Optical package structure

Abstract

An optical packaging structure mainly provides a glass carrier plate having opposite first and second sides and formed with a plurality of conductive vias connecting the first and second sides, and then an electronic module and an optical module are disposed on the glass carrier plate and electrically connected to the conductive vias, so as to reduce warping problems caused by thermal expansion mismatch during packaging by using the glass carrier plate.

Description

Technical Field

[0001] This application relates to a semiconductor packaging structure, and more particularly to an optical packaging structure. Background Technology

[0002] With the booming development of the electronics industry, electronic products are gradually moving towards multifunctionality and high performance. The application of fifth-generation (5G) communication technology has expanded to various fields such as the Internet of Things (IoT), Industrial Internet of Things (IIoT), cloud computing, artificial intelligence (AI), autonomous vehicles, and medical care. As applications expand, a massive amount of data needs to be efficiently transmitted, processed, and stored. The demand for data transmission, in particular, is surging, leading industries to replace electricity with light as the data transmission medium to improve transmission capacity, efficiency, and distance, while reducing energy consumption. Against this backdrop, co-packaged optical devices have become a future trend in semiconductor and packaging technologies.

[0003] Please see Figure 1 This is a cross-sectional schematic diagram of an existing co-packaged optical device 1. It mainly consists of an optoelectronic module 11 mounted on a circuit board 10. The optoelectronic module 11 includes a semiconductor chip 112 formed in a packaging structure 111 and an optical chip 113 mounted on the packaging structure 111. One end of the optical chip 113 is connected to an optical fiber 14, and a shelf 15 is provided below the junction of the optical chip 113 and the optical fiber 14 to allow optical signals to be transmitted to the optoelectronic module 11 for communication. At the same time, a switching IC 12 needs to be mounted on the circuit board 10 to be used in the terminal product. The switching IC 12 is first mounted on a substrate 13 and then mounted on the circuit board 10 through the substrate 13.

[0004] However, in the aforementioned co-packaged optical devices, the semiconductor chip is embedded in the packaging structure. Electrical connection between the semiconductor chip and the optical chip requires multiple circuit layers, and the optoelectronic module needs a substrate and circuit board to electrically connect with the conversion chip. Therefore, for future high-speed computing and data-intensive applications requiring the transmission of large amounts of information, message delays will occur. Furthermore, the optical chip and conversion chip must transmit signals through circuits within the circuit board and substrate, resulting in an excessively large and thick overall device size, hindering miniaturization of electronic products and potentially causing warping issues. The excessively long signal transmission path also easily leads to signal loss, causing problems in end-product applications. Additionally, there is a risk of the support structure being suspended, resulting in insufficient fiber optic support and potential breakage.

[0005] Therefore, overcoming the problems of the existing technology has become an urgent issue that needs to be addressed. Utility Model Content

[0006] In view of the various deficiencies of the prior art, this application provides an optical packaging structure, including: a glass substrate having a first side and a second side opposite to each other, and forming a plurality of conductive through holes connecting the first side and the second side; an electronic module disposed on the glass substrate and electrically connected to the plurality of conductive through holes; and an optical module disposed on the glass substrate and electrically connected to the plurality of conductive through holes.

[0007] This application also provides a method for manufacturing an optical packaging structure, comprising: providing a glass substrate having a first side and a second side opposite to each other, and forming a plurality of conductive through holes connecting the first side and the second side; and placing an electronic module and an optical module on the glass substrate and electrically connecting them to the plurality of conductive through holes.

[0008] In the aforementioned optical packaging structure and manufacturing method, the first side of the glass substrate defines an adjacent central region and a peripheral region surrounding the central region, and a groove and a plurality of conductive through holes are formed in the central region, so that a support portion protruding from the groove is formed in the peripheral region, and the electronic module and the optical module are housed in the groove.

[0009] In the aforementioned optical packaging structure and its manufacturing method, the optical module includes an optoelectronic integrated photonic chip and a second electronic component and an optical transmission component disposed on the optoelectronic integrated photonic chip.

[0010] In the aforementioned optical packaging structure and its manufacturing method, the optical transmission element abuts against the support portion of the glass substrate.

[0011] In the aforementioned optical packaging structure and its manufacturing method, the optical transmission element is connected to an optical fiber.

