[0020] The beneficial effects of this invention are as follows: The three-chip packaging assembly provided by this invention utilizes the synergistic design of its arch-bridge support, cantilever beam interconnect bracket, stress buffer bridge, and integrated heat dissipation fins. Through the stacked structure of "arch-bridge lifting the first chip" and "cantilever beam suspending the second chip," the Z-axis space is fully utilized, efficiently stacking three chips within a standard package housing. The first chip is directly mounted to the support platform via a highly thermally conductive first adhesive layer. Heat can be rapidly conducted to the extensive package housing via the metal arch bridge and dissipated through the housing's pins and bottom. The cantilever beam's suspended design cleverly utilizes vertical space, avoiding interference with the bonding lines of the underlying chips. The second and third chips are isolated above the main heat source by the cantilever beam, preventing direct heat accumulation. Simultaneously, the integrated heat dissipation fins provide a large surface area, efficiently dissipating heat from the top through air convection and radiation. Attached Figure Description

[0021] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 A schematic diagram of the structure of Embodiment 1 is shown;

[0023] Figure 2 A schematic diagram of the structure of Embodiment 2 is shown;

[0024] Figure 3 A schematic diagram of the structure of Embodiment 3 is shown.

[0025] Reference numerals: 1. Encapsulation housing; 11. Encapsulation base; 12. Encapsulation sidewall; 2. Arch bridge support; 21. Support platform; 22. Arched sidewall; 3. First chip; 4. Cantilever beam interconnect bracket; 5. Second chip; 6. Third chip; 7. Stress buffer bridge; 8. Protective cover. Detailed Implementation

[0026] To enable those skilled in the art to better understand this utility model, the present utility model will be further described in detail below with reference to specific embodiments and accompanying drawings.

[0027] The terminology used in this invention refers to those general terms currently widely used in the art in consideration of the functionality of this invention; however, these terms may vary according to the intent, precedent, or new technology of those skilled in the art. Furthermore, specific terms may be chosen by the applicant, and in such cases, their detailed meanings will be described in the detailed description of this invention. Therefore, the terminology used in this specification should not be construed as simple names, but rather based on the meaning of the terms and the overall description of this invention.

[0028] Example 1, referring to Figure 1 This is the first embodiment of the present invention, providing a three-chip packaging assembly, including: a packaging shell 1, which includes a packaging base 11 and a packaging sidewall 12, with an arch-shaped support 2 disposed on the packaging base 11; a first chip 3, the lower surface of which is attached to the arch-shaped support 2 through a first adhesive layer; a cantilever beam interconnect bracket 4, one end of which is fixed to the upper surface of the first chip 3 through a second adhesive layer, and the other end of which extends laterally and is suspended on one side of the arch-shaped support 2; a second chip 5, the upper surface of which is attached to the lower surface of the other end of the cantilever beam interconnect bracket 4; and a third chip 6, the lower surface of which is attached to the upper surface of the second chip 5.

[0029] The upper surface of the packaging base 11 is provided with an arch-shaped support 2. The first chip 3 is usually the main computing chip, and its lower surface is firmly attached to the support platform 21 of the arch-shaped support 2 via a first adhesive layer. The cantilever beam interconnect bracket 4 is a thin rectangular plate, the length and width of which are designed according to the chip size. The length is usually greater than the side length of the first chip 3 so that the other end can be suspended. The fixed end of the cantilever beam interconnect bracket 4 is attached to the upper surface of the first chip 3 via a second adhesive layer, and the suspended end extends laterally, its projection completely exceeding the range of the support platform 21. The second chip 5 and the third chip 6 are usually a pair of stacked memory chips or coprocessor chips. The upper surface of the second chip 5 is attached to the lower surface of the suspended end of the cantilever beam interconnect bracket 4. The lower surface of the third chip 6 is directly stacked and attached to the upper surface of the second chip 5.

[0030] By combining vertical stacking and cantilever beam lateral extension, three chips are integrated within a limited package area, significantly improving package density and functional integration. The first chip 3, acting as the primary heat source, generates heat that can be directly conducted downwards to the package housing 1 and dissipated through the highly thermally conductive first adhesive layer and the arch-shaped support 2, resulting in a short and efficient heat dissipation path. The cantilever beam design separates the weight and thermal stress of the second and third chips to a certain extent from the first chip 3 and the arch structure, avoiding the direct superposition of complex multi-layer stacking stress on the main chip and improving reliability.

