An electronic endoscope device

Abstract

The specification discloses an electronic endoscope device, comprising a host end and an image acquisition end, the host end and the image acquisition end having a cable therebetween, the host end comprising a host controller and a first buffer, the image acquisition end comprising an image sensor and a second buffer, the electronic endoscope device further comprising an I2C isolator, wherein: the host controller and the first buffer are connected, the I2C isolator is located between the first buffer and the second buffer, one end of the first buffer and the I2C isolator is connected, the other end of the I2C isolator and the second buffer are connected, and the image sensor and the second buffer are connected. In the specification, by arranging the I2C isolator between the two buffers, long-distance stable transmission of the I2C communication signal is realized.

Description

Technical Field

[0001] This manual relates to the field of medical devices, and in particular to an electronic endoscope. Background Technology

[0002] An electronic endoscope consists of a main controller and an image sensor. The image sensor acquires images and transmits them to the main controller, which processes the images and outputs them to a display device. Simultaneously, the main controller can also transmit control signals to the image sensor to control it. The image sensor and the main controller communicate via an Inter-Integrated Circuit (I2C) bus. Because the image sensor needs to be inserted into the human body, an I2C isolator is typically installed between the image sensor and the main controller to electrically isolate the image sensor from the patient and prevent electric shock.

[0003] However, with longer cables between the image sensor and the host controller, the capacitive load on the cable increases. During the transmission of the I2C isolator's output signal to the image sensor, if the isolator's driving capability is weakened, or if the communication level between the image sensor and the host controller is low, the rise and fall of the I2C signal waveform slows down, reducing the communication hold time and increasing the probability of communication anomalies. Currently, reducing the communication rate is commonly used to extend the stable signal transmission time. However, reducing the communication rate also reduces the efficiency of data transmission between the host controller and the image sensor. Utility Model Content

[0004] This specification provides an electronic endoscope device that at least partially solves the aforementioned problems existing in the prior art.

[0005] The following technical solution is adopted in this specification:

[0006] In a first aspect, this specification provides an electronic endoscope device, including a host terminal and an image acquisition terminal, which are connected by a cable. The host terminal includes a host controller and a first buffer, and the image acquisition terminal includes an image sensor and a second buffer. The electronic endoscope device further includes an I2C isolator, wherein: the host controller is connected to the first buffer; the I2C isolator is located between the first buffer and the second buffer, one end of the first buffer is connected to the I2C isolator, and the other end of the second buffer is connected to the I2C isolator; the image sensor is connected to the second buffer.

[0007] Optionally, both the first buffer and the second buffer have two connection ports, namely a current drive port and an open-drain port; the open-drain port of the first buffer is connected to one end of the I2C isolator, and the current drive port of the second buffer is connected to the other end of the I2C isolator.

[0008] Optionally, the I2C isolator has a first connection port and a second connection port, with a diode at the first connection port serving as a pull-down resistor; the open-drain port of the first buffer is connected to the first connection port of the I2C isolator, and the current drive port of the second buffer is connected to the second connection port of the I2C isolator.

[0009] Optionally, the host controller and the first buffer are connected via a first cable, the second buffer and the image sensor are connected via a second cable, the first buffer and the I2C isolator are connected via a third cable, and the I2C isolator and the second buffer are connected via a fourth cable.

[0010] Optionally, the host terminal also includes the I2C isolator, with the first cable and the third cable located inside the host terminal.

[0011] Optionally, the low level of the first connection port of the I2C isolator is 0.5V, and the low level of the second connection port of the I2C isolator is 0V.

[0012] Optionally, the communication level between the I2C isolator and the first buffer is 3.3V, and the communication level between the I2C isolator and the second buffer is 3.3V.

[0013] Optionally, the distance between the first buffer and the host controller is greater than the distance between the first buffer and the I2C isolator.

[0014] Optionally, the first buffer and the I2C isolator are located on the same circuit board, and the third cable is located on the same circuit board.

[0015] Optionally, the image acquisition terminal includes the I2C isolator, the second buffer, and the image sensor, with the first cable located inside the host terminal and the second and fourth cables located inside the image acquisition terminal.