[0012] In the aforementioned optical packaging structure and its manufacturing method, the optoelectronic integrated photonic chip has a first surface and a second surface opposite to each other and forms a plurality of conductive holes connecting the first surface and the second surface, and includes electronic integrated circuit elements and photonic integrated circuit elements.

[0013] In the aforementioned optical packaging structure and its manufacturing method, the second electronic component is a high-bandwidth memory and is electrically connected to the plurality of conductive holes.

[0014] In the aforementioned optical packaging structure and its manufacturing method, the electronic module includes a circuit structure and a plurality of first electronic components disposed on the circuit structure.

[0015] In the aforementioned optical packaging structure and its manufacturing method, the plurality of first electronic components are a switching application-specific integrated circuit and a high-bandwidth memory.

[0016] The aforementioned optical packaging structure and its manufacturing method also include a plurality of conductive elements disposed on the second side of the glass substrate and electrically connected to the plurality of conductive through holes.

[0017] As can be seen from the above, the optical packaging structure of this application mainly houses the electronic module and the optical module in the groove of the glass substrate to reduce the overall height. At the same time, the low warpage, excellent thermal expansion characteristics and optical transparency of the glass substrate make it an ideal choice for solving warpage and providing integration of silicon photonics with multiple electronic components. In addition, the use of multiple conductive perforations in the glass substrate can not only reduce losses in optical and electrical connections (reduce transmission paths), but also improve the performance and integration of the overall system, thereby meeting the needs of modern data processing and transmission. Furthermore, by forming a support portion that protrudes from the groove in the outer area of ​​the glass substrate, the optical transmission element can be abutted against, thereby stabilizing the optical transmission element through the support of the support portion. This can effectively increase the accuracy of the optical signal and effectively reduce alignment losses, while avoiding the problem of breakage caused by the optical transmission element being suspended. Attached Figure Description

[0018] Figure 1 This is a cross-sectional schematic diagram of an existing co-packaged optical device.

[0019] Figures 2A to 2C This is a cross-sectional schematic diagram of the optical packaging structure and its manufacturing method of this application.

[0020] Explanation of reference numerals in the attached figures

[0021] 1. Co-packaged optical devices

[0022] 10 Circuit Boards

[0023] 11 Optoelectronic Modules

[0024] 111 Package Structure

[0025] 112 Semiconductor wafers

[0026] 113 Optical Chip

[0027] 12 conversion chips

[0028] 13 substrate

[0029] 14 optical fibers

[0030] 15 brackets

[0031] 2. Optical Packaging Structure

[0032] 20 Glass substrate

[0033] 20a First side

[0034] 20b Second side

[0035] 201 Groove

[0036] 202 Support Section

[0037] 203 Conductive Through-hole

[0038] 21 Electronic Modules

[0039] 210 Line Structure

[0040] 211 First Electronic Components

[0041] 212 First conductive bump

[0042] 22 Optical Modules

[0043] 220 Optoelectronic Integrated Photonic Chip

[0044] 2200 conductive hole

[0045] 221 Second Electronic Component

[0046] 222 Optical transmission element

[0047] 223 Second conductive bump

[0048] 224 fiber optic cable

[0049] 23 Fill layer

[0050] 24 Conductive elements

[0051] C Central Area

[0052] P Outer area. Detailed Implementation

[0053] The following specific embodiments illustrate the implementation of this application. Those skilled in the art can easily understand other advantages and effects of this application from the content disclosed in this specification.

[0054] It should be understood that the structures, proportions, sizes, etc., depicted in the accompanying drawings are merely for illustrative purposes to aid those skilled in the art in understanding and reading the content disclosed herein, and are not intended to limit the scope of this application. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in proportions, or adjustments to size, without affecting the effectiveness and purpose of this application, should still fall within the scope of the technical content disclosed herein. Furthermore, the terms such as "above," "first," "second," "third," and "one" used in this specification are merely for clarity of description and are not intended to limit the scope of this application. Changes or adjustments to their relative relationships, without substantially altering the technical content, should also be considered within the scope of this application's implementation.

[0055] Please see Figures 2A to 2C This is a cross-sectional schematic diagram of the optical packaging structure and its manufacturing method of this application.

