Chip packaging structure, chip and electronic device
CN224698305UActive Publication Date: 2026-08-28BEIJING X RING TECHNOLOGY CO LTD
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Patent Information
- Application Number
- CN202522004063.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-09-17
- Publication Date
- 2026-08-28
- Estimated Expiration
- 2035-09-17
AI Technical Summary
Benefits of technology
[0016]本公开实施例中，芯片封装结构包括柔性基板、第一芯片、第二芯片，第二芯片与第一芯片层叠设置，第二芯片与第一芯片电连接；第三芯片和第一芯片通过柔性基板电连接。本公开第三芯片通过柔性基板与层叠设置的第一芯片电连接，可以节约空间，减小封装尺寸。此外，层叠设置的第一芯片与第二芯片和第三芯片都进行了电性互联，提高了封装集成度，实现了灵活布局。
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Abstract
The present disclosure provides a chip packaging structure, a chip and an electronic device, and relates to the technical field of semiconductors. The chip packaging structure comprises a flexible substrate, a first chip, and a second chip. The second chip is arranged in a stack with the first chip, and the second chip is electrically connected to the first chip. The third chip is electrically connected to the first chip through the flexible substrate. The third chip is electrically connected to the first chip through the flexible substrate, which can save space and reduce the packaging size. In addition, the first chip, the second chip and the third chip are all electrically interconnected, which improves the packaging integration and realizes flexible layout.
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