Brain electrode device and welding positioning device

Abstract

This application discloses a brain electrode device and a welding positioning device. The brain electrode device includes a flexible electrode, a circuit board, and conductive connectors. A welding area is provided on the flexible electrode, located on one side of opposite sides of the flexible electrode along its thickness direction. The welding area has multiple first pads arranged in an array. The circuit board has multiple second pads, each corresponding to one of the first pads. Multiple conductive connectors are connected one-to-one between the first and second pads. The conductive connectors are structures formed by the solidification of conductive fluid slurry injected between the first and second pads, and there is a gap between adjacent conductive connectors. The welding positioning device assists in the connection and positioning between the flexible electrode and the circuit board in the brain electrode device.

Description

Technical Field

[0001] This application relates to the field of brain-computer interface technology, and in particular to a brain electrode device and a welding positioning device. Background Technology

[0002] Brain-computer interfaces (BCIs) are communication and control channels established between the brain and computers or other external devices. Through these channels, users can directly express their thoughts or manipulate devices using their brains. BCIs not only enable the brain to output information to external devices, but also allow information to be input into the brain through stimuli such as electricity, magnetism, light, and sound. Therefore, BCIs establish a direct channel for information exchange between the biological brain and intelligent machines. They can interpret brain signals, control external devices, and encode information to input into the brain, thereby replacing, repairing, enhancing, or improving brain function, to achieve bidirectional interaction, collaborative work, and functional integration between the brain and intelligent machines.

[0003] Brain-computer interface (BCI) devices are devices that directly contact brain tissue to acquire electroencephalogram (EEG) signals or directly stimulate the brain, enabling information input / output. A BCI device consists of flexible electrodes and a circuit board. Ensuring a reliable connection between the flexible electrodes and the circuit board is a key technological step in stably achieving the desired functions.

[0004] Circuit boards mainly include rigid circuit boards and flexible circuit boards. Rigid circuit boards include ceramic printed circuits (CPCBs), while flexible circuit boards include flexible printed circuits (FPCs).

[0005] Currently, the mainstream welding technologies are mainly divided into two categories: gold wire welding and anisotropic conductive film (ACF) welding. Both of these commonly used welding technologies share some common drawbacks in the production of brain electrode devices. Because the fabrication of brain electrode devices typically relies heavily on manual experience to align the flexible electrodes with the circuit board, precise positioning between the flexible electrodes and the circuit board is often difficult. This results in low efficiency in the fabrication of brain electrode devices and a risk of short circuits between adjacent pads. Utility Model Content

[0006] A brain electrode device and a welding positioning device are provided to solve the above-mentioned technical problems.

[0007] In a first aspect, a brain electrode device is provided, comprising:

[0008] A flexible electrode, wherein a welding area is provided on the flexible electrode, and the welding area is located on one side of opposite sides of the flexible electrode along the thickness direction of the flexible electrode. The welding area is provided with a plurality of first pads, which are arranged in an array.

[0009] A circuit board having a plurality of second pads, wherein the plurality of second pads correspond one-to-one with the plurality of first pads;

[0010] Multiple conductive connectors are connected one-to-one between multiple first pads and multiple second pads. Each conductive connector is a structure formed by the curing of conductive fluid slurry injected between the first pads and the second pads, and there is a gap between two adjacent conductive connectors.

[0011] Optionally, the first pad is provided with a solder hole, and the conductive connector is at least partially embedded in the solder hole.

[0012] Optionally, the first pad and the solder hole are asymmetrical elliptical structures.

[0013] Optionally, the ratio between the major axis and the minor axis of the first pad is 2:1.

[0014] Optionally, the ratio between the major axis and the minor axis of the weld hole is 5:2.

[0015] Optionally, the flexible electrode includes a first side and a second side opposite to each other along its thickness direction, and a contact region spaced apart from the welding area along its length direction, wherein the weld hole correspondingly penetrates the first side and the second side of the flexible electrode; wherein,

[0016] When multiple first pads and the contact area are all located on the first side, the conductive connector includes:

[0017] A first conductive layer is located between the first pad and the second pad and extends at least partially from the surface of the second pad along the solder hole to contact the surface of the first pad.

[0018] A second conductive layer at least partially covers the first conductive layer and extends to the surface of the first pad, and is connected to the first conductive layer.

[0019] Optionally, the flexible electrode includes a first side and a second side opposite to each other along its thickness direction, and a contact region spaced apart from the welding area along its length direction, wherein the weld hole correspondingly penetrates the first side and the second side of the flexible electrode; wherein,

[0020] When the contact area is located on the first side, and multiple first pads are located on the second side, the first pads and the second pads abut against each other, and the conductive connector extends from the surface of the second pad to the first side corresponding to the solder hole.

[0021] Optionally, it also includes a protective reinforcement layer, which is at least partially embedded in the pore between the weld hole and the conductive connector.

[0022] Secondly, a welding positioning device is provided, which assists in the connection and positioning between the flexible electrode and the circuit board in the aforementioned brain electrode device. The welding positioning device includes...

[0023] A first positioning component, the first positioning component being provided with a first positioning structure, the first positioning structure being at least adapted to confine the circuit to the first positioning component;

[0024] A second positioning component, comprising a second positioning structure, wherein the second positioning structure is at least adapted to constrain the flexible electrode within the second positioning component; wherein...

[0025] The second positioning component has a first position that aligns with and fits against the first positioning component, and a second position that separates from the first positioning component.

[0026] When the second positioning component is located at the first position, the second positioning structure and the first positioning structure form a positioning cavity, and the circuit board and the flexible electrode at least partially abut against each other.

[0027] Optionally, the first positioning structure includes,

[0028] A positioning groove is provided on the surface of the first positioning component near the second positioning component and is recessed in a direction away from the second positioning component. The shape of the positioning groove is adapted to the circuit board.

[0029] Optionally, the second positioning component includes a first surface adjacent to the first positioning component, and the second positioning structure includes,

[0030] A contour marking region is disposed on the first surface and configured to conform to the shape of the flexible electrode.

[0031] Optionally, the second positioning structure includes a positioning plate, and the contour marking area is disposed on the positioning plate.

[0032] Optionally, the second positioning structure includes an array of through holes that penetrate the positioning plate.

[0033] Optionally, the first positioning component further includes a base and a punch, the punch being detachably protruding from the surface of the base near the second positioning component, and the positioning groove being disposed on the punch.

[0034] Optionally, the contour marking area includes a main area and an extension area. Along the length direction of the extension area, one end of the extension area is connected to the main area, and the other end extends to the outer edge of the second positioning component away from the main area. Along the first direction, the projected outer contour of the through-hole array is located within the projected outer contour of the main area.

[0035] Optionally, the surface roughness of the second positioning component away from the first positioning component is not greater than 0.1 μm.

[0036] Optionally, the second positioning component further includes,

[0037] A clamping component is detachably clamped to the outer periphery of the positioning plate and can form a limiting groove with the positioning plate. The limiting groove is adapted to the punch and can be sleeved on the punch and fit against the surface of the punch.

[0038] Optionally, the through-hole array includes a plurality of first through holes, and a chamfer structure is provided at the opening of at least one side of the first through hole along the axial direction of the first through hole.

[0039] Optionally, the first positioning component includes at least one first groove, which is recessed into the inner wall surface of at least one side of the positioning groove and communicates with the positioning groove.

[0040] Optionally, the first positioning component includes at least one second groove, which is disposed on at least one side of the positioning groove and communicates with the positioning groove, and does not overlap with the first groove.

[0041] Compared with the prior art, the technical solution of this application has the following beneficial effects:

[0042] This application provides a brain electrode device. A conductive connector is provided between the flexible electrode and the circuit board in the brain electrode device. The conductive connector connects a first pad of the flexible electrode and a second pad of the circuit board. The conductive connector is a structure formed by the curing of a conductive fluid slurry injected between the first and second pads, and there is a gap between adjacent conductive connectors to prevent short circuits between adjacent first pads and adjacent second pads.