[0016] The above-mentioned technical solutions adopted in this specification can achieve the following beneficial effects:

[0017] This embodiment of the specification incorporates an I2C isolator, a first buffer, and a second buffer in an electronic endoscope device. The I2C isolator isolates the host device from the image acquisition device. The first and second buffers enhance signal driving capability and reduce output impedance. This allows the signal to overcome the effects of cable capacitance load more quickly during long-distance transmission, accelerating signal rise and fall speeds and ensuring sufficient signal holding time at the specified level to meet device sampling requirements and reduce the probability of communication anomalies. Furthermore, the I2C isolator performs level conversion on the signal transmitted between the host and image acquisition devices, ensuring the I2C isolator detects a higher signal level than the transmitted signal level between the host and image acquisition devices. This increases the difference between high and low level signals between the host and image acquisition devices, reducing the probability of signal level misidentification and further lowering the probability of communication anomalies. In summary, by employing the first and second buffers, the solution in this embodiment reduces the probability of communication anomalies without reducing communication speed, ensuring communication quality and efficiency. Attached Figure Description

[0018] The accompanying drawings, which are included to provide a further understanding of this specification and form part of this specification, illustrate exemplary embodiments and are used to explain this specification, but do not constitute an undue limitation thereof. In the drawings:

[0019] Figure 1 This is a schematic diagram of the isolated end and non-isolated end of the electronic endoscope device according to an embodiment of this specification;

[0020] Figure 2 This is an internal circuit diagram of the isolation terminal of the electronic endoscope device according to an embodiment of this specification;

[0021] Figure 3 This is a schematic diagram illustrating the isolation method between the endoscope host and the image sensor in related technologies;

[0022] Figure 4 This is a schematic diagram of the physical interface topology of I2C isolation at both ends in related technologies;

[0023] Figure 5 This is a schematic diagram illustrating the isolation method between the endoscope host and the image sensor in an embodiment of this specification;

[0024] Figure 6A , Figure 6B and Figure 6C They are respectively Figure 5 A schematic diagram of the components of the endoscope host and image sensor under the isolation method shown;

[0025] Figure 7A and Figure 7BThis is a schematic diagram of the cable length in the electronic endoscope device according to an embodiment of this specification. Detailed Implementation

[0026] To make the objectives, technical solutions, and advantages of this specification clearer, the technical solutions of this specification will be clearly and completely described below in conjunction with specific embodiments and corresponding drawings. Obviously, the described embodiments are only a part of the embodiments of this specification, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments in this specification without creative effort are within the scope of protection of this application.

[0027] See Figure 1 and Figure 2 The electronic endoscope device 10 may include a host terminal 101 and an image acquisition terminal 102, wherein the host terminal 101 is a non-isolated terminal, and the image acquisition terminal 102 is an isolated terminal. See also Figure 2 The image acquisition unit is used to acquire images and can be roughly divided into three parts mechanically: the part inserted into the human body, including the image sensor 1021, which, together with the lens, forms the image acquisition part of the endoscope; the operating component 1022, which is held by the operator or fixed using other instruments; and the transmission component 1023, generally consisting of an insertion plug and a transmission cable, used to insert into the host unit 101 and transmit the processed image signal to the host unit 101. In addition to acquiring images and powering the image acquisition unit 102, the host unit 101 also needs to provide control information, typically via I2C control for the image sensor.

[0028] Since the endoscope in the image acquisition terminal 102 needs to be inserted into the human body, it needs to be defined as the application part and isolated as an isolation terminal to prevent electric shock hazards. The host terminal 101, used for image information processing and providing power and control information to the image acquisition terminal 102, is a non-isolated terminal and does not require isolation. The control information of the host terminal 101 uses I2C control, and the object to be controlled is the image sensor of the image acquisition terminal 102. Therefore, an I2C isolator can be used to isolate the I2C signals transmitted by the host terminal 101. Figure 3 As shown, the I2C isolator 103 is connected between the host terminal 101 and the image acquisition terminal 102.

[0029] To achieve bidirectional communication, the physical interface topology at both ends of the I2C isolator 103 will differ, such as... Figure 4As shown in the diagram. SDA1 represents the serial data line input / output pin on the master side, SCL1 represents the walkthrough clock line input pin on the master side, VCC1 represents the power supply voltage input pin on the master side, and GND1 represents the ground pin on the master side. SDA2 represents the serial data line input / output pin on the slave side, SCL2 represents the walkthrough clock line output pin on the slave side, VCC2 represents the power supply voltage input pin on both the master and slave sides, and GND2 represents the ground pin on the slave side. REF This indicates the reference voltage input pin. When the voltage on SDA2 or SCL2 is higher than V... REF When this occurs, the I2C isolator recognizes it as a logic high level. The I2C isolator enables bidirectional signal transmission and communication. The SDA1 / SCL1 port represents the first connection port of the I2C isolator, and the SDA2 / SCL2 port represents the second connection port of the I2C isolator. The middle part is an isolation capacitor. Both the first and second connection ports can be used as input / output ports for signal transmission.