[0031] Furthermore, the arch bridge support 2 includes a support platform 21 and an arched sidewall 22, and there is a cavity between the support platform 21 and the encapsulation base 11.

[0032] The arch-shaped support 2 consists of a support platform 21 and arched sidewalls 22. The raised arch provides an optimal downward heat dissipation path for the first chip 3 mounted on it. Simultaneously, the space beneath the arch forms a natural airflow channel, facilitating air convection. The heat dissipation cavity provides a deformable space, allowing the arch-shaped support 2 to have slight deformation leeway during thermal expansion and contraction, absorbing some stress and protecting the chip. The area between the support platform 21 and the package base 11 is a cavity, which can be a continuous void or segmented. The arch-shaped support 2 provides ample downward arch space for the bonding wires extending from the upper surface of the first chip 3 to the package housing 1, avoiding the risk of the bonding wires interfering with other structures due to excessive height or breaking due to insufficient bending radius. Compared to a solid support block, the cavity structure reduces the overall package weight.

[0033] Furthermore, the arch bridge support 2 is a frame structure with arched ridges formed by stamping or etching of metal materials.

[0034] The arch-shaped support 2 is a one-piece metal frame with arched ridges, made of copper alloy or other metal materials, through stamping or etching processes. Stamping and etching are mature and cost-effective metal processing technologies suitable for mass production. These processes can produce structures with high dimensional accuracy and good consistency, ensuring high yield in packaging production. Metal materials themselves are excellent thermal conductors, perfectly matching their function as the primary heat dissipation path.

[0035] Furthermore, the cantilever beam interconnect bracket 4 has an integrated redistribution layer and surface pads for wire bonding.

[0036] The cantilever beam interconnect bracket 4 integrates a redistribution layer with metal pads on its surface. These pads can connect to the second chip 5 via microbumps, or be used for traditional wire bonding to interconnect with the package housing 1 or other chips. The redistribution layer can achieve a significantly higher wiring density than wire bonding, meeting the high-speed interconnect requirements of high-end memory chips or processors. Integrating interconnect and mechanical support functions into a single component simplifies package design and assembly processes. The redistribution layer allows for the free reallocation of I / O port positions, rearranging pads around the chip to areas more conducive to global routing.

[0037] Furthermore, the first adhesive layer is sintered silver paste or a high thermal conductivity insulating adhesive, and the second adhesive layer is sintered silver paste or anisotropic conductive adhesive.

[0038] The first adhesive layer is located between the first chip 3 and the arch-shaped support 2, and can be either sintered silver paste or a high thermal conductivity insulating adhesive. The second adhesive layer is located between the cantilever beam interconnect bracket and the first chip 3, and can be either sintered silver paste or anisotropic conductive adhesive. The most suitable materials are selected to meet the thermal, electrical, and mechanical requirements of different locations, achieving the optimal balance between heat dissipation, conductivity, and reliability. A variety of material options are provided, allowing designers to flexibly adjust according to specific cost budgets and performance targets. The selected materials have excellent aging characteristics, ensuring the stability and durability of the product during long-term use.

[0039] During use, an arch-shaped support 2 is set on the packaging base 11. The support platform 21 is connected to the lower surface of the first chip 3 through a first adhesive layer. The upper surface of the first chip 3 is attached to the lower surface of one end of the cantilever beam interconnect bracket 4 through a second adhesive layer. The cantilever interconnect bracket integrates a redistribution layer. The other end of the cantilever interconnect bracket is suspended on one side of the arch-shaped support 2. The lower surface of the other end of the cantilever interconnect bracket is attached to the second chip 5, and pads are provided on its surface to connect the second chip 5. The lower surface of the second chip 5 is attached to the third chip 6.

[0040] Example 2, refer to Figure 1 This is the second embodiment of the present invention. The difference between this embodiment and the first embodiment is that: the stress buffer bridge 7 is disposed above the packaging base 11, and the upper part of the stress buffer bridge 7 abuts against the third chip 6; the stress buffer bridge 7 is made of an elastic compressible material; the material of the stress buffer bridge 7 is silicone gel or flexible epoxy resin, which is formed by dispensing process.