[0043] Furthermore, the flexible electrodes and circuit board of this brain electrode device can be precisely positioned and welded using a welding positioning device, which includes a first positioning component and a second positioning component. The first positioning component has a first positioning structure that restricts the circuit board to the first positioning component, and the second positioning component has a second positioning structure that restricts the flexible electrodes to the second positioning component. Precise positioning between the circuit board and the flexible electrodes is achieved through a first alignment and a second separation between the first and second positioning components. In other words, by using such a welding positioning device, the welding of the flexible electrodes and circuit board can be completed quickly and accurately, significantly increasing the production capacity of the brain electrode device and meeting the needs of mass production. Attached Figure Description

[0044] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0045] To gain a more complete understanding of this application and its beneficial effects, the following description will be provided in conjunction with the accompanying drawings, wherein the same reference numerals in the following description denote the same parts.

[0046] Figure 1 This is a schematic diagram of the overall structure of the brain electrode device in some embodiments.

[0047] Figure 2 This is a schematic diagram of the overall structure of the brain electrode device, including a rigid circuit board, in some embodiments.

[0048] Figure 3 This is a schematic diagram of the overall structure of the brain electrode device, including a flexible circuit board, in some embodiments.

[0049] Figure 4 This is a schematic diagram of the specific structure of the first pad of the flexible electrode of the brain electrode device in some embodiments.

[0050] Figure 5 This is a schematic diagram of the overall structure of the welding positioning device in some embodiments.

[0051] Figure 6 This is a schematic diagram of the specific structure of the first positioning component in some embodiments.

[0052] Figure 7 This is a schematic diagram of the specific structure of the second positioning component in some embodiments.

[0053] Figure 8This is a bottom view of the second positioning component in some embodiments.

[0054] Figure 9 This is a schematic diagram of the overall structure of the welding positioning device in some other embodiments.

[0055] Figure 10 This is a schematic diagram of the overall structure of the welding positioning device at different angles in some other embodiments.

[0056] Figure 11 This is a schematic diagram of the specific structure of the first positioning component in some other embodiments.

[0057] Figure 12 This is a schematic diagram of the specific structure of the second positioning component in some other embodiments.

[0058] The above figures include the following reference numerals:

[0059] 10. Flexible electrode; 11. First pad; 110. Solder hole; 12. First side; 13. Second side; 14. Contact area;

[0060] 20. Circuit board; 21. Second solder pad;

[0061] 30. Conductive connector; 31. First conductive layer; 32. Second conductive layer;

[0062] 40. First positioning component; 401. First positioning structure; 402. First groove; 41. Base; 42. Punch; 421. Positioning slot; 43. Fastening component; 431. Fixing hole; 44. Second guide component; 441. Second protrusion; 442. Guide hole;

[0063] 50. Second positioning component; 501. Second positioning structure; 011. Contour marking area; 1a. Main body area; 1b. Extension area; 502. Through hole array; 021. First through hole; 503. First surface; 51. Clamping component; 511. First frame; 5111. First clearance hole; 512. Second frame; 5121. Second clearance hole; 52. Positioning plate; 531. Locking component; 532. Connecting hole; 54. Limiting groove;

[0064] 60. Receiving cavity; 61. Second groove; 62. Third groove;

[0065] 70. First guide component; 71. First protrusion; 72. Second through hole. Detailed Implementation

[0066] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the protection scope of this application.

[0067] In the embodiments of this application, "at least one" refers to one or more; "multiple" refers to two or more. In the description of this application, the terms "first," "second," "third," etc., are used only for the purpose of distinguishing descriptions and should not be construed as indicating or implying relative importance, nor should they be construed as indicating or implying order.

[0068] References such as "one embodiment" or "some embodiments" as used in this specification mean that one or more embodiments of this application include specific features, structures, or characteristics described in connection with that embodiment. Different components and techniques in different embodiments can be freely combined with each other. The terms "comprising," "including," "having," and variations thereof in this specification mean "including but not limited to," unless otherwise specifically emphasized.

[0069] It should be noted that in the embodiments of this application, "and / or" describes the relationship between associated objects, indicating that there can be three relationships. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. In addition, the character " / ", unless otherwise specified, generally indicates that the associated objects before and after it are in an "or" relationship.

[0070] It should be noted that in the embodiments of this application, "connection" can be understood as electrical connection. The connection between two electrical components can be a direct or indirect connection between the two electrical components. For example, the connection between A and B can be a direct connection between A and B, or an indirect connection between A and B through one or more other electrical components.

[0071] Definition: The vertical direction Z is the first direction, the horizontal direction X is the second direction, and the horizontal direction Y is the third direction.

[0072] Combination Figures 1 to 3 As shown, this application provides a brain electrode device, which includes a flexible electrode 10, a circuit board 20, and a conductive connector 30.

[0073] The flexible electrode 10 has a welding area. Along the thickness direction of the flexible electrode 10, the welding area is located on one side of the opposite sides of the flexible electrode 10, and the welding area is provided with a plurality of first welding pads 11.

[0074] Optionally, the flexible electrode 10 is typically an elongated sheet-like film, including a supporting base layer and a layer of metal wires bonded and distributed on the base layer. Specifically, the base layer material is typically polyimide, and the metal wire layer material is typically gold. The thickness of the flexible electrode 10 is 5 μm-100 μm. Optionally, the flexible electrode 10 also includes a contact region 14 for contacting brain tissue. The contact region 14 is spaced apart from the welding region along its length.

[0075] Optionally, along the thickness direction of the flexible electrode 10, the flexible electrode 10 includes a first side 12 and a second side 13.

[0076] Optionally, multiple first pads 11 are arranged in an array.

[0077] The circuit board 20 is provided with a plurality of second pads 21, and the plurality of second pads 21 are provided in a one-to-one correspondence with the plurality of first pads 11.

[0078] Optionally, the circuit board 20 includes a rigid circuit board, such as a ceramic substrate, a metal substrate, an epoxy fiberglass cloth substrate, a glass substrate, etc., preferably a ceramic substrate.

[0079] Optionally, the circuit board 20 includes a flexible circuit board, such as a polyimide substrate, a liquid crystal polymer substrate, a polyethylene terephthalate substrate, a polypropylene substrate, preferably a polyimide substrate, etc.

[0080] The conductive connector 30 includes multiple conductive connectors 30, which are connected one-to-one between multiple first pads 11 and multiple second pads 21.

[0081] Optionally, the conductive connector 30 is a structure formed by the curing of conductive fluid slurry injected between the first pad 11 and the second pad 21, and there is a gap between two adjacent conductive connectors 30.

[0082] Alternatively, the conductive fluid paste can be one or more of the following: carbon black paste, graphite paste, conductive gold paste, conductive platinum paste, conductive silver paste, conductive copper paste, conductive carbon paste, graphene paste, conductive solder paste, and composite paste.

[0083] It is important to emphasize that the flexible electrode 10 and the circuit board 20 of the brain electrode device can be precisely positioned through the aforementioned conductive connector 30. Furthermore, the conductive connector, which is formed by the solidification of conductive fluid slurry, makes it less likely for two adjacent first pads 11 and two adjacent second pads 21 to short-circuit.

[0084] In some embodiments, each of the first pads 11 is provided with a solder hole 110, and the conductive connector 30 is at least partially embedded in the solder hole 110.

[0085] Understandably, the solder hole 110 can not only serve as a channel for the conductive fluid slurry to flow to the surface of the first solder pad 11 and the surface of the second solder pad 21, but also improve the stability and connection strength of the conductive connector 30 between the first solder pad 11 and the second solder pad 21.

[0086] In some embodiments, the first pad 11 and the solder hole 110 are asymmetrical elliptical structures.

[0087] Optionally, combined Figure 4 As shown, the first pad 11 and the solder hole 110 of the flexible electrode 10 are both elliptical structures. The elliptical first pad 11 is located on the outer ring, and the other elliptical solder hole 110 is located inside the first pad 11. The two are asymmetrical elliptical structures. Furthermore, the two are asymmetrical elliptical structures with inner and outer rings on the same plane.

[0088] It should be noted that, in the process of soldering using conductive fluid paste, compared to the radially symmetrical structure of circular pads and solder holes, the use of an asymmetrical elliptical structure with inner and outer rings, especially the elliptical solder hole 110, can form a directional guiding channel for the conductive fluid paste by utilizing the extension characteristics of the long axis of the elliptical structure. The long axis of the elliptical solder hole can reduce the resistance of the conductive fluid paste (reducing the flow shear force by about 30%-40%), promoting the uniform spread of the conductive fluid paste along the long axis, avoiding local accumulation or voids, and thus significantly increasing the effective contact area between the conductive fluid paste and the pad (25%-35% higher than that of circular pads).