[0030] Using I2C isolator 103 to isolate I2C signals results in high communication quality when the following conditions are met: ① short distance; and ② sufficiently high communication level. However, in practical applications, the communication level between the host 101 and the image acquisition terminal 102 is often low, and the communication distance is usually relatively long (e.g., greater than 5m). In this case, the following problems may occur:

[0031] (1) When the communication level between the host terminal 101 and the image acquisition terminal 102 is low, it may cause communication identification errors and communication abnormalities;

[0032] (2) When the distance is long, the probability of communication failure increases. In order to reduce the probability of communication failure, the communication rate needs to be reduced, which affects the configuration speed of the host 101 to the image acquisition terminal 102 and the speed of acquiring dynamic data from the image sensor.

[0033] Based on this, the embodiments of this specification use I2C buffers and I2C isolators to achieve long-distance and isolated transmission of I2C communication. The specific solutions of the embodiments of this specification are illustrated below with reference to the accompanying drawings.

[0034] like Figure 5 , Figure 6A , Figure 6B and Figure 6CAs shown in the figure, this embodiment of the specification provides an electronic endoscope device 10, including a host terminal 101 and an image acquisition terminal 102, which are connected by a cable. The host terminal 101 includes a host controller 1011 and a first buffer 1012, and the image acquisition terminal 102 includes an image sensor 1021 and a second buffer 1024. The electronic endoscope device 10 also includes an I2C isolator 103. The host controller 1011 and the first buffer 1012 are connected, and the I2C isolator is located between the first buffer 1012 and the second buffer 1024. The first buffer 1012 is connected to one end of the I2C isolator 103, and the second buffer 1024 is connected to the other end of the I2C isolator 103. The image sensor 1021 and the second buffer 1024 are connected. Optionally, both the first buffer and the second buffer are I2C buffers.

[0035] The host terminal 101 can supply power to the image acquisition terminal 102 and transmit control signals to it. These control signals can be used to control the image acquisition terminal 102. For example, the host terminal 101 can control the endoscope of the image acquisition terminal 102 to open or close, or switch the image acquisition mode of the endoscope, such as switching from standard mode to high-definition mode. The host terminal 101 can also configure the parameters of the image acquisition terminal 102 (such as gain, exposure time, etc.) to optimize image quality. In addition, the control signals transmitted by the host terminal 101 can also adjust the image transmission frequency or dynamically configure the pixel resolution. These control signals can be sent to the image acquisition terminal 102 through a dedicated transmission channel (such as an I2C bus). After receiving the signals, the image acquisition terminal 102 can check the validity of the parameters, perform the corresponding operations, and feed back the operation results to the host terminal 101.

[0036] In practical applications, to reduce device power consumption, the communication level between the host terminal 101 and the image acquisition terminal 102 is low, such as below 2V (taking 1.8V as an example below). Furthermore, to avoid the need for an I2C isolator at the first connection port (e.g., ... Figure 5 The end marked "1" is shown in the middle) and the second connection port (as shown in the middle). Figure 5 Misidentification of communication (as shown at the end marked "2") will cause a diode D (such as...) to be added to the first connection port. Figure 4 As shown, when the second connection port is input with a low level of 0V, the response output level of the first connection port may be around 0.5V. For the 1.8V communication level between the host end 101 and the image acquisition end 102, the 0.5V low level of the first connection port may be misidentified under slight interference.

[0037] To address the above issues, this embodiment introduces a first buffer 1012 and a second buffer 1024 for level conversion. During the signal transmission from the host terminal 101 to the image acquisition terminal 102, the first buffer 1012 performs level conversion on the signal sent by the host terminal 101 and outputs the converted signal to the I2C isolator 103. The level after conversion by the first buffer 1012 is higher than the level before conversion. As mentioned above, when the host terminal 101 is not sending a signal to the image acquisition terminal 102, since a diode is connected to the first connection port of the I2C isolator 103, the low level that the first connection port of the I2C isolator 103 can reach is only up to the diode's forward voltage drop. The difference between this forward voltage drop and the level before conversion by the first buffer 1012 is small, which may lead to a misinterpretation of a low level as a high level. After conversion by the first buffer 1012, the signal level at the first connection port of the I2C isolator 103 is higher, and the difference between this level and the diode's forward voltage drop is greater, thereby reducing the probability of misinterpreting a low level as a high level.

[0038] Similarly, the second buffer 1024 can perform level conversion on the signal output by the I2C isolator 103 and output the converted signal to the image acquisition terminal 102. The level after conversion by the second buffer 1024 is lower than the level before conversion, so that the signal level obtained by the image acquisition terminal 102 is compatible with the working level of the image acquisition terminal 102.

