Chip core heat dissipation device

Abstract

The utility model relates to a kind of chip core heat sink, including sequentially arranged chip bottom plate, radiator cold plate and radiator cover plate from bottom to top, wherein, radiator cover plate is connected and installed with the radiator joint for cooling working substance inflow and outflow, radiator cold plate is sealingly installed in radiator cover plate, and heat exchange chamber is formed by combining and enclosing between radiator cold plate and radiator cover plate, the side of radiator cold plate towards heat exchange chamber is provided with microstructure rib column or microstructure fin.Compared with prior art, the utility model overcomes the shortcomings of large power consumption requirement, unstable operation and large thermal resistance during operation of traditional chip radiator, and has the advantages of good heat exchange efficiency, good heat dissipation effect, stable operation and wide application range.

Description

Technical Field

[0001] This utility model relates to the field of chip heat dissipation technology, and in particular to a chip core heat dissipation device. Background Technology

[0002] With the continuous development of microelectronics technology, chip performance has been improved time and time again. As various devices are rapidly developing towards miniaturization and high-density integration, thermal management issues have become increasingly prominent.

[0003] Specifically, on the one hand, the power consumption of the chip's core unit has increased significantly; on the other hand, the three-dimensional stacked structure design makes it very easy for heat to accumulate inside. These two factors combined cause the chip's heat flux density to soar exponentially. However, semiconductor components are extremely sensitive to high temperatures. Once the operating temperature exceeds the critical value, they are likely to be damaged, thus affecting the normal operation of the entire device.

[0004] Therefore, thermal management has become a key factor limiting the full performance of chips and affecting their reliability. Efficient heat dissipation technology plays a decisive role in ensuring stable chip operation and extending their lifespan. Existing technology utilizes phase change liquid cooling systems to achieve heat dissipation through medium phase changes. Phase change liquid cooling, with its compact structure, ability to handle high heat flux, and low operating noise, has become the preferred technology for addressing the heat dissipation needs of high-power chips. However, in engineering practice, it has been found that typical chip heat sinks have the bottom surface of the heat sink in direct contact with the chip cover surface, resulting in drawbacks such as high thermal resistance, low heat exchange efficiency, and high energy consumption during heat exchange. Utility Model Content

[0005] The purpose of this invention is to overcome the defects of the prior art by providing a chip core heat dissipation device that can overcome the shortcomings of traditional chip heat sinks, such as high power consumption, unstable operation, and high thermal resistance.

[0006] The objective of this utility model can be achieved through the following technical solution: a chip core heat dissipation device, comprising a chip base plate, a heat sink cold plate, and a heat sink cover plate arranged sequentially from bottom to top, wherein a heat sink connector for cooling working fluid inflow and outflow is connected and installed on the heat sink cover plate, the heat sink cold plate is sealed and installed inside the heat sink cover plate, and a heat exchange chamber is formed between the heat sink cold plate and the heat sink cover plate, wherein a microstructure rib or microstructure fin is provided on the side of the heat sink cold plate facing the heat exchange chamber.

[0007] The radiator cold plate and the radiator cover plate can be fixedly connected by welding, gluing or integral molding, with welding being the preferred solution.

[0008] The heat sink cover and the chip base plate can be fixedly connected by adhesive bonding or threaded connection to realize the installation of the heat dissipation device and the chip base plate;

[0009] The heat sink cold plate is connected to the chip core of the chip base plate by welding, filling with thermal interface material or using thermally conductive adhesive to ensure that the heat exchange bottom surface of the heat sink device is in close contact with the heat-generating surface of the chip.

[0010] Furthermore, the projected area of ​​the microstructure ribs or microstructure fins on the heat sink cold plate is larger than the surface area of ​​the chip core on the chip substrate, and the top surface of the microstructure ribs or microstructure fins is directly attached to or has a gap with the heat sink cover plate.

[0011] Furthermore, the cross-sectional shape of the microstructure rib is selected from one or more of rectangles, trapezoids, triangles, or parallelograms;

[0012] The three-dimensional form of the microstructure ribs is selected from one of the columns, cones, or frustums, or a combination thereof.

[0013] The head and root of the combined structure have different cross-sectional shapes or three-dimensional forms;

[0014] The arrangement of the microstructure ribs includes straight-line and staggered arrangements.

