Interconnection structure and interconnection unit

Abstract

The application provides an interconnection structure and an interconnection unit, and relates to the technical field of integrated circuits. The interconnection structure comprises an intermediate layer, a first interconnection layer, a second interconnection layer, a first base layer and a second base layer. The first interconnection layer comprises a first interconnection column, and the second interconnection layer comprises a second interconnection column. The first interconnection column and the second interconnection column have similar structures. The intermediate layer comprises a first spherical body, which is connected to one side of the first interconnection column and the second interconnection column respectively. The other side of the first interconnection column is connected to the first base layer, and the other side of the second interconnection column is connected to the second base layer. The interconnection structure and the interconnection unit can realize high-density electrical connection, thereby constructing a three-dimensional heterogeneous integrated structure of a multi-layer stacked chip, effectively buffering thermal mechanical stress, and providing key mechanical support and stress distribution optimization for the stacked structure.

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