[0056] like Figure 2A As shown, a glass carrier plate 20 is provided. In this embodiment, the glass carrier plate 20 has opposing first sides 20a and second sides 20b. The first side 20a defines an adjacent central region C and a peripheral region P surrounding the central region C. A groove 201 is formed in the central region C, so that a support portion 202 protruding from the groove 201 is formed in the peripheral region P. The groove 201 can be formed by laser cutting or cutting with a tool.

[0057] Furthermore, the glass substrate 20 has a plurality of conductive through-holes 203, such as conductive silicon through-holes (TSVs), formed in the central region C to connect the first side 20a and the second side 20b.

[0058] like Figure 2B As shown, at least one electronic module 21 and at least one optical module 22 are disposed in the groove 201. In the illustration of this embodiment, an electronic module 21 is provided at the center of the groove 201, and a plurality of optical modules 22 are provided around the electronic module 21, so that the electronic module 21 and the plurality of optical modules 22 are accommodated in the groove 201 of the glass carrier plate 20.

[0059] The electronic module 21 includes a circuit structure 210, a plurality of first electronic components 211 and a plurality of first conductive bumps 212.

[0060] The circuit structure 210 includes an insulating layer and a circuit layer bonded to the insulating layer. The insulating layer is made of a dielectric material such as polybenzoxazole (PBO), polyimide (PI), or prepreg (PP). The circuit layer is, for example, a fan-out type redistributed circuit layer, and its material is, for example, metallic copper.

[0061] The plurality of first electronic components 211, such as switch ASICs and high bandwidth memory (HBM), are disposed on one side of the circuit structure 210 and electrically connected to the circuit layer.

[0062] The plurality of first conductive bumps 212 are, for example, solder balls or copper metal blocks, which are disposed on the other side of the circuit structure 210 and electrically connected to the circuit layer, so that the electronic module 21 can be placed in the groove 201 of the glass substrate 20 through the plurality of first conductive bumps 212 and electrically connected to the plurality of conductive through holes 203.

[0063] The optical module 22 is, for example, an optical engine, which includes an optoelectronic integrated photonic chip (EPIC) 220, at least one second electronic component 221, an optical transmission element 222, and a plurality of second conductive bumps 223.

[0064] In this embodiment, the optoelectronic integrated photonic chip 220 has opposing first and second surfaces and includes electronic integrated circuit elements (EIC) and photonic integrated circuit elements (PIC). It also has a plurality of conductive holes 2200 (e.g., conductive silicon vias) connecting the first and second surfaces, which can directly perform signal conversion and transmission, thereby avoiding the problems of signal delay and large amount of heat generation caused by the transmission of signals between long lines in the existing structure.

[0065] The second electronic component 221 is, for example, a high-bandwidth memory (HBM), which is disposed on the first surface of the optoelectronic integrated photonic chip 220 and electrically connected to the optoelectronic integrated photonic chip 220. The second electronic component 221 can be directly electrically connected to the optoelectronic integrated photonic chip 220 through the plurality of conductive vias 2200 to improve signal transmission speed.

[0066] The optical transmission element 222 can be, for example, a lens structure, a reflective element, an optical fiber module, an optical fiber slot, an optical fiber array unit, or a waveguide array. It is disposed on the optoelectronic integrated photonic chip and can be connected to the optical fiber 224. At the same time, the optical transmission element 222 can abut against the support portion 202 of the peripheral region P of the glass substrate 20, so that the optical transmission element 222 is stabilized by the support portion 202, which can effectively increase the accuracy of the optical signal and reduce alignment loss. For example, the optical signal provided by the laser and / or optical fiber can be effectively introduced into the optoelectronic integrated photonic chip 220 through the optical transmission element 222, while avoiding the problem of breakage caused by the optical transmission element 222 being suspended.

[0067] The plurality of second conductive bumps 223 are, for example, solder balls or copper metal blocks, which are disposed on the second surface of the optoelectronic integrated photonic chip 220 and electrically connected to the optoelectronic integrated photonic chip 220, so that the optical module 22 can be placed in the groove 201 of the glass substrate 20 through the plurality of second conductive bumps 223 and electrically connected to the plurality of conductive through holes 203.

[0068] like Figure 2C As shown, a filling layer 23 is formed between the electronic module 21 and the glass substrate 20 and between the optical module 22 and the glass substrate 20 to cover the plurality of first conductive bumps 212 and the plurality of second conductive bumps 223. A plurality of conductive elements 24 electrically connected to the plurality of conductive through holes 203 are provided on the second side 20b of the glass substrate 20 to obtain the optical packaging structure 2 of this application.

