Transistor vertical mounting structure

CN224698295UActive Publication Date: 2026-08-28SHENZHEN ACTIWAY ELECTRONICS
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Patent Information

Application Number
CN202521777878.6
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-08-20
Publication Date
2026-08-28
Estimated Expiration
2035-08-20

AI Technical Summary

Technical Problem

压条或支架在平面或斜面用打螺丝固定晶体管的方式需要较大的产品内部空间,还需要加工相应的孔来配合,生产效率较低;弹片配合治具的晶体管固定方式需要用治具配合,治具的活动范围会占用产品的内部空间,不利于功放小型化

Benefits of technology

[0006] Compared with the prior art, the transistor vertical fixing structure of this utility model fixes the transistor vertically, which occupies less internal space in the power amplifier. The heat sink is directly slotted without the need for additional positioning holes, saving costs. The screws are fixed from the outside of the power amplifier without the need for jigs, which occupies less internal space in the power amplifier and effectively improves production efficiency.

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Abstract

The utility model relates to power amplifier transistor installation technical field, especially transistor vertical fixing structure, including pressing plate, radiator and transistor, the radiator includes a radiator vertical surface, the transistor vertical close on the radiator vertical surface, the pressing plate press in the outside of transistor, the pressing plate is connected with the radiator through screw, the transistor is pressed in between the radiator vertical surface and pressing plate, the top of the radiator vertical surface is provided with a slanting horn mouth shape recess, the pressing plate is provided with fixed hole, the screw is connected in the slanting horn mouth shape recess after passing through fixed hole. Compared with prior art, the utility model discloses transistor vertical fixing structure, and the transistor adopts vertical mode and fixes, and the internal space of power amplifier is little, and the radiator is directly extracted, does not need to process positioning hole extra, saves the cost, and the screw is fixed from the outside of power amplifier, does not need fixture auxiliary, and the internal space of power amplifier is little, and production efficiency is effectively improved.
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Description

[Technical Field] This utility model relates to the field of power amplifier transistor mounting technology, and in particular to a vertical fixing structure for transistors. [Background Technology] There are two common methods for mounting transistors in power amplifiers: fixing them with screws on flat or angled surfaces using clamping strips or brackets, and fixing them with spring clips and fixtures. Fixing transistors with screws on flat or angled surfaces using clamping strips or brackets requires a large internal space and also requires machining corresponding holes, resulting in low production efficiency. Fixing transistors with spring clips and fixtures requires the use of fixtures, and the range of motion of these fixtures occupies internal space, which is detrimental to power amplifier miniaturization. [Utility Model Content] To overcome the above problems, this utility model proposes a vertical fixed structure for transistors that can effectively solve the above problems.

[0001] The present invention provides a technical solution to solve the above-mentioned technical problems by providing a vertical fixing structure for a transistor, including a pressure plate, a heat sink, and a transistor. The heat sink includes a vertical surface, and the transistor is vertically attached to the vertical surface of the heat sink. The pressure plate is pressed against the outside of the transistor, and the pressure plate is connected to the heat sink by screws. The transistor is pressed between the vertical surface of the heat sink and the pressure plate. A slanted flared groove is provided at the top of the vertical surface of the heat sink, and a fixing hole is provided on the pressure plate. The screw passes through the fixing hole and is connected to the slanted flared groove. Preferably, the pressure plate includes a hook portion, a fixing portion, and a pressing portion. The hook portion and the pressing portion are integrally formed on both ends of the fixing portion. The hook portion overlaps the upper end of the vertical surface of the heat sink, and the pressing portion contacts the transistor.

[0002] Preferably, the upper end of the vertical surface of the radiator is provided with a slot, and the hook part is engaged in the slot.

[0003] Preferably, the fixing hole is formed on the fixing part.

[0004] Preferably, one side of the pressing part is provided with a pressing arc surface, which protrudes towards the transistor.

[0005] Preferably, a PCB board is provided on the heat sink, and the pins of the transistor are connected to the PCB board.

[0006] Compared with the prior art, the transistor vertical fixing structure of this utility model fixes the transistor vertically, which occupies less internal space in the power amplifier. The heat sink is directly slotted without the need for additional positioning holes, saving costs. The screws are fixed from the outside of the power amplifier without the need for jigs, which occupies less internal space in the power amplifier and effectively improves production efficiency. [Attached Image Description] Figure 1 This is a perspective view of the vertical fixed structure of the transistor of this utility model; Figure 2 This is a side view of the vertical fixed structure of the transistor of this utility model; Figure 3 This is a side view of the pressure plate of the vertical fixing structure of the transistor of this utility model.