[0041] A stress-relief bridge 7 is formed by filling the gap between the lower part of the third chip 6 and the upper part of the support platform 21. This structure is made of elastic compressible materials such as silicone gel or flexible epoxy resin, precisely filled and cured using a dispensing process. The towering chip stack provides additional lateral support, preventing the package from tilting or collapsing due to stress during subsequent molding processes or use. The elastic material effectively absorbs impact and vibration energy from the outside world, protecting fragile chips and interconnect points (such as microbumps) from damage. Different materials have different coefficients of thermal expansion, which generate shear stress during temperature cycling. The elastic buffer bridge absorbs and releases these stresses through deformation, greatly reducing the risk of chip cracking and interface delamination, and significantly improving package reliability.

[0042] The remaining structure is the same as that in Example 1.

[0043] During use, an arch-shaped support 2 is installed on the packaging base 11. A first adhesive layer is applied to the lower surface of the first chip 3 on the support platform 21. The upper surface of the first chip 3 is attached to the lower surface of one end of a cantilever interconnect bracket 4 via a second adhesive layer. A redistribution layer is integrated inside the cantilever interconnect bracket. The other end of the cantilever interconnect bracket is suspended above one side of the arch-shaped support 2. A second chip 5 is attached to the lower surface of the other end of the cantilever interconnect bracket, and pads are provided on its surface to connect to the second chip 5. A third chip 6 is attached to the lower surface of the second chip 5. A stress-relief bridge 7 is placed between the third chip 6 and the packaging base 11 to protect the chip.

[0044] Example 3, referring to Figure 1 This is the third embodiment of the present invention. The difference between this embodiment and the second embodiment is that: the protective cover 8 is disposed above the encapsulation shell 1, and the protective cover 8 is molded with an integrally formed heat dissipation tooth structure; the heat dissipation tooth structure is made of epoxy molding compound, and its fin structure is directly formed in the encapsulation molding process.

[0045] After all chip mounting and interconnection are completed, epoxy molding compound is used for encapsulation. During the molding process, a finned heat dissipation structure is integrally formed directly above the package shell 1 and the chip stack using a special mold. The heat dissipation structure greatly increases the heat dissipation surface area in contact with air, providing powerful heat dissipation capabilities without the need for additional metal heat sinks. This eliminates the steps of purchasing, installing, and bonding separate heat sinks, simplifying the supply chain and assembly process, and reducing overall costs. Since the molding compound and heat sink are integrally molded, there is no reliability risk of traditional bonded heat sinks detaching due to aging, and the interface thermal resistance is also lower.

[0046] The remaining structure is the same as that in Example 2.

[0047] During use, an arch-shaped support 2 is installed on the packaging base 11. A first adhesive layer is applied to the lower surface of the first chip 3 on the support platform 21. The upper surface of the first chip 3 is attached to the lower surface of one end of a cantilever interconnect bracket 4 via a second adhesive layer. A redistribution layer is integrated inside the cantilever interconnect bracket. The other end of the cantilever interconnect bracket is suspended above one side of the arch-shaped support 2. A second chip 5 is attached to the lower surface of the other end of the cantilever interconnect bracket, with pads on its surface connecting it to the second chip 5. A third chip 6 is attached to the lower surface of the second chip 5. A stress-relief bridge 7 is placed between the third chip 6 and the packaging base 11 to protect the chip. An integrally formed heat dissipation fin structure is provided above the packaging shell 1 to increase the heat dissipation effect of the packaging structure.

