substrate structure

Abstract

The application provides a substrate structure, comprising: a glass substrate comprising a through hole; and a metal layer arranged on the glass substrate and filling the through hole; wherein an interface between the glass substrate and the metal layer forms a sintering area, and the glass substrate has a plurality of protruding structures protruding from the surface of the glass substrate in the sintering area. The application forms a sintering area at the interface between the metal layer and the glass substrate, and the surface of the glass substrate in the sintering area forms a plurality of protruding structures, so that the bonding strength between the metal layer and the glass substrate can be improved, the problem of cracks at the edge of the through hole can be solved, and specifically, the interface cracks between the metal layer and the glass substrate can be reduced or eliminated due to the improved bonding strength. In addition, the forming process of the sintering area has a repairing effect on the structural cracks generated in the glass substrate structure at the edge of the glass through hole.

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