[0015] Furthermore, the combined structure is specifically an umbrella-shaped structure. The circumcenters of the horizontal projection contours of the root and the head of the umbrella-shaped structure are either coincident or misaligned according to design requirements. R1 is defined as the circumradius of the horizontal projection contour of the root, and R2 is defined as the circumradius of the horizontal projection contour of the head. When the root and the head are misaligned, the misalignment distance is less than or equal to the sum of R1 and R2. The ratio of the circumradius of the root to the circumradius of the head is 0.1 to 10. The height ratio of the root to the head is adjusted according to design requirements.

[0016] Furthermore, the microstructure ribs are specifically linear or wavy, wherein the wavy shape includes one or more combinations of rectangular waveforms, trapezoidal waveforms, triangular waveforms, and sine or cosine waveforms;

[0017] When the microstructure ribs are wavy, the arrangement of the microstructure ribs includes parallel arrangement or mirror arrangement.

[0018] Furthermore, a first capillary structure is provided on the side of the radiator cold plate facing the heat exchange chamber, and the first capillary structure covers the upper surface of the radiator cold plate.

[0019] The surface of the microstructured ribs or microstructured ribs is covered with a second capillary structure.

[0020] The thickness of the first capillary structure is greater than or equal to 0. When the thickness of the first capillary structure is 0, the upper surface of the heat sink cold plate is a smooth metal surface.

[0021] The thickness of the second capillary structure is greater than or equal to 0. When the thickness of the second capillary structure is 0, the microstructure rib or microstructure rib is a smooth structure.

[0022] Furthermore, the constituent materials of the first and second capillary structures are selected from one of metal powder, metal wire, metal mesh, and metal foam, or a mixture of two or more of them in a specific proportion. The first and second capillary structures achieve stable porous capillary structures through sintering, pressing, bonding, stacking, chemical deposition, or chemical etching. The porosity of the first and second capillary structures is 10% to 99%, and the thickness at different locations or regions is adjusted differently according to design requirements.

[0023] Furthermore, the radiator cover plate has a cover plate working fluid inlet and a cover plate working fluid outlet for connecting and installing the radiator connector, and the inner wall surface and the lower surface of the radiator cover plate together form a cavity for accommodating the radiator cold plate.

[0024] When the cooling medium flows through a radiator joint and through the first flow channel of the cover plate, which is connected to the working medium inlet of the cover plate, it flows into the heat exchange chamber. In the heat exchange chamber, it contacts the microstructured ribs or microstructured fins of the radiator cold plate to achieve heat exchange. After completing the heat exchange, it flows out of the heat exchange chamber and then through the working medium outlet of the cover plate, which is connected to the second flow channel of the cover plate, and then through another heat dissipation joint to be discharged to the external flow channel.

[0025] Furthermore, a heat dissipation layer is provided between the heat sink cold plate and the chip core of the chip substrate, and the upper and lower surfaces of the heat dissipation layer are respectively connected to the lower surface of the heat sink cold plate and the upper surface of the chip core.

[0026] Furthermore, the heat dissipation layer is connected to the lower surface of the heat sink cold plate and the upper surface of the chip core by welding or thermal interface filling, respectively. The heat dissipation layer adopts one or more combinations of VC heat dissipation plate, high thermal conductivity graphite film, graphene film, diamond film, boron nitride nanosheets, copper-graphite composite layer, and carbon fiber reinforced composite material.

[0027] Compared with the prior art, the present invention has the following advantages:

[0028] This invention features a chip substrate, a heat sink cold plate, and a heat sink cover plate arranged sequentially from bottom to top. The heat sink cover plate is fitted with a heat sink connector for the inflow and outflow of cooling fluid. The heat sink cold plate is sealed within the heat sink cover plate, forming a heat exchange chamber. Microstructured ribs or microstructured fins are provided on the side of the heat sink cold plate facing the heat exchange chamber. Firstly, the heat sink cold plate contacts the chip core on the chip substrate for heat dissipation, shortening the heat transfer process from the chip to the heat sink cold plate and significantly reducing thermal resistance. This allows the cooling fluid flowing within the heat exchange chamber to more effectively remove the heat generated during chip operation. Secondly, the microstructured ribs or microstructured fins on the heat sink cold plate significantly increase the contact area with the cooling fluid, thereby significantly improving heat exchange efficiency and reducing chip power consumption.