[0089] Specifically, in combination Figure 4 As shown, in some embodiments, the ratio between the major axis and the minor axis of the first pad 11 is 2:1. For example, the length of the major axis of the elliptical structure of the first pad 11 is specifically set to 100μm-400μm, and the width of the minor axis is 50μm-200μm.

[0090] Specifically, in combination Figure 4 As shown, in some embodiments, the ratio between the major axis and minor axis of the weld hole is 5:2. For example, the length of the major axis of the weld hole in the elliptical structure is specifically set to 50μm-250μm, and the width of the minor axis is 20μm-100μm.

[0091] It is particularly important to emphasize that when the first pad 11 is set to an elliptical structure, it can also be highly matched with the deformation direction of the ball diameter in gold wire welding and the pressure distribution of ACF film welding. For example, during gold wire welding, the major axis of the elliptical first pad 11 can accommodate the major axis direction of the ball weld deformation, preventing the ball weld from overflowing the edge of the first pad. During ACF film welding and pressing, the narrow design of the minor axis of the elliptical first pad 11 can concentrate the pressure stress and increase the contact probability between the conductive particles and the first pad (approximately 20% higher than that of a circular pad). In other words, the elliptical pad structure can better adapt to various mainstream welding processes and achieve better welding results.

[0092] It should be noted that the first pad 11, the solder hole 110 and the second pad 21 can all be set as elliptical structures or as annular elliptical structures with internal and external symmetry. No specific restrictions are made here. The corresponding structures have the same effect as the aforementioned structures and will not be described again here.

[0093] In some embodiments, a plurality of first pads 11 and contact areas 14 are located on the same side of the flexible electrode 10, the plurality of first pads 11 are used to connect correspondingly to the second pads 21 of the circuit board 20, and the contact areas 14 are used to directly contact brain tissue.

[0094] Optionally, the plurality of first pads 11 and contact areas 14 are all located on the first side 12 or the second side 13 of the flexible electrode 10. Preferably, combined with Figure 2 As shown, multiple first pads 11 and contact areas 14 are located on the first side 12 of the flexible electrode 10. The solder holes 110 provided in the first pads 11 extend from the first side 12 to the corresponding second side 13. The contacts of the contact areas 14 are arranged in a direction away from the second side 13.

[0095] The circuit board 20 includes a rigid circuit board or a flexible circuit board. Preferably, it is combined with... Figure 2 As shown, the circuit board 20 includes a rigid circuit board, such as a ceramic substrate. A plurality of second pads 21 are provided on the side of the rigid circuit board facing the flexible electrode 10, and the plurality of second pads 21 correspond one-to-one with the plurality of first pads 11.

[0096] Optionally, the conductive connector 30 includes a first conductive layer 31 and a second conductive layer 32. The first conductive layer 31 is located between the first pad 11 of the flexible electrode 10 and the second pad 21 of the circuit board 20 and extends at least partially from the second pad 21 along the solder hole 110 to contact the surface of the first pad 11. The second conductive layer 32 at least partially covers the first conductive layer 31 and extends to the surface of the first pad 11, and is connected to the first conductive layer 31.

[0097] Specifically, the first conductive layer 31 and the second conductive layer 32 are designed to improve the welding reliability and connection strength between the first pad 11 of the flexible electrode 10 and the second pad 21 of the circuit board 20. These are formed by repeating the same welding process, i.e., screen printing the conductive fluid paste at least twice, and then curing the resulting structure. Specifically, the first conductive layer 31 is the paste coating structure formed by the first screen printing and curing of the conductive fluid paste. The second conductive layer 32 is the paste coating structure formed by repeating the second screen printing and curing of the conductive fluid paste based on the formation of the first conductive layer 31. Figure 2 and Figure 3 As shown, the welding structure of this "sandwich-like" conductive path ensures the mechanical bonding strength of the welding interface of the brain electrode device, and the contour consistency and thickness uniformity of each conductive layer are highly controllable, which facilitates mass production with a high yield rate.

[0098] It is particularly important to emphasize that when the first pad 11 is disposed on the first side 12 of the flexible electrode 10, at least two screen printings of conductive fluid paste must be performed between the first pad 11 and the second pad 21 of the circuit board 20, and the two curings will form the first conductive layer 31 and the second conductive layer 32 respectively to form a conductive connector 30, thereby ensuring that the first pad 11 and the second pad 21 are reliably soldered together.

[0099] In other embodiments, a plurality of first pads 11 are located on the second side 13. Solder holes 110 provided in the first pads 11 extend from the second side 13 to the corresponding first side 12.

[0100] Optionally, the contact area 14 may be disposed on the first side 12 or the second side 13 of the flexible electrode 10, preferably in combination with Figure 3 As shown, the contact area 14 is located on the first side 12. Further, the contacts of the contact area 14 can be positioned towards the second side 13, or they can be positioned away from the second side 13. Preferably, the contacts of the contact area 14 are positioned away from the second side 13.

[0101] The circuit board 20 includes a rigid circuit board or a flexible circuit board. Preferably, such as... Figure 3 As shown, the circuit board 20 includes a flexible circuit board, such as a polyimide substrate. A plurality of second pads 21 are provided on the side of the flexible circuit board facing the flexible electrode 10, and the plurality of second pads 21 correspond one-to-one with the plurality of first pads 11.

[0102] Optionally, the first pad 11 and the second pad 21 abut against each other, and the conductive connector 30 extends from the surface of the second pad 21 to the first side 12 corresponding to the solder hole 110.

[0103] It should be noted that when the first pad 11 and the second pad 21 are in contact, only one screen printing of the conductive fluid paste is required, and the conductive connector 30 is formed in one step, thus reliably welding the first pad 11 and the second pad 21 together. Depending on actual needs, the screen printing and welding process of the conductive fluid paste can be repeated.

[0104] In some embodiments, combined with Figure 2 and Figure 3 As shown, the brain electrode device also includes a protective reinforcement layer, which is at least partially embedded in the pore between the weld hole 110 and the conductive connector 30.

[0105] Specifically, the protective reinforcement layer can be formed by curing a protective reinforcement fluid, which may include one or more of the following: epoxy resin silicone, organic silicone, polyurethane, acrylate, and UV adhesive (ultraviolet curing adhesive). For example, if the protective reinforcement fluid is composed of epoxy resin silicone, after the flexible electrode 10 and circuit board 20 in the brain electrode device are welded together via conductive connectors 30, the epoxy resin silicone, being in a fluid state, is injected along the weld holes 110 of the flexible electrode 10. At this time, although the weld holes 110 are filled with conductive connectors 30 formed by curing the conductive fluid slurry, the conductive connectors 30 and the weld holes 110 are not tightly bonded without gaps. The epoxy resin silicone fluid will completely fill these gaps along the guide of the conductive connectors 30. It should be noted that the formation of other protective reinforcement fluids with different compositions is similar, and will not be elaborated further here.

[0106] Furthermore, a protective reinforcing fluid can be applied to the entire first side 12 of the flexible electrode 10, forming a protective reinforcing layer integrally. This not only further improves the welding strength between the flexible electrode 10 and the circuit board 20, but also protects the flexible electrode 10 from oxidation.

[0107] In some embodiments, combined with Figures 5-12 As shown, this application provides a welding positioning device for assisting in the connection and positioning between the circuit board 20 and the flexible electrode 10 in the aforementioned brain electrode device. The welding positioning device includes a first positioning component 40 and a second positioning component 50. The first positioning component 40 is mainly used for the precise positioning and fixing of the circuit board 20, and the second positioning component 50 is mainly used for the visual and precise alignment and fixing of the flexible electrode 10, thereby working together to improve the welding quality and efficiency of the brain electrode device.

[0108] The first positioning component 40 is provided with a first positioning structure 401, which is at least adapted to restrict the circuit board 20 to the first positioning component 40. It can be understood that after the circuit board 20 is restricted to the first positioning component 40, the spatial positions of the plurality of second pads 21 on the circuit board 20 are fixed.

[0109] The second positioning component 50 is provided with a second positioning structure 501, which is at least adapted to restrict the flexible electrode 10 to the second positioning component 50. It can be understood that after the flexible electrode 10 is restricted to the second positioning component 50, the spatial position of the multiple first pads 11 on the flexible electrode 10 is fixed.