[0039] The following numerical example illustrates the above level conversion process. In this embodiment, the initial level of the signal sent by the host 101 is 1.8V. After conversion by the first buffer 1012, the signal level is converted to 3.3V, that is, the input voltage of the first connection port of the I2C isolator 103 is 3.3V. See also... Figure 4When the first connection port of I2C isolator 103 changes between high and low communication levels, the level of the second connection port of I2C isolator 103 will change between VCC2 and GND2 (signal ground). However, when the level of the second connection port of I2C isolator 103 changes, since a diode is connected in parallel to ground at the output of the first connection port of I2C isolator 103, and the forward voltage drop of the diode is usually about 0.7V, the low level that the first connection port can reach in response to the change of the second connection port is only up to the forward voltage drop of the diode, that is, about 0.7V, rather than GND1 (signal ground). Since the signal level sent by the host terminal 101 is converted from 1.8V to 3.3V through the first buffer 1012 in this embodiment, there is a significant difference between the above-mentioned 0.7V voltage and the 3.3V voltage, thus reducing the probability of misinterpreting a low level as a high level. Furthermore, the I2C isolator 103 can output a 3.3V signal to the second buffer 1024, which can convert the signal into a 1.8V signal and output it to the image acquisition terminal 102.

[0040] Furthermore, over longer distances, the capacitive load of the cable increases. During signal transmission from the output of the I2C isolator 103 to the image acquisition terminal 102, if the driving capability of the I2C isolator 103 is weak or the communication level is low, the rise and fall of the waveform will become very slow, reducing the communication hold time and increasing the probability of communication anomalies. In this embodiment, the first buffer 1012 can enhance the signal driving capability and reduce the output impedance. In this way, even without reducing the communication rate, the signal can overcome the influence of the cable's capacitive load more quickly during long-distance transmission, accelerating the rise and fall of the signal and ensuring that the signal holds at the specified level for a sufficiently long time. Therefore, this embodiment can reduce the probability of communication anomalies while maintaining a high communication rate.

[0041] During the transmission of signals from the image acquisition terminal 102 to the host terminal 101, the second buffer 1024 converts the low-level signal output by the image acquisition terminal 102 into a high-level signal and outputs it to the I2C isolator 103. The first buffer 1012 converts the high-level signal output by the I2C isolator 103 into a low-level signal and outputs it to the host terminal 101. The specific process can be referred to the aforementioned embodiment, and will not be repeated here.

[0042] In some embodiments, both the first buffer 1012 and the second buffer 1024 include a current-driven port and an open-drain port. The current-driven port of the first buffer 1012 is connected to the host terminal 101, and the open-drain port of the first buffer 1012 is connected to one end of the I2C isolator 103. The current-driven port of the second buffer 1024 is connected to the other end of the I2C isolator 103, and the open-drain port of the second buffer 1024 is connected to the image acquisition terminal 102. The current-driven port is as follows: Figure 5 As shown in the diagram, the end marked B has an open-drain port as follows: Figure 5 The terminal labeled A is shown in the diagram. The current-driven port is responsible for the complete output of the control signal in the circuit, and can actively adjust the current and level to directly drive the load. The open-drain port mainly participates in the pull-down control of the signal.

[0043] In some embodiments, the first connection port of the I2C isolator 103 is a current-driven port, and the second connection port of the I2C isolator 103 is an open-drain port. In some embodiments, a diode is provided at the first connection port of the I2C isolator 103 as a pull-down resistor. In some embodiments, the anode of the diode is grounded, and the cathode of the diode is connected to the first connection port of the I2C isolator 103. In the I2C isolator 103, bidirectional communication is achieved through two back-to-back unidirectional channels. If the two unidirectional channels are directly connected, the I2C isolator 103 will enter a channel-locked state. When both channels attempt to output a low level simultaneously, the field-effect transistors (FETs) on both sides will be turned on, causing the voltage on both sides to be pulled low and maintained at a low level (approximately 0V). At this time, the signal cannot be toggled, and communication stops. To avoid this situation, the diode connected to the output terminal of one side of the host terminal 101 (hereinafter referred to as side 1) is used to make the low-level output of the side 1 output channel regarded as the high level of the side 1 input channel. Due to the presence of this diode, the low level of the side 1 output can reach up to 0.8V. When the side connected to the image acquisition terminal (hereinafter referred to as side 2) detects a low level input on side 2, side 1 will turn on the field-effect transistor, causing the diode to conduct and generating a non-zero forward voltage. The non-zero forward voltage is transmitted to side 2 through isolation, preventing the field-effect transistors on side 2 from being turned on, thereby preventing side 2 from being pulled low and locked.