Detailed Implementation Methods

[0007] It should be noted that in this embodiment of the invention, all directional indications (such as up, down, left, right, front, back, etc.) are limited to relative positions on the specified view, rather than absolute positions.

[0008] Furthermore, in this utility model, the use of terms such as "first," "second," etc., is for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this utility model, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0009] Please see Figures 1 to 3 The present invention discloses a vertical fixing structure for transistors, comprising a pressure plate 1, a heat sink 2, and a transistor 6. The heat sink 2 includes a vertical heat sink surface 3, and the transistor 6 is vertically attached to the vertical heat sink surface 3. The pressure plate 1 is pressed against the outside of the transistor 6, and the pressure plate 1 is connected to the heat sink 2 by screws 5. The transistor 6 is pressed between the vertical heat sink surface 3 and the pressure plate 1.

[0010] The top of the vertical surface 3 of the radiator is provided with an oblique flared groove 4. The pressure plate 1 is provided with a fixing hole 11. The screw 5 passes through the fixing hole 11 and is connected to the oblique flared groove 4 to achieve a fixed connection.

[0011] The pressure plate 1 includes a hook portion 12, a fixing portion 13, and a pressing portion 14. The hook portion 12 and the pressing portion 14 are integrally formed on both ends of the fixing portion 13. The hook portion 12 overlaps the upper end of the vertical surface 3 of the heat sink, and the pressing portion 14 contacts the transistor 6.

[0012] The upper end of the vertical surface 3 of the radiator is provided with a slot, and the hook part 12 is engaged in the slot.

[0013] The fixing hole 11 is formed on the fixing part 13.

[0014] A pressing arc surface 15 is provided on one side of the pressing part 14. The pressing arc surface 15 protrudes towards the transistor 6, which is conducive to better pressing the transistor 6 for fixation.

[0015] A PCB board is provided on the heat sink 2, and the pins of the transistor 6 are connected to the PCB board.

[0016] The vertical fixing structure of the transistor in this utility model allows the transistor 6 to be closely attached to the vertical surface 3 of the heat sink. The heat generated by the transistor 6 when it is working is transferred to the vertical surface 3 of the heat sink, and then conducted to the whole body of the heat sink 2. The heat sink 2 dissipates the heat into the air, thereby achieving effective heat dissipation.

[0017] During installation, after placing the transistor 6 flat on the vertical surface 3 of the heat sink, place the pressure plate 1 on top of the transistor 6. Use an electric screwdriver to pass the screw 5 through the fixing hole 11 on the pressure plate 1 and fix the screw 5 into the slanted flared groove 4. The screw 5 will press the pressure plate 1 against the transistor 6, thereby making the transistor 6 tightly attached to the vertical surface 3 of the heat sink.

[0018] Compared with the prior art, the transistor vertical fixing structure of this utility model has transistor 6 fixed in a vertical manner, which occupies less internal space of the power amplifier. The heat sink 2 is directly slotted without the need for additional positioning holes, saving costs. The screw 5 is fixed from the outside of the power amplifier without the need for jigs, which occupies less internal space of the power amplifier and effectively improves production efficiency.

[0019] The above description is only a preferred embodiment of the present utility model and does not limit the patent scope of the present utility model. Any modifications, equivalent substitutions and improvements made within the concept of the present utility model should be included within the patent protection scope of the present utility model.

Claims

1. A vertical fixed structure for transistors, characterized in that, The device includes a pressure plate, a heat sink, and a transistor. The heat sink includes a vertical surface. The transistor is vertically attached to the vertical surface of the heat sink. The pressure plate is pressed against the outside of the transistor. The pressure plate is connected to the heat sink by screws. The transistor is pressed between the vertical surface of the heat sink and the pressure plate. The top of the vertical surface of the radiator has an oblique flared groove, and the pressure plate has a fixing hole. The screw passes through the fixing hole and is connected to the oblique flared groove.

2. The transistor vertical fixed structure as described in claim 1, characterized in that, The pressure plate includes a hook portion, a fixing portion, and a pressing portion. The hook portion and the pressing portion are integrally formed on both ends of the fixing portion. The hook portion overlaps the upper end of the vertical surface of the heat sink, and the pressing portion contacts the transistor.

3. The transistor vertical fixed structure as described in claim 2, characterized in that, The upper end of the vertical surface of the radiator is provided with a slot, and the hook part is engaged in the slot.

4. The transistor vertical fixing structure as described in claim 2, characterized in that, The fixing hole is formed on the fixing part.

5. The transistor vertical fixing structure as described in claim 2, characterized in that, One side of the clamping part is provided with a clamping arc surface, which protrudes towards the transistor.

6. The transistor vertical fixed structure as described in claim 1, characterized in that, A PCB board is mounted on the heat sink, and the pins of the transistor are connected to the PCB board.