[0048] The three-chip packaging assembly provided by this utility model employs an innovative arch-bridge support 2 to support the first chip 3, and a second chip 5 is suspended and connected via a cantilever beam interconnect bracket integrating a redistribution layer. A third chip 6 is then stacked on top of the second chip 5. Stress-absorbing material is filled at key interfaces, and heat dissipation fins are integrally molded on top. In this structure, the first chip 3 is directly attached to the support platform 21 via a highly thermally conductive first adhesive layer. Heat can be rapidly conducted to the extensive packaging shell 1 via the metal arch bridge and dissipated through the shell's pins and bottom. The cantilever beam's suspended design cleverly utilizes vertical space, avoiding interference with the bonding lines of the underlying chips, and isolating the second and third chips above the main heat source, preventing direct heat accumulation. Simultaneously, the integrally molded heat dissipation fins provide a large surface area, efficiently dissipating top heat through air convection and radiation. Importantly, it should be noted that the construction and arrangement of this application shown in several different exemplary embodiments are merely illustrative. Although only a few embodiments are described in detail in this disclosure, those who consult this disclosure will readily understand that many modifications are possible (e.g., variations in the size, dimensions, structure, shape, and proportions of various elements, as well as parameter values ​​(e.g., temperature, pressure, etc.), installation arrangements, use of materials, color, orientation, etc.) without substantially departing from the novel teachings and advantages of the subject matter described in this application). For example, an element shown as integrally formed may be composed of multiple parts or elements, the position of elements may be inverted or otherwise altered, and the nature or number or position of discrete elements may be changed or altered. Therefore, all such modifications are intended to be included within the scope of this invention. The order or sequence of any process or method steps may be changed or rearranged according to alternative embodiments. In the claims, any "device plus function" clause is intended to cover the structure described herein that performs the function, and not only structurally equivalent but also equivalent in structure. Other substitutions, modifications, alterations, and omissions may be made in the design, operation, and arrangement of exemplary embodiments without departing from the scope of this invention. Therefore, this invention is not limited to the specific embodiments, but extends to various modifications that still fall within the scope of the appended claims.

[0049] Furthermore, in order to provide a concise description of exemplary embodiments, not all features of actual embodiments (i.e., those features that are not relevant to the best mode of carrying out the present invention as currently considered, or those features that are not relevant to the implementation of the present invention) may be omitted.

[0050] It should be noted that the above embodiments are only used to illustrate the technical solution of this utility model and are not intended to limit it. Although this utility model has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solution of this utility model without departing from the spirit and scope of the technical solution of this utility model, and all such modifications or substitutions should be covered within the scope of the claims of this utility model.

Claims

1. A three-chip packaged assembly, characterized in that: include, The encapsulation housing (1) includes an encapsulation base (11) and an encapsulation sidewall (12), wherein an arch-shaped support (2) is disposed on the encapsulation base (11); and, The lower surface of the first chip (3) is attached to the arch-shaped support (2) through the first adhesive layer; The cantilever beam interconnect bracket (4) has one end fixed to the upper surface of the first chip (3) by the second adhesive layer, and the other end extends laterally and is suspended on one side of the arch bridge support (2). The second chip (5) has its upper surface attached to the lower surface of the other end of the cantilever beam interconnect bracket (4); The lower surface of the third chip (6) is attached to the upper surface of the second chip (5).

2. The three-chip packaging assembly according to claim 1, characterized in that: The arch bridge support (2) includes a support platform (21) and an arched sidewall (22), and there is a cavity between the support platform (21) and the encapsulation base (11).

3. The three-chip packaging assembly according to claim 1 or 2, characterized in that: The arch bridge support (2) is a frame structure with arched ridges formed by stamping or etching of metal materials.

4. The three-chip packaging assembly according to claim 1, characterized in that: The cantilever beam interconnect bracket (4) has an integrated redistribution layer inside and pads for wire bonding on its surface.

5. The three-chip packaging assembly according to claim 1, characterized in that: A stress buffer bridge (7) is disposed above the package base (11), and the top of the stress buffer bridge (7) abuts against the third chip (6).

6. The three-chip packaging assembly according to claim 5, characterized in that: The stress buffer bridge (7) is made of an elastic compressible material.

7. The three-chip packaging assembly according to claim 6, characterized in that: The stress buffer bridge (7) is made of silicone gel or flexible epoxy resin and is formed by dispensing process.

8. The three-chip packaging assembly according to claim 1, characterized in that: A protective cover (8) is disposed above the encapsulation shell (1), and the protective cover (8) has an integrally molded heat dissipation tooth structure.

9. The three-chip packaging assembly according to claim 8, characterized in that: The heat dissipation tooth structure is made of epoxy molding compound, and its fin structure is directly formed in the encapsulation molding process.

10. The three-chip packaging assembly according to claim 1, characterized in that: The first adhesive layer is sintered silver paste or high thermal conductivity insulating adhesive, and the second adhesive layer is sintered silver paste or anisotropic conductive adhesive.

Images