[0110] The second positioning component 50 has a first position that is aligned and attached to the first positioning component 40 and a second position that is separated from the first positioning component 40.

[0111] Furthermore, when the second positioning component 50 is in the first position, the second positioning structure 501 and the first positioning structure 401 form a positioning cavity. When the brain electrode device is positioned within the positioning cavity, the circuit board 20 and the flexible electrode 10 at least partially abut against each other. It is understood that the positioning cavity formed by the second positioning structure 501 and the first positioning structure 401 ensures that the at least partially abutting circuit board 20 and flexible electrode 10 achieve precise alignment. In the second position, where the second positioning component 50 is separated from the first positioning component 40, all components of the second positioning component 50 do not contact the second positioning component 50.

[0112] Specifically, along the first direction, after the second positioning component 50 is moved to the first position, the second positioning structure 501 is stacked on the first positioning structure 401 and forms a positioning cavity with the first positioning structure 401. The flexible electrode 10, confined within the positioning cavity, will at least partially stack and abut against the circuit board 20, and the multiple first pads 11 and multiple second pads 21 will correspond one-to-one, achieving precise and rapid positioning of the flexible electrode 10 and the circuit board 20. After the flexible electrode 10 and the circuit board 20 are positioned, the multiple first pads 11 and multiple second pads 21 are welded together one-to-one to form multiple conductive connectors 30, thereby obtaining the desired brain electrode device.

[0113] Understandably, the welding positioning device helps to make the positioning between the circuit board 20 and the flexible electrode 10 in the brain electrode device faster and more accurate. Moreover, by setting up multiple welding positioning devices on the production line, multiple flexible electrodes 10 and multiple circuit boards 20 can be positioned and welded in batches, thereby realizing the mass production of brain electrode devices and improving production efficiency.

[0114] In some embodiments, the first positioning structure 401 includes a positioning groove 421. The positioning groove 421 is disposed on the surface of the first positioning component 40 near the second positioning component 50 and is recessed in a direction away from the second positioning component 50. The shape of the positioning groove 421 is adapted to the circuit board 20. The positioning groove 421 can accurately position the plurality of second pads 21 of the circuit board 20 in both horizontal and vertical directions, thereby achieving precise spatial positioning of the plurality of second pads 21 and preventing the plurality of second pads 21 from shifting during the soldering process. Furthermore, the positioning groove 421 is easy to process and the assembly with the circuit board 20 is efficient and convenient.

[0115] In some embodiments, combined Figures 5-8 As shown, the circuit board 20 includes a rigid circuit board, such as a ceramic plate, i.e., a ceramic printed circuit. The shape of the inner wall of the positioning groove 421 can be set to match the overall outline of the ceramic plate.

[0116] Optionally, after the rigid circuit board is integrally fitted into the positioning groove 421, the edge contour of the rigid circuit board is tightly fitted with the inner wall surface of the positioning groove 421 to achieve horizontal positioning of the multiple second pads 21. The upper surface of the rigid circuit board is flush with the upper surface of the first positioning component 40, or flush with the opening of the positioning groove 421, thereby achieving vertical positioning of the second pads 21. For example, the positioning groove 421 can be a square positioning groove 421 with a length of 10mm-25mm × width of 10mm-25mm × depth of 0.5mm-4mm.

[0117] In some other embodiments, combined Figures 9-12 As shown, the circuit board 20 includes a flexible circuit board, such as an FPC board, i.e., a flexible printed circuit. The shape of the inner wall of the positioning groove 421 can be set to match the outer contour of the welding section of the flexible circuit board. The welding section is a welding area of ​​multiple second solder pads 21 provided on the flexible circuit board.

[0118] Optionally, after the soldering segment of the flexible circuit board is integrally fitted into the positioning groove 421, the edge contour of the soldering segment is tightly fitted with the inner wall surface of the positioning groove 421 to achieve horizontal positioning of the second solder pad 21. The upper surface of the soldering segment is flush with the upper surface of the first positioning component 40 or flush with the opening of the positioning groove 421, thereby achieving vertical positioning of the second solder pad 21. For example, the positioning groove 421 can be a square positioning groove 421 with a length of 5mm-15mm × width of 5mm-15mm × depth of 0.2mm-1.3mm, used to fix the soldering segment of the flexible circuit board (such as an FPC board).

[0119] It is particularly emphasized that, regardless of whether it is a rigid circuit board or a flexible circuit board, this application can achieve precise positioning and restriction of multiple second pads 21 on the circuit board 20 in the horizontal and vertical directions by setting a positioning groove 421 that is adapted to the shape of the circuit board 20, so as to provide conditions for rapid and accurate positioning between them and the flexible electrode 10, which is conducive to the high-efficiency production needs of brain electrode devices.

[0120] Optionally, in some embodiments, the first positioning component 40 further includes a base 41 and a punch 42. The base 41 serves as the basic support for the welding positioning device, and the punch 42 is detachably protruded from the surface of the base 41 near the second positioning component 50.

[0121] Specifically, the base 41 has a mounting hole in its central area that matches the punch 42. The punch 42 is mounted over the mounting hole in the central area of ​​the base 41. The distance deviation between the outer edge of the punch 42 and the inner wall of the mounting hole in the base 41 is ≤0.05mm, so that the punch 42 fits tightly against the mounting hole without damaging the base 41 or making it difficult to disassemble due to excessive tightness. The mounting hole reduces the overall weight of the first positioning component 40, making it easier to handle.

[0122] For example, the base 41 can be made from an aluminum alloy frame structure with a thickness of 3mm-5mm and a flatness of ≤0.05mm. The surface of the base 41 is anodized to support other components and ensure overall rigidity.

[0123] For example, the punch 42 can be a square block structure with a thickness of 3mm-5mm.

[0124] Furthermore, a positioning groove 421 is provided on the punch 42 and is recessed in a direction away from the second positioning component 50. The positioning groove 421 provided on the punch 42 is used to directly support and fix the circuit board 20, and is the core component for achieving precise positioning at the welding station. Specifically, the top surface of the punch 42 has a positioning groove 421 that is adapted to the shape of the welding section of the rigid circuit board or the flexible circuit board. The groove depth of the positioning groove 421 along the first direction is consistent with the thickness of the circuit board 20, and the groove width of the positioning groove 421 matches the width and length of the welding section of the rigid circuit board or the flexible circuit board in the horizontal direction. By making the axis of the positioning groove 421 parallel to the length direction of the base 41, precise embedding and positioning of the circuit board 20 can be achieved, ensuring the coaxiality and load-bearing rigidity of the punch 42 and the base 41, while facilitating alignment with external tooling references, effectively improving the positioning accuracy and process matching of the welding station, and ensuring the stability of welding quality.

[0125] Understandably, when it is necessary to position circuit boards 20 of different sizes or types, it is only necessary to remove the punch 42 with the positioning groove 421 and replace it with a punch 42 that has a positioning groove 421 that matches the circuit board 20 to be soldered.

[0126] Optionally, in some embodiments, to facilitate the assembly of the base 41 and the punch 42, the base 41 and the punch 42 can be detachably connected together by a fastening component 43. The fastening component 43 may include a combination of fasteners (such as screws or bolts) and fixing holes 431. The fixing holes 431 are provided through the punch 42 and the base 41, and internal threads are provided in the fixing holes 431. The screw is inserted into the fixing holes 431 and tightened by engaging with the internal threads.

[0127] The fastening component 43 serves as a mechanical connection channel between the base 41 and the punch 42, and the two are rigidly fixed by fixing screws. The axis of the fixing hole 431 coincides with the center of the four corners of the base 41 and the punch 42 (positional deviation ≤ 0.03mm), ensuring the installation consistency of the punch 42 and the base 41.

[0128] Optionally, in some embodiments, the surface of the punch 42 near the second positioning component 50 is provided with a first protrusion 71. The first protrusion 71 includes at least three protrusions 71 arranged in a triangular pattern. This triangular arrangement provides a stable three-point positioning reference as an alignment reference for the first positioning component 40. The multiple first protrusions 71 are used to form a first guide component 70 that guides the second positioning component 50 to move to a first position along a first direction. The distance between the axis of the first protrusion 71 and the edge of the base 41 is 1 mm, the positional deviation is ≤0.01 mm, and the spacing between each protrusion 71 and its corresponding hole is strictly consistent to ensure assembly consistency of the components.

