A chip package structure

Abstract

The utility model discloses a chip packaging structure relates to chip heat dissipation structure field, including the heat dissipation plate body, the inside of heat dissipation plate body is provided with the heat dissipation cavity, and the inside of heat dissipation cavity is provided with multiple groups of connecting columns, the inside of heat dissipation cavity is provided with liquid, the heat dissipation plate body is VC even heat plate, and the top of heat dissipation plate body is provided with the mounting groove. The utility model discloses the mounting groove that sets up can install the chip in the one side of heat dissipation plate body to make the heat dissipation plate body to the chip heat dissipation, and the liquid in the heat dissipation cavity absorbs the heat that the chip produces to reach the purpose of heat dissipation, and the wiring groove can increase the contact area with the chip to make the heat dissipation effect of chip better, improve the efficiency of heat dissipation.

Description

Technical Field

[0001] This utility model relates to the field of chip heat dissipation structure, specifically a chip packaging structure. Background Technology

[0002] A chip, usually referring to an integrated circuit, is a miniaturized electronic device that integrates a large number of electronic components (such as transistors, resistors, capacitors, etc.) onto a tiny semiconductor material (usually silicon). Chips can perform specific computing tasks, control the operation of control systems, transmit signals, or process data. Chips are an indispensable core component of modern electronic devices. However, chips generate heat when they are working, so heat dissipation structures are needed to cool them.

[0003] Existing chip heat dissipation structures typically use copper plates to dissipate heat from the chip. The copper plate itself absorbs the heat generated by the chip and then dissipates the heat through its own operation. This heat dissipation method has low efficiency. Utility Model Content

[0004] Therefore, the purpose of this utility model is to provide a chip packaging structure to solve the technical problems mentioned in the background art.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a chip packaging structure, including a heat sink body, the heat sink body being attached to and covering the chip, the heat sink body having a heat dissipation cavity inside, and multiple sets of connecting posts being arranged inside the heat dissipation cavity, the heat dissipation cavity being filled with liquid, and the heat sink body being a VC heat dissipation plate.

[0006] By adopting the above technical solution, the chip can be easily installed on one side of the heat sink body through the set mounting slot, so that the heat sink body can dissipate heat from the chip, and the liquid inside the heat dissipation cavity absorbs the heat generated by the chip, thereby achieving the purpose of heat dissipation.

[0007] The present invention is further configured such that a mounting groove is provided on the top of the heat sink body, and a wiring groove is provided on the inner wall of the mounting groove.

[0008] Preferably, the chip can be easily installed through the mounting slot, and the wiring slot can be easily installed in the wiring slot on one side of the chip.

[0009] The present invention is further configured such that the material of the heat sink body is either copper or aluminum.

[0010] Preferably, the heat sink body is made of copper or aluminum, which has better heat absorption properties and can better dissipate heat from the chip.

[0011] The present invention is further configured such that the heat sink body is composed of an upper cover and a lower cover, and the upper cover and the lower cover are fixed by welding.

[0012] Preferably, after the upper and lower covers are welded together, a liquid inlet hole is reserved on one side of the heat sink body. Liquid is added into the heat sink cavity through the liquid inlet hole. When the liquid reaches a certain amount, the liquid inlet hole is welded and sealed.

[0013] In summary, the present invention has the following main advantages:

[0014] This utility model features an installation slot, a wiring slot, and a heat dissipation cavity. The installation slot allows the chip to be easily installed on one side of the heat sink body, enabling the heat sink body to dissipate heat from the chip. The liquid inside the heat dissipation cavity absorbs the heat generated by the chip, thereby achieving the purpose of heat dissipation. The wiring slot increases the contact area with the chip, resulting in better heat dissipation and improved heat dissipation efficiency. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the structure of this utility model;

[0016] Figure 2 This is a schematic diagram showing the connection between the upper and lower covers of this utility model;

[0017] Figure 3 This is a schematic diagram of the structure of the lower cover of this utility model.