[0029] This invention features a first capillary structure on the side of the radiator cold plate facing the heat exchange chamber, covering the upper surface of the radiator cold plate. A second capillary structure is also provided on the surface of the microstructure ribs or microstructure fins. This capillary action promotes the distribution of the working fluid and enhances heat conduction. Furthermore, the capillary structure can be prepared using processes such as metal powder sintering or metal wire sintering. The porosity and thickness can be adjusted according to the different heat dissipation requirements (e.g., increasing porosity in high heat density areas), thereby balancing heat dissipation efficiency and manufacturing cost.

[0030] This invention sets up a heat dissipation layer between the heat sink cold plate and the chip core on the chip base plate. That is, the heat sink cold plate contacts the chip core through the heat dissipation layer, so that the heat transfer is more uniform. When the cooling medium flows into the heat exchange chamber and comes into full contact with the microstructure ribs or microstructure fins set on the bottom surface of the cold plate, the heat generated by the chip operation will be transferred to the cooling medium faster and more uniformly, thereby eliminating the danger of local dryness and achieving high-efficiency heat exchange. Attached Figure Description

[0031] Figure 1 This is an unfolded view of the overall structure of the chip core heat dissipation device in Example 1;

[0032] Figure 2 This is an overall structural assembly diagram of the chip core heat dissipation device in Example 1;

[0033] Figure 3 This is a cross-sectional view of the overall structure of the chip core heat dissipation device in Example 1;

[0034] Figure 4 This is a schematic diagram of the chip substrate structure;

[0035] Figure 5 A schematic diagram of a heat sink cold plate with microstructured ribs;

[0036] Figure 6 A schematic diagram of a heat sink cold plate with microstructured fins;

[0037] Figure 7 This is a schematic diagram of the upper surface structure of the radiator cover plate in Example 1;

[0038] Figure 8 This is a schematic diagram of the lower surface structure of the radiator cover in Example 1;

[0039] Figure 9 This is a schematic diagram of the radiator connector structure;

[0040] Figure 10 This is a schematic diagram of the shape of the microstructure ribs;

[0041] Figure 11 A schematic diagram of an umbrella-shaped microstructure rib column;

[0042] Figure 12 This is a schematic diagram of the shape of the microstructure ribs;

[0043] Figure 13 This is a schematic diagram of the arrangement of microstructure ribs;

[0044] Figure 14 A schematic diagram of the capillary structure of a radiator cold plate with microstructured ribs;

[0045] Figure 15 A schematic diagram of the capillary structure of a heat sink cold plate with microstructured fins;

[0046] Figure 16 This is a cross-sectional view of the overall structure of the chip core heat dissipation device in Example 2;

[0047] The markings in the diagram are as follows: 1. Chip substrate, 11. Upper surface of chip substrate, 12. Chip core, 2. Heat sink cold plate, 21. Upper surface of cold plate, 22. Microstructure rib, 23. Microstructure rib, 211. First capillary structure, 221. Second capillary structure, 3. Heat sink cover plate, 31. First surface of cover plate, 32. Second surface of cover plate, 33. Working fluid inlet of cover plate, 34. First flow channel of cover plate, 35. Working fluid outlet of cover plate, 36. Second flow channel of cover plate, 37. First lower surface of cover plate, 38. Second lower surface of cover plate, 39. First inner wall of cover plate, 4. Heat sink connector, 41. Heat sink connector channel, 42. Bottom surface of heat sink connector, 43. Heat sink connector structure, 5. Heat spreader. Detailed Implementation

[0048] The present invention will now be described in detail with reference to the accompanying drawings and specific embodiments.

[0049] Example 1

[0050] To address at least one of the heat dissipation problems of existing chip heat sinks, namely low heat exchange efficiency, poor heat dissipation effect, and high power consumption, this embodiment provides a high-efficiency chip core heat dissipation device. The specific operating principle and structure are detailed below. Figures 1-3 The device mainly includes a radiator cold plate 2, a radiator cover plate 3, and a radiator connector 4. The radiator cold plate 2 is sealed and installed inside the radiator cover plate 3, and the radiator connector 4 is sealed and connected to the radiator cover plate 3. The side of the radiator cold plate 2 closest to the radiator cover plate 3 is the upper surface 21 of the cold plate. The radiator cold plate 2 abuts against the first inner wall surface 39 of the cover plate of the radiator cover plate 3. The space enclosed by the upper surface 21 of the cold plate 2, the lower second surface 38 of the cover plate of the radiator cover plate 3, and the first inner wall surface 39 of the cover plate constitutes a heat exchange chamber 24.