[0129] For example, the first protruding post 71 is a cylindrical steel post of a certain height. The first protruding post 71 can be made of GCr15 bearing steel, and the surface is hardened. The surface roughness Ra of the post body is ≤0.2μm to ensure smooth sliding.

[0130] Optionally, in some embodiments, to facilitate more precise and rapid installation of the punch 42 onto the base 41, a second guide component 44 may be provided between the punch 42 and the base 41.

[0131] Specifically, the second guide assembly 44 includes a second protrusion 441 and a guide hole 442. The second protrusion 441 can be disposed on at least one of the base 41 and the punch 42, and the guide hole 442 can be disposed on the other of the base 41 and the punch 42 (i.e., one of them, or both). The depths of the second protrusion 441 and the guide hole 442 are matched. Thus, by lowering the second protrusion 441 along the guide hole 442 until the punch 42 abuts against the base 41, the base 41 and the punch 42 can be detachably fastened together by the fastening member 43.

[0132] Optionally, at least two second protrusions 441 are spaced apart on one diagonal of the top surface of the base 41, with the axis of the second protrusion 441 12mm-14mm away from the edge of the base 41 (positional deviation ≤0.01mm), serving as the alignment reference between the base 41 and the punch 42. Guide holes are provided on the punch at the corresponding positions. The cooperation between the second protrusions 441 and the guide holes 442 ensures the installation consistency between the punch 42 and the base 41.

[0133] Understandably, the diagonal distribution and spacing of the second protrusion 441 match the basic structure to ensure the installation accuracy of the punch 42 and the base 41.

[0134] For example, the second protruding post 441 is a cylindrical steel post of a certain height. The second protruding post 441 can be made of GCr15 bearing steel, and the surface is hardened. The surface roughness Ra of the post body is ≤0.2μm to ensure smooth sliding.

[0135] Optionally, in some embodiments, combined with Figures 5-6 and Figure 9 , Figure 11 As shown, along the second direction, the first positioning component 40 includes at least one first groove 402. The first groove 402 is recessed along the second direction on the inner wall surface of at least one side of the positioning groove 421 and communicates with the positioning groove 421. That is, the first groove 402 communicates with the positioning groove 421, providing sufficient operating space for the placement and removal of the circuit board 20. In other words, the first groove 402 facilitates the operator to use corresponding clamping tools to fit the circuit board 20 into or remove it from the positioning groove 421.

[0136] Optionally, in some embodiments, combined with Figure 9 and Figure 11 As shown, along the third direction, the first positioning component 40 includes at least one second groove 61, which is disposed on at least one side of the positioning groove 421, that is, a second groove 61 is provided on one side or opposite sides, and does not overlap with the first groove 402.

[0137] For example, the second groove 61 may be a long, shallow groove structure for accommodating the flexible electrode 10 and / or the extension of the flexible circuit board to prevent damage to the flexible electrode 10 and the extension of the flexible circuit board during welding.

[0138] Understandably, when the brain electrode device is a combination of a flexible circuit board and a flexible electrode 10, a second groove 61 needs to be provided on both sides of the positioning groove 421. In this case, the extension of the flexible electrode 10 that is misaligned in the welding area can extend from one of the second grooves 61 to form a welding positioning device, while the portion of the flexible circuit board that is misaligned in the welding section can extend from the other second groove 61 to form a welding positioning device. When the brain electrode device is a combination of a rigid circuit board and a flexible electrode 10, only a second groove 61 needs to be provided on one side, and it is sufficient that the extension of the flexible electrode 10 that is misaligned in the welding area can extend from the second groove 61 to form a welding positioning device.

[0139] In some embodiments, the second positioning component 50 includes a clearance space, which is disposed opposite to the second positioning structure 501 and communicates with the positioning cavity. Thus, multiple first pads 11 and multiple second pads 21 can be welded together one-to-one along the clearance space. Positioning before welding is completed by a welding positioning device, making positioning faster and more accurate. The clearance space allows for direct welding of the flexible electrode 10 and the circuit board 20, or facilitates touch-up welding of any missed solder joints between the flexible electrode 10 and the circuit board 20. This can be flexibly adjusted according to actual process requirements.

[0140] Optionally, in some embodiments, the clearance space may be an opening that exposes a plurality of first pads 11 on the flexible electrode 10, thereby allowing a soldering operator to solder the first pads 11 and the second pads 21 together along the clearance space.

[0141] In some embodiments, combined with Figure 5 , Figures 7-8 as well as Figures 9-10 , Figure 12 As shown, along the first direction, the second positioning component 50 includes a first surface 503 adjacent to the first positioning component 40. The second positioning structure 501 includes a contour marking region 011 disposed on the first surface 503. The contour marking region 011 is configured to adapt to the shape of the flexible electrode 10 so as to restrict the flexible electrode 10 to the second positioning component 50 by attaching the flexible electrode 10 to the contour marking region 011.

[0142] Understandably, the contour marking area 011 and the positioning groove 421 are arranged to form a positioning cavity and are aligned, so that when the second positioning component 50 is located in the first position aligned and attached to the first positioning component 40, the brain electrode device composed of the circuit board 20 and the flexible electrode 10 can be at least partially confined within the positioning cavity, and the circuit board 20 and the flexible electrode 10 in the positioning cavity are stacked and abutted to form a conductive connector 30.

[0143] Optionally, the contour marking area 011 is formed by the contour line provided on the first surface 503, and the flexible electrode 10 can be attached and accommodated in the contour marking area 011 as a whole. The edge contour of the flexible electrode 10 coincides with the contour line of the contour marking area 011, and the lower top surface of the flexible electrode 10 is flush with the lower top surface of the contour marking area 011. Optionally, the width of the outline is between 0.05mm and 0.1mm (e.g., widths of 0.05mm, 0.06mm, 0.07mm, 0.08mm, 0.09mm, 0.1mm, etc.), and the depth of the outline marking area 011 is between 0.01mm and 0.1mm (e.g., depths of 0.01mm, 0.02mm, 0.03mm, 0.04mm, 0.05mm, 0.06mm, 0.07mm, 0.08mm, 0.09mm, 0.1mm, etc.). The overall depth of the outline marking area 011 is consistent with the thickness of the flexible electrode 10, and can be freely selected according to the thickness of the flexible electrode 10. Optionally, the entire outline marking area 011 is obtained by laser engraving.

[0144] Optionally, the outline marking area 011 includes a structure where at least one of its color and transparency differs from that of other areas of the first surface 503 besides the outline marking area 011. For example, the color of the outline marking area 011 may be set to be different from the colors of other areas of the first surface 503, or the outline marking area 011 may be set to be more transparent than other areas of the first surface 503. The outline marking area 011 may be created using a laser engraving process.

[0145] It is particularly emphasized that when the welding area of ​​the flexible electrode 10 and the contact area 14 that contacts the brain tissue are located on opposite sides of the flexible electrode 10 along its own thickness direction, in order to ensure that the contact area 14 can contact the brain tissue downward after the flexible electrode 10 and the circuit board 20 are welded, the outline marking area 011 is a mirror image of the part of the flexible electrode 10 where the welding area is provided.

[0146] It is understood that, regardless of the form of the outline marking area 011 described above, this application only requires attaching the flexible electrode 10 to the outline marking area 011 and aligning the outer contour of the flexible electrode 10 with the edge contour of the outline marking area 011 to constrain the flexible electrode 10 to the first surface 503 of the second positioning component 50. When the second positioning component 50 moves to the first position and the first surface 503 is tightly attached to the surface of the first positioning component 40, at least partial contact is made between the flexible electrode 10 and the circuit board, thereby aligning the plurality of first pads 11 of the flexible electrode 10 with the plurality of second pads 21 on the circuit board 20 to form corresponding conductive connectors 30.

[0147] Optionally, in some embodiments, to further improve the welding efficiency between the flexible electrode 10 and the circuit board 20, the second positioning structure 501 includes a positioning plate 52, and a first surface 503 is the surface of the positioning plate 52 near the first positioning component 40. A contour marking area 011 is disposed on the first surface 503 of the positioning plate 52.

[0148] Optionally, the outline marking area 011 includes a through-hole array 502 penetrating the positioning plate 52, the through-hole array 502 being a hollow mesh structure.