[0018] Explanation of reference numerals in the attached figures:

[0019] 1. Heat sink body; 11. Top cover; 12. Bottom cover; 2. Mounting slot; 3. Wiring slot; 4. Heat dissipation cavity. Detailed Implementation

[0020] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0021] The embodiments of this utility model will be described below based on its overall structure.

[0022] Please see Figures 1-3The device includes a heat sink body 1, which is attached to and covers the chip. The heat sink body 1 has a heat dissipation cavity 4 inside, and multiple sets of connecting posts are provided inside the heat dissipation cavity 4. The two ends of the connecting posts are connected to the upper cover 11 and the lower cover 12 respectively. The heat sink body 1 is composed of the upper cover 11 and the lower cover 12, which are fixed by welding. After the upper cover 11 and the lower cover 12 are welded, a liquid inlet hole is reserved on one side of the heat sink body 1. Liquid is added into the heat dissipation cavity 4 through the liquid inlet hole. When the liquid reaches a certain amount, the liquid inlet hole is welded and sealed. The two ends of the connecting posts are in contact with the two sides of the inner wall of the heat dissipation cavity 4, which can increase the strength of the heat sink body 1, thereby making the heat sink body 1 less prone to deformation and bulging, and improving the high temperature resistance. The heat dissipation cavity 4 is filled with liquid. The heat sink body 1 is a VC heat dissipation plate, and the top of the heat sink body 1 has a mounting groove 2.

[0023] For details regarding the above embodiments, please refer to [link / reference]. Figure 1 The inner wall of the mounting slot 2 is provided with a wiring slot 3, which allows the wiring on one side of the chip to be easily installed in the wiring slot 3.

[0024] For details regarding the above embodiments, please refer to [link / reference]. Figure 1 and Figure 2 The heat sink body 1 is made of either copper or aluminum. Copper or aluminum heat sink body 1 has better heat absorption performance and can better dissipate heat from the chip.

[0025] In practical operation, the chip is installed inside the mounting slot 2, and the heat sink body 1 partially encloses the chip. The liquid is heated and evaporated into gas on the side close to the chip. After moving to a place away from the chip, it is cooled and condensed into water droplets. The water droplets are then absorbed back to the side close to the chip through capillary action, thereby achieving the purpose of heat dissipation.

[0026] There are two ways to install the chip. The first is to install the chip inside the mounting slot 2 and partially wrap the chip with the heat sink body 1. The second is to directly install the chip on one side of the heat sink body 1. Both sides of the heat sink body 1 are flat, so that the chip can fit in close to the heat sink body 1.

[0027] Although embodiments of the present invention have been shown and described, these specific embodiments are merely explanations of the present invention and are not intended to limit the invention. The specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. After reading this specification, those skilled in the art may make modifications, substitutions, and variations to the embodiments as needed without departing from the principles and spirit of the present invention, provided that such modifications, substitutions, and variations are within the scope of the claims of the present invention and are protected by patent law.

Claims

1. A chip packaging structure, comprising a heat sink body (1), characterized in that: The heat sink body (1) is attached to and covers the chip. The heat sink body (1) has a heat dissipation cavity (4) inside, and multiple sets of connecting posts are arranged inside the heat dissipation cavity (4). Liquid is arranged inside the heat dissipation cavity (4). The heat sink body (1) is a VC heat dissipation plate.

2. The chip packaging structure according to claim 1, characterized in that: The heat sink body (1) has a mounting groove (2) on its top.

3. The chip packaging structure according to claim 2, characterized in that: The inner wall of the mounting groove (2) is provided with a wiring groove (3).

4. The chip packaging structure according to claim 1, characterized in that: The heat sink body (1) is composed of an upper cover (11) and a lower cover (12), which are fixed by welding.

5. The chip packaging structure according to claim 4, characterized in that: The two ends of the connecting column are connected to the upper cover (11) and the lower cover (12).

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