[0051] The aforementioned heat dissipation device is fixedly connected to the chip base plate 1 via the heat sink cover plate 3. In practical applications, the heat sink cold plate 2 and the first inner wall surface 39 of the heat sink cover plate 3 are fixedly connected by welding, gluing, or integral molding, with welding being the preferred option. The heat sink cold plate 2 and the heat sink cover plate 3 are connected by welding. Compared with screw connection, no additional structural treatment is required, nor is it necessary to add additional gaskets or washers to improve sealing. This ensures the strength and integrity of the structure, has strong corrosion resistance, and the structure connected by welding has good sealing performance, providing a guarantee for high sealing requirements. This is very important for heat dissipation systems that need to prevent leakage of cooling medium or air ingress.

[0052] The heat sink cover 3 and the chip base plate 1 are fixedly connected by adhesive bonding or threaded connection to realize the installation of the heat dissipation device and the chip base plate 1. Adhesive bonding is the preferred solution. When the heat sink cover 3 and the chip base plate 1 are fixedly connected by threaded connection, the heat sink cover 3 needs to be provided with cover thread holes and the corresponding positions of the chip base plate 1 need to be provided with base plate thread holes, and they are connected by screws to realize the threaded connection and installation of the heat dissipation device and the chip base plate 1.

[0053] The heat sink cold plate 2 and the chip core 12 of the chip base plate 1 are connected by welding, thermal interface material filling or thermally conductive adhesive to ensure that the heat exchange bottom surface of the heat sink device is in close contact with the heat-generating surface of the chip. Among them, thermal interface material filling is the preferred solution, which can avoid the risk of connection breakage due to thermal expansion and contraction of the heat sink device as the temperature rises.

[0054] The heat sink 2 has microstructured ribs 22 or microstructured fins 23 on the side facing the heat exchange chamber 24 to enhance heat transfer. The projected area of ​​the microstructured ribs 22 or microstructured fins 23 on the heat sink 2 is larger than the surface area of ​​the chip core 12 of the chip substrate 1. The heat sink 2 may or may not have microstructured ribs 22 or microstructured fins 23 in a certain area near a pair of cover interfaces on the heat sink cover 3 (i.e., the area corresponding to the inflow and outflow of the cooling working fluid).

[0055] When the radiator cold plate 2 does not have microstructure ribs 22 or microstructure fins 23 in a certain area near a pair of cover interfaces on the corresponding radiator cover plate 3, the heat exchange chamber 24 forms a space for stable diversion or convergence of the working fluid, which improves the flow stability of the working fluid during the heat exchange process, reduces the impact of local pressure fluctuations on heat exchange performance during boiling, promotes full contact between the working fluid and the microstructure ribs 22 or microstructure fins 23, and helps maintain the long-term stable and efficient operation of the radiator.

[0056] When the radiator cold plate 2 is provided with microstructured ribs 22 or microstructured fins 23 in a certain area near a pair of cover plate interfaces of the corresponding radiator cover plate 3, more sufficient rib or fin coverage is achieved, which can increase the effective heat exchange area of ​​the radiator, promote the uniform occurrence of boiling in the entire heat exchange chamber 24, improve the uniformity of heat exchange performance in each area of ​​the cold plate, avoid the accumulation of heat in local areas, prevent the occurrence of local drying phenomenon, and improve the heat exchange efficiency of the radiator.

[0057] In addition, the distance between the top of the microstructure rib 22 or the microstructure fin 23 and the second surface 38 under the cover of the radiator cover 3 can be set to a certain size or the two surfaces can be directly attached, depending on the requirements of local heat flux density, whether the disturbance generated by the working fluid flow is strong, etc.

[0058] In this embodiment, the projected area of ​​the microstructure ribs 22 provided on the heat sink cold plate 2 is larger than the surface area of ​​the chip core 12 of the chip base plate 1, and the microstructure ribs 22 are not provided in a part of the area near the pair of cover interfaces of the heat sink cover plate 3. Furthermore, a certain gap is provided between the top of the microstructure ribs 22 and the second surface 38 under the cover of the heat sink cover plate 3 to enhance the heat dissipation effect.