[0044] In some embodiments, the host controller 1011 and the first buffer 1012 are connected via a first cable, the second buffer 1024 and the image sensor 1021 are connected via a second cable, the first buffer 1012 and the I2C isolator 103 are connected via a third cable, and the I2C isolator 103 and the second buffer 1024 are connected via a fourth cable.

[0045] Whether it's the first buffer 1012, the second buffer 1024, or the I2C isolator 103, their two ports have different characteristics. Therefore, it's necessary to determine an optimal connection method to maintain stable I2C communication. Examples of connection methods for each device are provided below.

[0046] In a practical electronic endoscope device 10, the image sensor 1021 is located at the instrument end and needs to be inserted into the human body to acquire images during actual use. The host controller 1011 is responsible for processing the acquired images and outputting the processed images to the display device. There is typically a distance of several meters (e.g., 5 meters) between the image sensor 1021 and the host controller 1011. Because the endoscope itself is relatively small, the processing of endoscope signal isolation is generally placed at the host end 101, meaning the I2C isolator 103 is located at the host end 101. Figure 6A As shown. With the host end 101 including the I2C isolator 103, the first cable and the third cable are both located inside the host end 101, and the second cable is located inside the image acquisition end 102. By placing the I2C isolator 103 in the host end 101, the size and complexity of the instrument end can be effectively reduced, making the image acquisition end 102 lighter and easier to operate.

[0047] In other embodiments, the I2C isolator 103 may also be located at the image acquisition terminal 102, such as... Figure 6B As shown. In this configuration, the first cable is located inside the host unit 101, while the second and fourth cables are located inside the image acquisition unit 102. This approach simplifies the circuit design of the host unit 101, allowing it to focus on its core functions and enhancing the overall system's modularity.

[0048] In other examples, the first buffer 1012, the I2C isolator 103, and the second buffer 1024 can also be located in an isolation component 104 independent of the host terminal 101 and the image acquisition terminal 102, such as... Figure 6C As shown. This simplifies the circuit design of the host unit 101 and reduces the size and complexity of the instrument. Furthermore, the isolation component 104 can be flexibly connected between the host unit and the image acquisition unit without an I2C buffer, enabling isolation between the host unit and the image acquisition unit even when neither has an I2C buffer. Moreover, the isolation component 104 can be reused by multiple host units and multiple image acquisition units, effectively reducing hardware costs.

[0049] In some embodiments, the low level of the first connection port of the I2C isolator 103 is 0.5V, and the low level of the second connection port of the I2C isolator 103 is 0V.

[0050] In an embodiment where both the first buffer 1012 and the I2C isolator 103 are located on the host side 101, see [link to previous document]. Figure 7A To avoid signal interference caused by excessive communication distance between the first buffer 1012 and the I2C isolator 103, the distance between the first buffer 1012 and the host controller 1011 can be set to be greater than the distance between the first buffer 1012 and the I2C isolator 103. In one application scenario, the length of the first cable between the host controller 1011 and the first buffer 1012 can be set to an integer multiple of 10cm, and the length of the third cable between the first buffer 1011 and the I2C isolator 103 can be set to a shorter length such as 1cm or 2cm. This ensures that the third cable is shorter than the first cable, keeping the first buffer 1012 close to the I2C isolator 103 and away from the host controller 1011. The host end 101 and the image acquisition end 102 can be connected by a cable longer than 1m (e.g., 5m).

[0051] Further, see Figure 7B Alternatively, the first buffer 1012 and the I2C isolator 103 can be located on the same circuit board, with the third cable also located on this circuit board. Placing the first buffer 1012 and the I2C isolator 103 on the same circuit board can reduce signal loss and reflection during transmission. It can also reduce production costs, optimize PCB layout design, and reduce the complexity of materials and manufacturing processes. In addition, it can reduce the interface design work between modules, making the overall design more compact, and can reduce signal interference to external circuits, while also reducing the impact of external noise on the signal.

[0052] Combining the wiring characteristics of endoscope equipment with the port characteristics of I2C buffers and I2C isolators, and combining... Figure 6A Based on the structure shown, the following scheme is proposed to achieve stable long-distance transmission and isolation of I2C communication:

[0053] (1) A 5m long cable is set between the host end 101 and the image acquisition end 102. The current drive port B of the second buffer 1024 of the image acquisition end 102 is connected to the second connection port of the I2C isolator 103. The B end of the second buffer 1024 is for current drive communication. The low level of the second connection port of the I2C isolator 103 is the normal 0V low level. Stable communication can be achieved during long-distance communication.