[0149] By setting the positioning plate 52 with the contour marking area 011 and / or the through hole array 502, it is possible to quickly and accurately position the circuit board 20 and the flexible electrode 10, and also to precisely control the coating position and amount of conductive fluid slurry, which is the core component to ensure welding quality.

[0150] For example, the positioning plate 52 can be made of a thin SUS304 stainless steel sheet with a thickness of 0.04mm-0.2mm, such as a sheet structure with a thickness of 0.04mm, 0.05mm, 0.06mm, 0.07mm, 0.08mm, 0.09mm, 0.1mm, 0.15mm, or 0.2mm. The surface of the positioning plate 52 is electropolished to achieve a surface roughness Ra ≤ 0.1μm, improving smoothness and flatness, thereby preventing the conductive fluid slurry injected onto the positioning plate 52 from adhering and remaining on it. The surface roughness Ra of the positioning plate 52 can include one of 0.1μm, 0.09μm, 0.08μm, 0.06μm, 0.05μm, or 0.03μm.

[0151] It is particularly important to emphasize that the use of positioning plate 52 screen printing process to replace pressure welding can precisely control the amount of conductive fluid slurry coated (deviation ≤ ±5%), effectively avoiding defects such as uneven solder joint size, hidden cracks, cracks or short circuits / open circuits caused by equipment parameter fluctuations. The welding yield is increased from 70%-80% of the traditional process to more than 95%, making the welding quality more controllable and achieving high precision, high efficiency and low cost control of the welding process.

[0152] Optionally, in some embodiments, the through-hole array 502 includes a plurality of first through holes 021 disposed through a first direction. The plurality of first through holes 021 are spaced apart from each other and arranged in an array. The first through holes 021 are connected to the positioning cavity, specifically to the positioning groove 421.

[0153] For example, the first through hole 021 can be a circular through hole or an elliptical through hole, with a hole diameter ranging from 0.1mm to 0.35mm (the hole diameter can be set to one of 0.1mm, 0.15mm, 0.2mm, 0.25mm, 0.3mm, 0.35mm, etc.). The arrangement can be consistent with the multiple second pads 21 on the circuit board 20 and the multiple first pads 11 on the flexible electrode 10. For example, the spacing between several first through holes 021 and adjacent first through holes 021 along a first direction is 0.1mm-1mm (which can be set to one of 0.1mm, 0.2mm, 0.3mm, 0.4mm, 0.5mm, 0.6mm, 0.7mm, 0.8mm, 0.9mm, 1mm, etc.), and the spacing between several first through holes 021 and adjacent first through holes 021 along a second direction is 0.1mm-1mm (which can be set to one of 0.1mm, 0.2mm, 0.3mm, 0.4mm, 0.5mm, 0.6mm, 0.7mm, 0.8mm, 0.9mm, 1mm, etc.). That is, the several first through holes 021 are distributed in multiple rows and columns, wherein the spacing between two adjacent first through holes 021 in each row is 0.1mm-1mm, and the spacing between two adjacent first through holes 021 in each column is 0.1mm-1mm. It is emphasized that, in any case, the arrangement of the plurality of first through holes 021 and the plurality of second pads 21 on the circuit board 20 and the plurality of first pads 11 on the flexible electrode 10 are consistent with each other. The detailed specification of any one of the three components is the detailed specification of the other two.

[0154] Specifically, when the circuit board 20 and the flexible electrode 10 are at least partially aligned and abutted before welding, the projected outer contours of the multiple first through holes 021, multiple first pads 11, and multiple second pads 21 coincide along the first direction. Conductive fluid slurry can be simultaneously guided along the through hole array 502 to the multiple first pads 11 and multiple second pads 21, so that the multiple first pads 11 and multiple second pads 21 are welded together one-to-one by the conductive connectors 30 formed by the conductive fluid slurry, ensuring more controllable and efficient welding.

[0155] Optionally, along the axial direction of the first through-hole 021, at least one side of the opening of the first through-hole 021 is provided with a chamfer structure. The chamfer structure may include a 0.02mm × 45° rounded corner or bevel, to prevent conductive fluid paste from sticking to the edge, and to avoid the first through-hole 021 being blocked by the conductive fluid paste stuck to the edge, so that the through-hole array 502 can be reused. The first through-hole 021 may also be at least one of a square hole, a polygonal hole, an elliptical hole, etc., as long as its size is smaller than the size of the second pad 21.

[0156] It is particularly important to note that the positioning plate 52 can be replaced with various through-hole arrays 502 with different through-hole diameters to adapt to the screen printing requirements of flexible electrodes 10 with different pad sizes, achieving "one device with multiple specifications compatibility". At the same time, it can achieve millimeter-level precise quantitative control of the amount of conductive fluid slurry by using different combinations of parameters of the through-hole array 502 of the positioning plate 52.

[0157] Optionally, in some embodiments, combined with Figure 8 and Figure 12 As shown, the contour marking area 011 includes a main area 1a and an extension area 1b. Along the length direction of the extension area 1b, one end of the extension area 1b is connected to the main area 1a, and the other end extends to the outer edge of the second positioning component 50 away from the main area 1a. Along the first direction, the projected outer contour of the through-hole array 502 is located within the projected outer contour of the main area 1a. The main area 1a is mainly used for adsorption and positioning of the welding area of ​​the flexible electrode 10 where multiple first pads 11 are provided. After adsorption and positioning, it can be ensured that the multiple first through holes 021 of the through-hole array 502 correspond one-to-one with the multiple first pads 11 on the flexible electrode 10, forming corresponding fluid communication. The extension area 1b can position the area located between the welding area and the contact area 14, and make the contact area 14 extend out of the welding positioning device, improving the positioning accuracy of the flexible electrode 10 without confining the entire flexible electrode 10 within the positioning cavity.

[0158] Optionally, in some embodiments, 75% alcohol is uniformly sprayed onto the outline marking area 011. A flexible electrode 10, with the same size as the outline marking area 011, is then gently placed within the outline marking area 011. Utilizing the surface tension of the alcohol before evaporation, the flexible electrode 10 is positioned quickly and non-contactly, ensuring precise alignment and complete attachment within the outline marking area 011. Furthermore, the surface of the outline marking area 011 is hydrophilically treated (contact angle ≤ 30°) to enhance the micro-adhesive adsorption effect of the adsorption liquid (such as alcohol) on the flexible electrode 10.

[0159] Understandably, the geometric center of the contour marking region 011 coincides with the geometric center of the through-hole array 502 (deviation ≤ 0.02 mm), serving as a visual alignment reference. Through the synergistic effect of the contour marking region 011 and the micro-adhesive adsorption of the adsorption liquid, the flexible electrode 10 is quickly and accurately fixed onto the first surface 503 of the positioning plate 52. The outer edge of the contour marking region 011 completely coincides with the actual edge of the flexible electrode 10 (deviation ≤ 0.02 mm), and the center distance deviation between the outer edge contour line of the contour marking region 011 and the welding area formed by the multiple first pads 11 is ≤ 0.01 mm. The flexible electrode 10 is precisely aligned and completely contained within the contour marking region 011.

[0160] Specifically, after the positioning plate 52 is placed on the first positioning component 40, the flexible electrode 10 directly covers the contour marking area 011. Positioning is completed by intuitively judging the overlap between the edge of the flexible electrode 10 and the contour marking area 011, and multiple second pads 21, without the need for additional measuring tools. The placement of the flexible electrode 10 is directly guided by the visualized contour marking area 011, replacing the complex process of "manual visual inspection + optical positioning system" in traditional processes, and achieving rapid and accurate positioning with "zero tool dependence".

[0161] Optionally, in some embodiments, combined with Figure 5 and Figure 8 As shown, the second positioning component 50 includes a limiting groove 54, which is disposed on the side of the second positioning component 50 near the first positioning component 40. The limiting groove 54 is adapted to the punch 42, and the first surface 503 is located at the bottom of the limiting groove 54. When the second positioning component 50 is in the first position, the limiting groove 54 is sleeved on the punch 42 and fits against the surface of the punch 42, so that the second positioning component 50 is more stable relative to the first positioning component 40 during the welding process. The limiting groove 54 is sleeved on the punch 42 and the first surface 503 fits against the surface of the punch 42. At this time, the punch 42 is the first limiting structure, and the limiting groove 54 is the second limiting structure.