[0059] The radiator cover 3 is provided with a pair of cover interfaces for the inflow and outflow of the working fluid, which serve as the cover working fluid inlet 33 and the cover working fluid outlet 35 of the heat dissipation device, respectively.

[0060] In practical applications, the radiator connector 4 can be connected to the radiator cover plate 3 by threaded connection or welding. When the radiator connector 4 is connected by thread, it is convenient to maintain and clean the heat dissipation device. When the radiator connector 4 is connected by welding, it can ensure the sealing of the heat dissipation device and is not affected by vibration during operation.

[0061] In this embodiment, the heat dissipation device includes a pair of heat dissipation connectors 4. One heat dissipation connector 4 is connected to the working fluid inlet 33 of the radiator cover plate 3 by means of a threaded connection, serving as a working fluid inlet connector. The other heat dissipation connector 4 is connected to the working fluid outlet 35 of the radiator cover plate 3 by means of a threaded connection, serving as a working fluid outlet connector.

[0062] In this embodiment, the upper surface 11 of the chip base plate 1 is attached to the lower first surface 37 of the heat sink cover plate 3 and connected by adhesive bonding, so that the heat sink cover plate 3 can be fixed on the upper surface 11 of the chip base plate 1, ensuring the stability of the entire heat dissipation device.

[0063] The chip core 12 of the chip base plate 1 is attached to the lower surface of the heat sink cold plate 2 and connected by filling with thermal interface material, so that the heat dissipation effect of the heat dissipation device can be applied to the heat-generating surface of the chip with low heat loss, while ensuring the stability of the device.

[0064] The outer wall of the radiator cold plate 2 abuts against the first inner wall 39 of the radiator cover plate 3 and is connected by welding. No other auxiliary sealing device is needed between the two components, which ensures the sealing performance and stability between the two components.

[0065] In this embodiment, a heat dissipation layer 5 is also provided between the heat sink cold plate 2 and the chip core 12 of the chip base plate 1. The upper surface of the heat dissipation layer 5 is connected to the lower surface of the heat sink cold plate 2 by welding, and the lower surface of the heat dissipation layer 5 is connected to the upper surface of the chip core 12 by welding. The heat dissipation layer 5 can make the heat generated by the chip evenly diffuse to the heat sink cold plate 2 through this structure, making the heat dissipation more uniform and reducing the phenomenon of local drying.

[0066] In practical applications, the heat spreader layer 5 can also be connected to the heat sink cold plate 2 and the chip substrate 1 by filling with thermal interface materials. The heat spreader layer 5 can be composed of one or more of the following: VC heat spreader plate, high thermal conductivity graphite film, graphene film, diamond film, boron nitride nanosheets, copper-graphite composite layer, and carbon fiber reinforced composite material. The specific composition can be adjusted according to requirements.

[0067] In this embodiment, the cooling working fluid flows through a radiator connector 4 and through the first flow channel 34 of the cover plate, which is connected to the working fluid inlet 33 of the cover plate, to the upper surface 21 of the cold plate of the radiator cold plate 2. After converging, it flows into the heat exchange chamber 24, where it contacts the microstructure ribs 22 of the radiator cold plate 2 to achieve heat exchange. After completing the heat exchange, it flows out of the heat exchange chamber 24, and after converging again, it flows through the working fluid outlet 35 of the cover plate, which is connected to the second flow channel 36 of the cover plate, and is discharged to the external flow channel through another heat dissipation connector 4, forming a heat exchange loop.

[0068] like Figure 4 As shown, the chip substrate 1 in this embodiment is a printed circuit board. On the upper surface 11 of the chip substrate 1 is the exposed chip core 12, which is the heat source that needs to be dissipated.

[0069] like Figure 5-6 As shown, the upper surface 21 of the radiator cold plate 2 is provided with microstructured ribs 22 or microstructured fins 23 perpendicular to the bottom surface, which can enhance heat dissipation and improve heat exchange efficiency.

[0070] like Figures 7-9 As shown, the radiator cover plate 3 is provided with a working fluid inlet 33 and a working fluid outlet 35. The working fluid inlet 33 and the working fluid outlet 35 are respectively connected to the first flow channel 34 and the second flow channel 36 of the cover plate. The first flow channel 34 is the working fluid inflow channel, and the second flow channel 36 is the working fluid outflow channel. A pair of radiator connectors 4 are provided on the radiator cover plate 3. The radiator connectors 4 are provided with a heat dissipation connector channel 41, a heat dissipation connector bottom surface 42, and a heat dissipation connector structure 43. The heat dissipation connector bottom surface 42 of one of the radiator connectors 4 is installed on the working fluid inlet 33 of the cover plate. The heat dissipation connector channel 41 is connected to the first flow channel 34 of the cover plate. The corresponding radiator connector 4 is the working fluid inflow connector.