[0054] (2) Inside the host 101, the second connection port of the I2C isolator 103 is connected to the image acquisition terminal 102, and the first connection port of the I2C isolator 103 is connected to the inside of the host 101. The low level of its first connection port is about 0.5V. In order to avoid interference during long-distance communication, the first buffer 1012 is placed near the I2C isolator 103, rather than near the host controller 1011. Therefore, the first buffer 1012 will be far away from the host controller 1011. The current drive port B of the first buffer 1012 is connected to the host controller 1011 to achieve stable long-distance communication. The open-drain port A of the first buffer 1012 is connected to the first connection port of the I2C isolator 103.

[0055] In some embodiments, this specification also provides an isolation component disposed between the endoscope host and the endoscope tip for electrically isolating the endoscope host and the endoscope tip in an electronic endoscope device. The isolation component includes: an isolator for detecting the level of a control signal output by the endoscope host; the isolator includes a protection element for boosting the low level of the control signal to be no lower than the on-state voltage of the protection element, thereby preventing communication conflicts from occurring in the bidirectional isolation channels at both ends of the isolator due to simultaneous low-level outputs at both ends; a first buffer for boosting the high level of the control signal to the power supply voltage and reducing the low level of the control signal to 0 voltage; the input of the first buffer is connected to the endoscope host, the output of the first buffer is connected to the input of the isolator, and the output of the isolator is connected to the endoscope tip, the endoscope tip being used to acquire images in response to the control signal from the endoscope host.

[0056] Optionally, the endoscope host can be the host terminal 101 in the electronic endoscope device 10, the endoscope front end can be the image acquisition terminal 102 in the electronic endoscope device 10, the isolator can be the I2C isolator 103 in the electronic endoscope device, the protection element can be the diode D at the first connection port of the I2C isolator 103, and the first buffer and the second buffer are the first buffer 1021 and the second buffer 1024 in the electronic endoscope device 10, respectively.

[0057] In this embodiment, an isolation component is provided between the endoscope host and the endoscope tip. This isolation component includes an isolator and a first buffer. The first buffer can boost the high level of the control signal output by the endoscope host to the power supply voltage (e.g., 3.3V) and reduce the low level of the control signal to 0V. This increases the difference between the high and low levels of the control signal, thereby reducing the probability of signal level misinterpretation and thus reducing the probability of communication abnormalities.

[0058] For example, in this embodiment, the control signal level is 1.8V, and without the first buffer, the input voltage of the isolator is also 1.8V. Furthermore, since the isolator includes a diode, and the forward voltage drop of the diode is typically about 0.7V, the low level of the control signal can only reach the forward voltage drop of the diode, approximately 0.7V. With the first buffer, the high level of the control signal can be boosted to the power supply voltage (e.g., 3.3V), and the low level of the control signal can be reduced to 0V. This conversion increases the difference between the high and low levels of the control signal, thereby reducing the probability of misidentification of the signal level and consequently reducing the probability of communication anomalies.

[0059] Furthermore, buffers enhance signal driving capability and reduce output impedance. This allows the signal to overcome the effects of cable capacitance load more quickly during long-distance transmission, accelerating signal rise and fall speeds. This ensures the signal remains at the specified level for a sufficiently long time to meet equipment sampling requirements and further reduces the probability of communication anomalies.

[0060] In some embodiments, this specification provides an electronic endoscope device. The isolation component in any of the foregoing embodiments further includes: an endoscope host for outputting control signals; an endoscope tip for image acquisition in response to the control signals from the endoscope host; and an isolation component disposed between the endoscope host and the endoscope tip. The isolation component includes an isolator and a first buffer. The input of the first buffer is connected to the endoscope host, the output of the first buffer is connected to the input of the isolator, and the output of the isolator is connected to the endoscope tip. The isolator detects the level of the control signal and transmits the detected control signal level to the endoscope tip through the isolation component to achieve electrical isolation between the endoscope host and the endoscope tip. The isolator includes a protection element for boosting the low level of the control signal to a level not lower than the forward voltage of the protection element, thereby preventing simultaneous low-level outputs at both ends of the isolator from causing communication conflicts in the bidirectional isolation channels at both ends of the isolator. The first buffer boosts the high level of the control signal to the power supply voltage and reduces the low level of the control signal to 0 voltage.

[0061] In this embodiment, an isolation component is provided between the endoscope main unit and the endoscope tip of the electronic endoscope device. This isolation component includes an isolator and a first buffer. The first buffer can boost the high level of the control signal output by the endoscope main unit to the power supply voltage (e.g., 3.3V) and reduce the low level of the control signal to 0V. This increases the difference between the high and low levels of the control signal, thereby reducing the probability of signal level misinterpretation and thus reducing the probability of communication anomalies. Furthermore, the buffer enhances the signal driving capability and reduces the output impedance. As a result, during long-distance transmission, the signal can overcome the influence of cable capacitive load more quickly, accelerating the rise and fall speeds of the signal. This ensures that the signal is held at the specified level for a sufficiently long time to meet the device sampling requirements, further reducing the probability of communication anomalies.

