A liquid jet cooling device for electronic chips

Abstract

The utility model relates to a kind of for electronic chip's liquid jet type liquid cooling heat sink.The device includes the chip carrier of being equipped with electronic chip, pedestal, jet flow guide plate, backflow collection plate, cover plate and joint;Pedestal is sealedly installed on chip carrier, jet flow guide plate, backflow collection plate and cover plate are sequentially superposed and mutually sealed connection, and integrally fixed on pedestal.Jet flow guide plate is located above electronic chip and is equipped with first through-hole and second through-hole, backflow collection plate is equipped with cooling liquid through-hole and cooling liquid flow guide hole, and cover plate is equipped with cooling liquid first interface and cooling liquid second interface.Compared with prior art, the utility model is cooperatively designed by jet flow guide plate and backflow collection plate, so that cooling liquid directly impacts electronic chip surface with high-speed jet, thereby significantly enhancing local heat exchange efficiency;While optimizing backflow path, reduce flow resistance, realize the consideration of high heat exchange performance and low pressure drop, applicable to the high-efficiency heat dissipation of high heat flux density electronic chip.

Claims

1. A jet-type liquid cooling heat dissipation device for electronic chips, characterized in that, The jet-type liquid cooling heat dissipation device includes a chip carrier (1), a base (2), a jet guide plate (3), a return collection plate (4), a cover plate (5), and a connector (6); An electronic chip (11) is mounted on the chip carrier (1); The base (2) is provided with a base cavity (23), which is used to accommodate the electronic chip (11); The base (2) is connected to the chip carrier (1), the jet guide plate (3) is connected to the base (2), the return collection plate (4) is connected to the jet guide plate (3), and the cover plate (5) is connected to the return collection plate (4). The chip carrier (1), base (2), jet guide plate (3), return collection plate (4), and cover plate (5) are connected in sequence to form a coolant channel; The cover plate (5) is provided with a first coolant inlet (51) and a second coolant inlet (52), which are used to connect the connector (6) to realize the inflow and outflow of coolant; The base cavity (23), the chip carrier (1) and the jet guide plate (3) are jointly enclosed to form a jet chamber (91); The jet guide plate (3) and the return collection plate (4) are jointly enclosed to form a first fluid chamber (92); The reflux collecting plate (4) and the cover plate (5) together enclose and define the second fluid chamber (93).

2. The jet-type liquid cooling heat dissipation device for electronic chips according to claim 1, characterized in that, The jet guide plate (3) has a jet plate groove (33) on the side facing the return collection plate (4); The jet plate groove (33) is provided with one or more of the following: a first through hole (331), a second through hole (332), and a slit (333); The first through hole (331) and the second through hole (332) are used to realize the jetting function or the return function of the coolant, and when one type of through hole undertakes the jetting function, the other type of through hole undertakes the return function. The slit (333) is used to realize the jetting or reflux function of coolant, or is used in combination with the first through hole (331) and / or the second through hole (332); The arrangement of the first through hole (331), the second through hole (332) and / or the slit (333) corresponds to the area where the electronic chip (11) is located, or corresponds to the electronic chip (11) and its surrounding area; The jet plate groove (33) and the return collection plate (4) together enclose and define the first fluid chamber (92).

3. A jet-type liquid cooling heat dissipation device for electronic chips according to claim 2, characterized in that, The arrangement of the first through hole (331) and the second through hole (332) is selected from either a sequential arrangement or a plug-in arrangement; In the row arrangement or the plug arrangement, the first through hole (331) and the second through hole (332) are alternately arranged in the same row or respectively arranged in different rows.

4. A jet-type liquid cooling heat dissipation device for electronic chips according to claim 2, characterized in that, The slit (333) is provided with a plurality of dividing strips (3331), which divide the slit (333) into a plurality of interval segments (3332); The interval segments (3332) are uniformly or unevenly distributed within the same slit (333), and the interval segments (3332) on different slits (333) are aligned or staggered in the width direction of the slit (333).

5. A jet-type liquid cooling heat dissipation device for electronic chips according to claim 2, characterized in that, A nozzle structure (3311) is coaxially arranged around one or more of the first through hole (331), the second through hole (332), and the slit (333) facing the side of the electronic chip (11). The nozzle structure (3311) has a cross-sectional shape along the coolant flow direction that is one of an outward expansion type, an inward contraction type, or a straight cylinder type. The total height of the nozzle structure (3311) is H, where H≥0; When H≠0: the starting position of the nozzle structure (3311) expanding outward or contracting inward is at a height of h1 from the bottom end of the nozzle structure (3311), and the ratio of h1 to H is in the range of 0 to 1; The distance from the bottom of the nozzle structure (3311) to the surface of the electronic chip (11) is h2, and h2>0; The angle between the vertical wall of the nozzle structure (3311) and the outward or inward opening is α, where α is used to characterize the degree of outward or inward expansion of the nozzle structure (3311), and α≥0.

6. A jet-type liquid cooling heat dissipation device for electronic chips according to claim 2, characterized in that, One or more of the first through hole (331), the second through hole (332), and the slit (333) are coaxially surrounded by a flow guiding structure (3321) on one side facing the return flow collecting plate (4); The height of the flow guiding structure (3321) is the same as the depth of the jet plate groove (33).

7. A jet-type liquid cooling heat dissipation device for electronic chips according to claim 1, characterized in that, The reflux collecting plate (4) has a reflux plate groove (42) on the side facing the cover plate (5); The return plate groove (42) is provided with a coolant through hole (421) and a number of coolant guide holes (422); The reflux plate groove (42) and the cover plate (5) together enclose and define the second fluid chamber (93).

8. A jet-type liquid cooling heat dissipation device for electronic chips according to claim 7, characterized in that, The coolant through hole (421) is coaxially surrounded by a coolant through hole guide structure (4211) on the side facing the cover plate (5), and the height of the coolant through hole guide structure (4211) is the same as the depth of the return plate groove (42).

9. A jet-type liquid cooling heat dissipation device for electronic chips according to claim 7, characterized in that, The coolant through hole (421) is connected to the first coolant interface (51) or the second coolant interface (52).

10. A jet-type liquid cooling heat dissipation device for electronic chips according to claim 1, characterized in that, The first fluid chamber (92) and the second fluid chamber (93) respectively undertake the function of diverting or converging flow according to the flow direction of the coolant and the internal passage structure of the jet-type liquid cooling heat dissipation device. When one of the fluid chambers undertakes the function of diverting flow, the other fluid chamber undertakes the function of converging flow.

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