[0071] like Figure 10-13As shown, when the microstructure rib 22 is set on the upper surface 21 of the cold plate of the radiator cold plate 2, the cross-sectional shape of the microstructure rib 22 is selected from one or more of rectangle, trapezoid, triangle or parallelogram according to the applicable situation; the three-dimensional form of the microstructure rib 22 is selected from one of column, cone or frustum or a combination of the above according to the applicable situation; when the microstructure rib 22 is selected as a combination structure, the combination structure is an umbrella structure, and the cross-sectional shape or three-dimensional form of the head and root of the structure is selected from different types; when the microstructure rib 22 is a combination structure, the circumcenter of the horizontal projection profile of the root and the head can be coincident or misaligned according to the design requirements; R1 is defined as the circumcircle radius of the horizontal projection profile of the root, and R2 is the circumcircle radius of the horizontal projection profile of the head. When the root and the head are misaligned, the misalignment distance is less than or equal to the sum of R1 and R2. The ratio of the circumcircle radius of the root to the circumcircle radius of the head is 0.1 to 10. The height ratio of the root to the head can be adjusted to any value according to the design requirements.

[0072] The arrangement of the microstructure ribs 22 can be selected from either a straight arrangement or an interlaced arrangement, depending on the applicable situation;

[0073] When the microstructure fins 23 are disposed on the upper surface 21 of the cold plate of the radiator cold plate 2, the microstructure fins can be designed as straight lines or wavy lines according to requirements, and the distance between two adjacent microstructure fins is L. When straight microstructure fins 23 are selected, this type of fin allows the working fluid to flow along a straight channel, with a smooth path, fewer local eddies, less pressure loss, and a simple structure that is easy to produce.

[0074] When the wavy microstructure fin 23 is selected, this fin can increase the specific surface area, which can increase the heat transfer area in the same space. The generated eddies can enhance local disturbance and improve the heat transfer coefficient.

[0075] The arrangement of the wavy microstructure fins can be selected from parallel or mirror arrangement depending on the application. The waveform of the wavy microstructure fins includes one or more combinations of rectangular waveforms, trapezoidal waveforms, triangular waveforms, and sine or cosine waveforms, with an amplitude of B and a wavelength of A. The specific dimensions are designed and modified according to the local heat flux density requirements.

[0076] In this embodiment, the microstructure ribs 22 have a rectangular cross-sectional shape and a three-dimensional column form, and are arranged in a straight line. When the working fluid flows in this structure, the path is smooth, there are few local eddies, the pressure loss is small, and the structure is simple and easy to produce.

[0077] like Figures 14-15As shown, the radiator cold plate 2 is provided with a first capillary structure 211 covering the upper surface 21 of the cold plate and a second capillary structure 221 covering the surface of the microstructure ribs 22 or microstructure fins 23 on one side of the heat exchange chamber 24.

[0078] The thickness of the first capillary structure 211 is greater than or equal to 0. When its thickness is 0, the upper surface 21 of the cold plate is a smooth metal surface.

[0079] The thickness of the second capillary structure 221 is greater than or equal to 0. When its thickness is 0, the microstructure rib 22 or microstructure rib 23 is a smooth structure.

[0080] The constituent material of the first capillary structure 211 or the second capillary structure 221 can be one of metal powder, metal wire, metal mesh, or metal foam, or a mixture of two or more of them in a specific proportion. The porous capillary structure can achieve a stable porous structure through various methods such as sintering, pressing, bonding, stacking, chemical deposition, and chemical etching. The porosity of the porous capillary structure is 10% to 99%, and the thickness at different locations or regions can be adjusted differently according to design requirements.

[0081] In this embodiment, the radiator cold plate 2 is provided with a first capillary structure 211 and a second capillary structure 221, and the capillary structures have a certain thickness, which can enhance heat dissipation and improve heat exchange efficiency.