[0062] Optionally, the electronic endoscope device in this embodiment may be the electronic endoscope device 10 in the aforementioned embodiments. The endoscope host may be the host terminal 101 in the electronic endoscope device 10, the endoscope tip may be the image acquisition terminal 102 in the electronic endoscope device 10, the isolator may be the I2C isolator 103 in the electronic endoscope device, the protection element may be the diode D at the first connection port of the I2C isolator 103, and the first buffer may be the first buffer 1021 in the electronic endoscope device 10. In some embodiments, the first buffer is an I2C buffer.

[0063] Optionally, the isolator includes: a master device communication port with a protective element on one side; a slave device communication port; an isolation capacitor with the master device communication port and the slave device communication port located on opposite sides of the isolation capacitor; and a first buffer connected to the master device communication port. The master device communication port may be the first connection port in the aforementioned embodiments, and the slave device communication port may be the second connection port in the aforementioned embodiments.

[0064] In some embodiments, the electronic endoscope device may further include a second buffer. The second buffer can boost the high level of the output signal from the endoscope tip to the power supply voltage (e.g., 3.3V) and reduce the low level of the output signal from the endoscope tip to 0V. This increases the difference between the high and low levels of the output signal from the endoscope tip, thereby reducing the probability of signal level misinterpretation and consequently reducing the probability of communication anomalies. Optionally, the second buffer may be located at the endoscope tip. In some embodiments, the second buffer may be the second buffer 1024 described in the foregoing embodiments. The second buffer may be an I2C buffer.

[0065] In some embodiments, the first buffer and / or the second buffer are current-driven buffers. A current-driven buffer is an electronic device that uses current as an input signal and achieves stable transmission or enhancement of the current signal through specific circuit design. Its core function is to isolate the mutual influence between the input source and the load, while providing a high-precision, low-distortion current output. During transmission, the signal is transmitted in the form of current, which is less sensitive to noise and interference, better ensuring signal integrity. Even during long-distance transmission, it can reduce signal distortion and bit error rate, thereby supporting longer-distance communication.

[0066] Optionally, the second buffer is connected to the isolator via a cable. In some embodiments, the cable length can be greater than or equal to 5m, thus meeting the requirements for long-distance communication.

[0067] Optionally, both the first buffer and the isolator are located inside the endoscope host, which can effectively reduce the size and complexity of the endoscope tip, making the endoscope tip lighter and easier to operate.

[0068] Optionally, the first buffer and isolator are located on the same circuit board, which reduces signal loss and reflection during transmission. This also lowers production costs, optimizes PCB layout design, and reduces the complexity of materials and manufacturing processes. Furthermore, it reduces the design work required for interfaces between modules, making the overall design more compact and reducing signal interference to external circuits, while also minimizing the impact of external noise on the signal.

[0069] Optionally, the endoscope host also includes a main controller, with a first buffer located between the main controller and the isolator. The main controller may be the host controller 1011 described in the preceding embodiments. The main controller can acquire images collected by the endoscope tip, process the images, and output them to a display device.

[0070] Optionally, the distance between the first buffer and the main controller is greater than the distance between the first buffer and the isolator. For example, the distance between the first buffer and the main controller can be set to an integer multiple of 10cm, while the distance between the first buffer and the isolator can be set to a shorter distance such as 1cm or 2cm. In this way, signal interference caused by excessive communication distance between the first buffer and the isolator can be reduced.

[0071] Optionally, the first buffer is located inside the endoscope main unit, and the isolator is located at the tip of the endoscope. By placing the isolator at the tip of the endoscope, the size and complexity of the endoscope main unit can be simplified.

[0072] In some embodiments, the communication level between the endoscope host and the endoscope tip is less than or equal to 1.8V. The isolator includes a protective element, which typically includes a diode. The presence of the diode ensures that the low level of the control signal is limited to the diode's forward voltage drop, approximately 0.7V. The difference between this 0.7V level and the communication level between the endoscope tip and the control signal is small, potentially leading to signal misidentification. This embodiment, by providing a first buffer, can boost the high level of the control signal to the power supply voltage (e.g., 3.3V) and reduce the low level of the control signal to 0V, thereby increasing the difference between the high and low levels of the control signal. This reduces the probability of signal misidentification when the communication level between the endoscope host and the endoscope tip is low, thus lowering the probability of communication anomalies.