[0069] In this embodiment, the filler layer 23 is, for example, a primer, and the plurality of conductive elements 24 are, for example, solder balls or copper metal blocks, so that the optical packaging structure 2 can be electrically connected to an external device, such as a circuit board, through the plurality of conductive elements 24.

[0070] Compared to traditional optical chips and conversion chips that require signal transmission through circuits within circuit boards and substrates, this application integrates electronic integrated circuit elements and photonic integrated circuit elements into a chip group (optoelectronic integrated photonic chip 220), which can directly perform signal conversion and transmission. This avoids the signal delay and heat generation problems caused by long-distance signal transmission in existing structures. At the same time, the electronic module 21 and the optical module 22 can be electrically coupled to each other through multiple conductive through-holes 203 of the glass substrate 20 or directly electrically connected to the circuit board of external devices, achieving optimized transmission distance. The integration of multiple components enables advantages such as increased transmission rate and increased space utilization.

[0071] Through the aforementioned manufacturing method, this application discloses an optical packaging structure 2, which includes a glass substrate 20 and an electronic module 21 and an optical module 22 disposed on the glass substrate 20.

[0072] The glass substrate 20 has a first side 20a and a second side 20b. The first side 20a defines an adjacent central region C and a peripheral region P. A groove 201 is formed in the central region C, so that a support portion 202 protruding from the groove 201 is formed in the peripheral region P. A plurality of conductive through holes 203 connecting the first side 20a and the second side 20b are formed in the central region C. The coefficient of thermal expansion of the glass substrate 20 is close to that of silicon, which can reduce the warping problem caused by thermal expansion mismatch during the packaging process.

[0073] The electronic module 21 is housed in the recess 201 and includes a circuit structure 210, a plurality of first electronic components 211 disposed on one side of the circuit structure 210, and a plurality of first conductive bumps 212 disposed on the other side of the circuit structure 210. The plurality of first electronic components 211 are, for example, switch ASICs and high bandwidth memory (HBM), so that the electronic module 21 can be electrically connected to a plurality of conductive through holes 203 of the glass substrate 20 through the plurality of first conductive bumps 212.

[0074] The optical module 22 is housed in the recess 201 and includes an optoelectronic integrated photonic chip (EPIC) 220, as well as a second electronic component 221, a light transmission element 222, and a plurality of second conductive bumps 223 disposed on the optoelectronic integrated photonic chip 220. The optoelectronic integrated photonic chip 220 has a plurality of conductive holes 2200 connecting the two opposing surfaces, so that the second electronic component 221 (e.g., HBM) is disposed on the first surface of the optoelectronic integrated photonic chip 220 and electrically connected to the optoelectronic integrated photonic chip 220, and the light transmission element 222 is disposed on the first surface of the optoelectronic integrated photonic chip 220 and abuts against the support portion 202 of the glass substrate 20. At the same time, the optical module 22 can be electrically connected to the plurality of conductive through holes 203 of the glass substrate 20 through the plurality of second conductive bumps 223.

[0075] In summary, the optical packaging structure of this application primarily houses the electronic module and the optical module within a groove in a glass substrate to reduce the overall height. Simultaneously, the low warpage, excellent thermal expansion characteristics, and optical transparency of the glass substrate make it an ideal choice for solving warpage and providing integration of silicon photonics with multiple electronic components. Furthermore, the use of multiple conductive perforations in the glass substrate not only reduces losses in optical and electrical connections (reducing transmission paths) but also improves the overall system performance and integration, thereby meeting the needs of modern data processing and transmission. Additionally, by forming a support portion protruding from the groove in the peripheral area of ​​the glass substrate, the optical transmission element can rest against it, stabilizing the optical transmission element through the support of this portion. This effectively increases the accuracy of the optical signal delivery and effectively reduces alignment losses, while preventing the optical transmission element from breaking due to being suspended in the air.

[0076] The above embodiments are used to illustrate the principles and effects of this application, and are not intended to limit this application. Those skilled in the art can modify the above embodiments without departing from the spirit and scope of this application. Therefore, the scope of protection of this application should be as set forth in the claims.

Images