[0162] Understandably, this application utilizes the cooperation between the punch 42 of the first positioning component 40 and the limiting groove 54 of the second positioning component 50 to more tightly and stably restrict the second positioning component 50 to the first position after it moves to the first position. The inner wall surface of the limiting groove 54 fits against the inner wall surface of the punch 42, achieving positioning of the second positioning component 50 in both horizontal and vertical directions, preventing the second positioning component 50 from shifting relative to the first positioning component 40 during the welding process. Therefore, not only can the second positioning component 50 move to the first position more accurately, but the second positioning component 50 in the first position is also more stable relative to the first positioning component 40, thereby preventing the flexible electrode 10 from shifting relative to the circuit board 20 and improving welding accuracy and efficiency.

[0163] Optionally, in some embodiments, the second positioning component 50 includes a clamping member 51, which is detachably clamped to the outer periphery of the positioning plate 52 and can form a limiting groove 54 with the positioning plate 52. The limiting groove 54 is adapted to the punch 42 and can be sleeved on the punch 42 and fit against the surface of the punch 42.

[0164] In other words, during the welding of the circuit board 20 and the flexible electrode 10 using conductive fluid slurry, when it is necessary to replace the through-hole array 502 with different specifications and sizes (i.e., different apertures of the first through-hole 021), only the positioning plate 52 with the different specifications and sizes of the through-hole array 502 needs to be replaced. When the positioning plate 52 is no longer needed, it can be removed from the clamping member 51, and the positioning plate 52 that needs to be used can be clamped by the clamping member 51. Moreover, after the positioning plate 52 is clamped on the clamping member 51, it can form a limiting groove 54 with the clamping member 51, making assembly efficient and convenient.

[0165] Optionally, in some embodiments, combined with Figures 7-8 and Figure 10 , Figure 12 As shown, the clamping component 51 includes a first frame 511 and a second frame 512. Along the first direction, the first frame 511 is located on opposite sides of the positioning plate 52 and has a clamped state for fixing the positioning plate 52 and a loosened state for removing the positioning plate 52.

[0166] Optionally, the first frame 511 is provided with a first clearance hole 5111. The second frame 512 is provided with a second clearance hole 5121. The first clearance hole 5111 on the first frame 511 exposes the upper surface of the positioning plate 52, facilitating the injection of conductive fluid slurry into the through-hole array 502 on the positioning plate 52, so that the conductive slurry can flow along the through-hole array 502 to achieve welding between the first pad 11 and the second pad 21. When the clamping component 51 is in the clamped state, the inner wall surface of the second clearance hole 5121 on the second frame 512 and the positioning plate 52 form a limiting groove 54, which is adapted to the punch 42.

[0167] Optionally, when the clamping component 51 is in the clamped state, the positioning plate 52 is clamped and embedded between the first frame 511 and the second frame 512. The area of ​​the positioning plate 52 that is not clamped accounts for 80% of the total area of ​​the first frame 511 and the second frame 512, and the geometric center of its through-hole array 502 coincides with the geometric center of the first frame 511 and the second frame 512. By replacing and installing positioning plates 52 with through-hole arrays 502 of different specifications, precise control of the coating position and amount of conductive fluid slurry can be achieved, thereby ensuring welding quality.

[0168] Specifically, in some examples, both the first frame 511 and the second frame 512 are metal plates (such as steel plates) of a certain thickness, which are convenient to process. The first frame 511 is made of 3mm-5mm thick steel plate, with countersunk holes at the four corners, and a flat bottom surface that fits against the upper surface of the positioning plate 52. As a clamping structure for the positioning plate 52, it provides stable support for the positioning plate 52 through rigid fastening. The second frame 512 is made of 3mm-5mm thick steel plate, with threaded holes at the four corners of the top surface, and a flat top surface that fits against the lower surface of the positioning plate 52.

[0169] Optionally, the steel plate serving as the first frame 511 and the steel plate serving as the second frame 512 are arranged in parallel (the parallelism between them is ≤0.02mm), and the distance between them is equal to the thickness of the positioning plate 52 + 0.01mm, so as to ensure that the positioning plate 52 can be evenly clamped by the first frame 511 and the second frame 512.

[0170] Optionally, in some embodiments, the clamping component 51 further includes a locking member 531. The locking member 531 locks the first frame 511 and the second frame 512 into a clamped state or unlocks them into a released state. When the positioning plate 52 needs to be replaced, the first frame 511 and the second frame 512 are unlocked into the released state using the locking member 531. After replacing the new positioning plate 52, the first frame 511 and the second frame 512 are locked into the clamped state using the locking member 531. Disassembly is convenient and assembly is simple.

[0171] For example, the clamping component 51 also includes a matching connecting hole 532. The locking component 531 may specifically include a screw. The connecting hole 532 is disposed through the first frame 511, the positioning plate 52 and the second frame 512. An internal thread matching the external thread on the screw is provided in the connecting hole 532 of one of the first frame 511 and the second frame 512. Then, the screw is inserted into the connecting hole 532 and tightened by engaging the internal thread. The assembly is convenient and the cost is low.

[0172] Optionally, in some embodiments, combined with Figure 7-8 and Figure 9 , Figure 12 As shown, the clamping component 51 includes a third groove 62. Along a third direction, the third groove 62 at least connects to one side of the second clearance hole 5121 of the second frame 512. For example, the groove width of the third groove 62 is 13mm-14.5mm, and the groove thickness is 3mm-5mm, formed by machining. When the limiting groove 54 is formed by the second frame 512 and the positioning plate 52, the third groove 62 can be directly machined onto the second frame 512, making machining convenient.

[0173] Specifically, when the second positioning component 50 is in the first position, the second groove 61 in the first positioning component 40 and the third groove 62 in the second positioning component 50 form a receiving cavity 60. The receiving cavity 60 is connected between the positioning cavity and the outside of the welding positioning device, which can reserve space for the flexible electrode 10 and / or the flexible circuit board to extend out of the welding positioning device, so that the area of ​​the flexible electrode 10 away from the first solder pad 11 can extend out of the welding positioning device along the receiving cavity 60, thereby avoiding damage to the flexible electrode 10 and / or the flexible circuit board.

[0174] Optionally, in some embodiments, combined with Figure 6 and Figure 8 As shown, when the circuit board 20 includes a rigid circuit board, the third groove 62, along a third direction, only connects to one side of the second clearance hole 5121 of the second frame 512, and can be formed with the corresponding second groove 61 on the first positioning component 40 to form a receiving cavity 60, which is in fluid communication with the positioning cavity. The receiving cavity 60 is used to reserve space for the flexible electrode 10 to extend out of the welding positioning device, preventing damage to parts of the flexible electrode 10 other than the welding area.

[0175] Optionally, in some embodiments, combined with Figure 10 , Figure 12As shown, when the circuit board 20 includes a flexible printed circuit board (FPC), the third groove 62, along a third direction, connects the opposite sides of the second clearance hole 5121 of the second frame 512, and can be formed with the corresponding second groove 61 on the first positioning component 40 to form a receiving cavity 60, which is in fluid communication with the positioning cavity. Further, the side of the extension area 1b of the contour marking area 011 away from the main body area 1a is located within any of the third groove 62, extending along the bottom of the third groove 62 to the outer edge of the second positioning component 50. In this case, the receiving cavity 60 is used to reserve space for the flexible electrode 10 and the flexible circuit board to extend out of the welding positioning device, preventing damage to the flexible electrode 10 and other parts of the flexible circuit board except for the welding area.

[0176] Understandably, since the welding segment with multiple second solder pads 21 on the flexible circuit board is located at one end of the flexible circuit board along its own length, it is only necessary to fit the welding segment into the positioning groove 421, while the other parts of the flexible circuit board extend out of the receiving cavity 60 to form the welding positioning device. The presence of the receiving cavity 60 can prevent other parts of the flexible circuit board that are misaligned in the welding segment from being crushed by the first positioning component 40 and the second positioning component 50. Other parts of the flexible electrode 10 that are misaligned in the welding area can also pass through the welding positioning component along the receiving cavity 60, thereby avoiding being crushed by the first positioning component 40 and the second positioning component 50.