[0082] Furthermore, this embodiment also fills the space between the heat sink 2 and the surface of the chip core 12 with a thermally conductive medium. This solution does not limit the type of thermally conductive medium; for example, it can be thermal grease or liquid metal. When the thermally conductive medium is liquid metal, a protective design is provided around the chip to prevent liquid metal leakage from damaging the motherboard.

[0083] It should be noted that, in practical applications, the materials of the radiator cold plate 2, radiator cover plate 3, and radiator connector 4 can be selected from one of the following: copper, aluminum, aluminum alloy, stainless steel, aluminum nitride, silicon carbide, gallium nitride, plastic, ceramic, or glass. The cooling medium can be selected from one or more mixtures of water, alcohols, ammonia, hydrocarbons, refrigerants, mineral oil, transformer oil, or fluorinated liquid.

[0084] The basic application principle of the above-mentioned chip core heat dissipation device is as follows: the heat sink cover plate 3 is connected to the chip base plate 1 by welding, and the heat sink cold plate 2 is connected to the chip core 12 on the chip base plate 1 by welding, so as to realize the connection and fixation between the heat dissipation device and the chip surface, so that the heat sink is attached to the chip surface. The low temperature cooling medium flows through a heat sink connector 4 through the first flow channel 34 of the cover plate connected to the working fluid inlet 33 of the cover plate, and flows into the heat exchange chamber 24. In the heat exchange chamber 24, it contacts the microstructure ribs 22 or microstructure fins 23 of the heat sink cold plate 2 to achieve heat exchange. After the heat exchange is completed, it flows out of the heat exchange chamber 24, and then through the cover plate working fluid outlet 35 connected to the second flow channel 36 of the cover plate, and flows through another heat sink connector 4 to be discharged to the external flow channel.

[0085] Example 2

[0086] The specific operating principle and structure of this embodiment are as follows: Figure 16 As shown, its overall structure and the connection between the structures are basically the same as in Embodiment 1, and the structure and method of forming the heat exchange chamber 24 are the same as in Embodiment 1.

[0087] In this embodiment, the projected area of ​​the microstructure ribs 22 on the heat sink cold plate 2 is larger than the surface area of ​​the chip core 12 on the chip base plate 1, and the microstructure ribs 22 are provided in a part of the area near a pair of interfaces of the heat sink cover plate 3. At this time, the working fluid flows directly into the heat exchange chamber 24.

[0088] In this embodiment, the working fluid flows through a radiator connector 4 and through the first flow channel 34 of the cover plate, which is connected to the working fluid inlet 33 of the cover plate, to the heat exchange chamber 24. It then directly contacts the microstructure ribs 22 of the radiator cold plate 2 in the heat exchange chamber 24 to achieve heat exchange. After completing the heat exchange, the working fluid flows out of the heat exchange chamber 24 and through the working fluid outlet 35 of the cover plate, which is connected to the second flow channel 36 of the cover plate, it flows through another heat dissipation connector 4 and is discharged to the external flow channel, forming a heat exchange loop.

[0089] In summary, this solution incorporates microstructured fins or microstructured pillars on one side of the heat exchange chamber where the radiator cold plate is located, significantly increasing the contact area with the working fluid and substantially improving heat exchange efficiency. Simultaneously, the design of the radiator cold plate in direct contact with the chip core reduces the amount of heat transferred from the chip to the cold plate, effectively lowering thermal resistance. This allows the cooling fluid to more effectively remove the heat generated during chip operation, significantly improving heat exchange efficiency and extending the chip's lifespan.

Claims

1. A heat dissipation device for a chip core (12), characterized in that, The device includes a chip base plate (1), a heat sink cold plate (2), and a heat sink cover plate (3) arranged sequentially from bottom to top. A heat sink connector (4) for cooling the inflow and outflow of the working fluid is connected and installed on the heat sink cover plate (3). The heat sink cold plate (2) is sealed and installed inside the heat sink cover plate (3). The heat sink cold plate (2) and the heat sink cover plate (3) together form a heat exchange chamber. Microstructure ribs (22) or microstructure fins (23) are provided on the side of the heat sink cold plate (2) facing the heat exchange chamber.