[0073] In some embodiments, this specification also provides an endoscope tip for image acquisition in response to control signals from the endoscope host of an electronic endoscope device. The endoscope host includes the isolation component described in any of the foregoing embodiments. The isolation component is disposed between the endoscope host and the endoscope tip, and includes an isolator and a first buffer. The input of the first buffer is connected to the endoscope host, the output of the first buffer is connected to the input of the isolator, and the output of the isolator is connected to the endoscope tip. The isolator detects the level of the control signal and transmits the detected control signal level to the endoscope tip through the isolation component, thereby achieving electrical isolation between the endoscope host and the endoscope tip. The isolator includes a protection element for boosting the low level of the control signal to a level not lower than the forward voltage of the protection element, thereby preventing simultaneous low-level outputs at both ends of the isolator from causing communication conflicts in the bidirectional isolation channels at both ends of the isolator. The first buffer boosts the high level of the control signal to the power supply voltage and reduces the low level of the control signal to 0 voltage.

[0074] This embodiment incorporates an isolation component in the endoscope's tip, comprising an isolator and a first buffer. The first buffer boosts the high-level control signal output from the endoscope's main unit to the power supply voltage (e.g., 3.3V) and reduces the low-level control signal to 0V. This increases the difference between the high and low levels of the control signal, reducing the probability of misinterpretation of signal levels and consequently lowering the probability of communication anomalies. Specific details of this embodiment can be found in the preceding embodiments and will not be repeated here.

[0075] In some embodiments, this specification provides an endoscope host for outputting control signals. The endoscope host controls the endoscope tip of the electronic endoscope device to acquire images through the control signals. An isolation component as described in any of the foregoing embodiments is provided between the endoscope host and the endoscope tip.

[0076] It should also be noted that the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0077] The various embodiments in this specification are described in a progressive manner. Similar or identical parts between embodiments can be referred to interchangeably. Each embodiment focuses on describing the differences from other embodiments. In particular, the system embodiments are basically similar to the method embodiments, so the description is relatively simple; relevant parts can be referred to the descriptions in the method embodiments.

[0078] The above description is merely an embodiment of this specification and is not intended to limit this specification. Various modifications and variations can be made to this specification by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this specification should be included within the scope of the claims of this application.

Claims

1. An electronic endoscope device, characterized in that, The electronic endoscope device includes a host unit and an image acquisition unit, which are connected by a cable. The host unit includes a host controller and a first buffer, and the image acquisition unit includes an image sensor and a second buffer. The electronic endoscope device also includes an I2C isolator, wherein: The host controller is connected to the first buffer; The I2C isolator is located between the first buffer and the second buffer, with the first buffer connected to one end of the I2C isolator and the second buffer connected to the other end of the I2C isolator. The image sensor and the second buffer are connected.

2. The electronic endoscope device as described in claim 1, characterized in that, Both the first buffer and the second buffer have two connection ports, which are a current drive port and an open-drain port; The open-drain port of the first buffer is connected to one end of the I2C isolator, and the current drive port of the second buffer is connected to the other end of the I2C isolator.

3. The electronic endoscope device as described in claim 2, characterized in that, The I2C isolator has a first connection port and a second connection port, and a diode is provided at the first connection port as a pull-down resistor. The open-drain port of the first buffer is connected to the first connection port of the I2C isolator, and the current drive port of the second buffer is connected to the second connection port of the I2C isolator.

4. The electronic endoscope device as described in claim 1, characterized in that, The host controller and the first buffer are connected via a first cable, the second buffer and the image sensor are connected via a second cable, the first buffer and the I2C isolator are connected via a third cable, and the I2C isolator and the second buffer are connected via a fourth cable.

5. The electronic endoscope device as described in claim 4, characterized in that, The host terminal also includes the I2C isolator, and the first cable and the third cable are located inside the host terminal.

6. The electronic endoscope device as described in claim 3, characterized in that, The low level of the first connection port of the I2C isolator is 0.5V, and the low level of the second connection port of the I2C isolator is 0V.

7. The electronic endoscope device as described in claim 3, characterized in that, The communication level between the I2C isolator and the first buffer is 3.3V, and the communication level between the I2C isolator and the second buffer is 3.3V.

8. The electronic endoscope device as described in claim 5, characterized in that, The distance between the first buffer and the host controller is greater than the distance between the first buffer and the I2C isolator.

9. The electronic endoscope device as described in claim 8, characterized in that, The first buffer and the I2C isolator are located on the same circuit board, and the third cable is located on the same circuit board.

10. The electronic endoscope device as described in claim 4, characterized in that, The image acquisition terminal includes the I2C isolator, the second buffer, and the image sensor. The first cable is located inside the host terminal, and the second cable and the fourth cable are located inside the image acquisition terminal.

Images