2. The heat dissipation device for a chip core (12) according to claim 1, characterized in that, The projected area of ​​the microstructure ribs (22) or microstructure ribs (23) on the heat sink cold plate (2) is greater than the surface area of ​​the chip core (12) of the chip base plate (1). The top surface of the microstructure ribs (22) or microstructure ribs (23) is directly attached to the heat sink cover plate (3) or there is a gap between them. The radiator cold plate (2) is provided with microstructured ribs (22) or microstructured ribs (23) in the part of the radiator cover plate (3) where the cooling working fluid flows in and out. Alternatively, the radiator cold plate (2) may not have microstructure ribs (22) or microstructure ribs (23) installed in the area where the cooling working fluid flows in and out of the corresponding radiator cover plate (3).

3. The heat dissipation device for a chip core (12) according to claim 1, characterized in that, The cross-sectional shape of the microstructure rib (22) is selected from one or more of the following: rectangle, trapezoid, triangle or parallelogram; The three-dimensional form of the microstructure rib (22) is selected from one of the columns, cones or frustums or a combination thereof; The head and root of the combined structure have different cross-sectional shapes or three-dimensional forms; The arrangement of the microstructure ribs (22) includes straight and staggered arrangements.

4. The heat dissipation device for a chip core (12) according to claim 3, characterized in that, The combined structure is specifically an umbrella-shaped structure. The outer center of the horizontal projection contour of the root and the head of the umbrella-shaped structure coincides or is offset according to the design requirements. R1 is defined as the outer radius of the horizontal projection contour of the root, and R2 is the outer radius of the horizontal projection contour of the head. When the root and the head are offset, the offset distance is less than or equal to the sum of R1 and R2. The ratio of the outer radius of the root to the outer radius of the head is 0.1 to 10. The height ratio of the root to the head is adjusted according to the design requirements.

5. The heat dissipation device for a chip core (12) according to claim 1, characterized in that, The microstructure rib (23) is specifically linear or wavy, wherein the wavy shape includes one or more combinations of rectangular waveform, trapezoidal waveform, triangular waveform and sine or cosine waveform; When the microstructure ribs (23) are wavy, the arrangement of the microstructure ribs (23) includes parallel arrangement or mirror arrangement.

6. The heat dissipation device for a chip core (12) according to claim 1, characterized in that, The radiator cold plate (2) is provided with a first capillary structure (211) on the side facing the heat exchange chamber, and the first capillary structure (211) covers the upper surface of the radiator cold plate (2). The surface of the microstructured rib (22) or microstructured rib (23) is covered with a second capillary structure (221); The thickness of the first capillary structure (211) is greater than or equal to 0. When the thickness of the first capillary structure (211) is 0, the upper surface of the heat sink cold plate (2) is a smooth metal surface. The thickness of the second capillary structure (221) is greater than or equal to 0. When the thickness of the second capillary structure (221) is 0, the microstructure rib (22) or microstructure rib (23) is a smooth structure.

7. A heat dissipation device for a chip core (12) according to claim 6, characterized in that, The first capillary structure (211) and the second capillary structure (221) are made of one of the following materials: metal powder, metal wire, metal mesh, and metal foam, or a mixture of two or more of them in a specific proportion. The first capillary structure (211) and the second capillary structure (221) are made into a stable porous capillary structure by means of sintering, pressing, bonding, stacking, chemical deposition or chemical etching. The porosity of the first capillary structure (211) and the second capillary structure (221) is 10% to 99%.

8. The heat dissipation device for a chip core (12) according to claim 1, characterized in that, The radiator cover plate (3) is provided with a cover plate working fluid inlet (33) and a cover plate working fluid outlet (35) for connecting and installing the radiator connector (4). The inner wall surface and the lower surface of the radiator cover plate (3) together form a cavity for accommodating the radiator cold plate (2).

9. A heat dissipation device for a chip core (12) according to claim 1, characterized in that, A heat dissipation layer (5) is provided between the heat sink cold plate (2) and the chip core (12) of the chip base plate (1). The upper and lower surfaces of the heat dissipation layer (5) are respectively connected to the lower surface of the heat sink cold plate (2) and the upper surface of the chip core (12).

10. A heat dissipation device for a chip core (12) according to claim 9, characterized in that, The heat dissipation layer (5) is connected to the lower surface of the heat sink cold plate (2) and the upper surface of the chip core (12) by welding or thermal interface filling, respectively. The heat dissipation layer (5) adopts one or more combinations of VC heat dissipation plate, high thermal conductivity graphite film, graphene film, diamond film, boron nitride nanosheet, copper-graphite composite layer, and carbon fiber reinforced composite material.

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