[0177] Optionally, in some embodiments, combined with Figure 12 As shown, the positioning plate 52 is provided with corresponding second through holes 72 that are adapted to multiple first protrusions 71. The multiple second through holes 72 are staggered in the through hole array 502. The multiple second through holes 72 are through holes that penetrate the positioning plate 52, including at least three. The at least three second through holes 72 are respectively provided in a one-to-one correspondence with at least three first protrusions 71 (corresponding one-to-one with the number and position of the first protrusions 71). The second through holes 72 and the first protrusions 71 can form a clearance fit. When the fit is achieved, the axis of the corresponding second through hole 72 is completely coincident with the axis of the first protrusion 71.

[0178] Specifically, a plurality of first protrusions 71 disposed on the first positioning component 40 and a plurality of second through holes 72 disposed on the second positioning component 50 constitute a first guide component 70, used to guide the second positioning component 50 to move to a first position along a first direction. Through the first guide component 70, the second positioning component 50 can be guided to move to the first position more accurately and efficiently, thereby achieving precise positioning between the circuit board 20 and the flexible electrode 10, especially in the horizontal direction, achieving sub-millimeter level alignment accuracy. Simultaneously, since the axis of the corresponding second through hole 72 completely coincides with the axis of the first protrusion 71, the coaxiality between the second positioning component 50 and the first positioning component 40 is ensured when the second positioning component 50 moves to the first position.

[0179] It is particularly emphasized that, by setting at least three first protrusions 71 corresponding to the second through holes 72, during the process of moving the second positioning component 50 to the first position, the first protrusions 71 pass through the second through holes 72, thereby guiding the second positioning component 50 to descend to the first position, ensuring precise guidance and positioning. Furthermore, the gap fit between the at least three first protrusions 71 and the second through holes 72 ensures smooth and stable sliding during the guiding process. Overall, the high stability of the alignment process between the first positioning component 40 and the second positioning component 50 is achieved through precise positional constraints, ultimately ensuring rapid and precise alignment between the through hole array 502 and the multiple first pads 11 and multiple second pads 21 during the welding process.

[0180] In summary, it is important to emphasize that the second positioning component 50 is used for precise positioning with the first positioning component 40 and for fixing the flexible electrode 10, effectively avoiding printing misalignment caused by structural deformation. The contour marking area 011 set on the second positioning component 50 provides a visual reference for the placement of the flexible electrode 10. Combined with the precise opening design of the through-hole array 502, it further improves the accuracy of the welding positioning device in the welding position of the flexible electrode 10 and the control of the amount of conductive fluid slurry coated. Furthermore, since the flexible electrode 10 is longer than the welding positioning device, the second frame 512 of the second positioning component 50 has a third groove 62 formed along one or both sides of the third direction to meet the extension requirements of the flexible electrode 10 and the flexible circuit board, preventing the welding positioning device from damaging or injuring the brain electrode device.

[0181] Optionally, in some embodiments, the welding method corresponding to the brain electrode device obtained by using a welding positioning device to assist in the connection positioning between the flexible electrode 10 and the circuit board 20 is briefly described below.

[0182] Specifically, the welding method includes the following steps:

[0183] Step 1: The circuit board 20 is fixed to the first positioning component 40 by the first positioning structure 401 of the welding positioning device.

[0184] Step 2: The flexible electrode 10 is constrained on one side surface facing the first positioning component 40 by the second positioning structure 501 of the welding positioning device.

[0185] Step 3: Move the second positioning component 50 to the first position so that the multiple first pads 11 of the flexible electrode 10 stacked on the circuit board 20 correspond one-to-one with the multiple second pads 21 on the circuit board 20. The conductive connector is formed by solidifying the conductive fluid slurry to weld the multiple first pads 11 and the multiple second pads 21 together.

[0186] Understandably, after the circuit board 20 and the flexible electrode 10 are constrained and positioned in the welding positioning device, this application can align the multiple first pads 11 of the flexible electrode 10 with the multiple second pads 21 on the circuit board 20 one-to-one, achieving precise and rapid positioning of the flexible electrode 10 and the circuit board 20. After the flexible electrode 10 and the circuit board 20 are positioned, the multiple first pads 11 and the multiple second pads 21 can be welded together one-to-one along the clearance space to obtain the desired brain electrode device.

[0187] Meanwhile, when this application uses such a welding positioning device to perform auxiliary positioning welding on the flexible electrode 10 and the circuit board 20, multiple sets of welding positioning devices can be used to perform parallel welding of multiple brain electrode devices. Through assembly line-style alternating operation or multi-station synchronous operation, the production capacity of brain electrode devices can be greatly improved to meet the needs of mass production.

[0188] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions of other embodiments. Different components and technologies in different embodiments can be freely combined and used with each other.

[0189] The above are merely preferred embodiments of this application and are not intended to limit this application in any way. Although this application has disclosed preferred embodiments as above, it is not intended to limit this application. Any person skilled in the art can make some modifications or alterations to the above-disclosed technical content to create equivalent embodiments without departing from the scope of the technical solution of this application. Any simple modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of this application without departing from the scope of the technical solution of this application shall still fall within the scope of the technical solution of this application.

Claims

1. A brain electrode device, characterized in that, include, A flexible electrode, wherein a welding area is provided on the flexible electrode, and the welding area is located on one side of opposite sides of the flexible electrode along the thickness direction of the flexible electrode. The welding area is provided with a plurality of first pads, which are arranged in an array. A circuit board having a plurality of second pads, wherein the plurality of second pads correspond one-to-one with the plurality of first pads; Multiple conductive connectors are connected one-to-one between multiple first pads and multiple second pads. Each conductive connector is a structure formed by the curing of conductive fluid slurry injected between the first pads and the second pads, and there is a gap between two adjacent conductive connectors.

2. The brain electrode device according to claim 1, characterized in that, Each of the first pads is provided with a solder hole, and the conductive connector is at least partially embedded in the solder hole.

3. The brain electrode device according to claim 2, characterized in that, The first pad and the solder hole are asymmetrical elliptical structures; and / or, the ratio between the major axis and the minor axis of the first pad is 2:1; and / or, the ratio between the major axis and the minor axis of the solder hole is 5:

2.

4. The brain electrode device according to claim 2, characterized in that, The flexible electrode includes a first side and a second side opposite to each other along its thickness direction, and a contact area spaced apart from the welding area along its length direction. The weld hole correspondingly penetrates the first side and the second side of the flexible electrode. When multiple first pads and the contact area are all located on the first side, the conductive connector includes: A first conductive layer is located between the first pad and the second pad and extends at least partially from the surface of the second pad along the solder hole to contact the surface of the first pad. The second conductive layer at least partially covers the first conductive layer and extends to the surface of the first pad, and is connected to the first conductive layer. When the contact area is located on the first side, and multiple first pads are located on the second side, the first pads and the second pads abut against each other, and the conductive connector extends from the surface of the second pad to the first side corresponding to the solder hole.

5. The brain electrode device according to any one of claims 2 to 4, characterized in that, It also includes, A protective reinforcement layer, which is at least partially embedded in the pores between the weld hole and the conductive connector.

6. A welding positioning device, characterized in that, The welding positioning device is used to assist in the connection positioning between the flexible electrode and the circuit board in the brain electrode device according to any one of claims 1 to 5, and the welding positioning device includes... A first positioning component, the first positioning component being provided with a first positioning structure, the first positioning structure being at least adapted to restrict the circuit board to the first positioning component; A second positioning component, comprising a second positioning structure, wherein the second positioning structure is at least adapted to constrain the flexible electrode within the second positioning component; wherein... The second positioning component has a first position that aligns with the first positioning component and a second position that is separate from the first positioning component; When the second positioning component is located at the first position, the second positioning structure and the first positioning structure form a positioning cavity, and the circuit board and the flexible electrode at least partially abut against each other.

7. The welding positioning device according to claim 6, characterized in that, The first positioning structure includes, A positioning groove, wherein the positioning groove is disposed on the surface of the first positioning component near the second positioning component and recessed in a direction away from the second positioning component, the shape of the positioning groove being adapted to the circuit board; and / or, The second positioning component includes a first surface adjacent to the first positioning component, and the second positioning structure includes, A contour marking area, the contour marking area being disposed on the first surface, the contour marking area being configured to fit the shape of the flexible electrode; and / or a positioning plate, the contour marking area being disposed on the positioning plate; and / or a through-hole array, the through-hole array correspondingly penetrating the positioning plate.

8. The welding positioning device according to claim 7, characterized in that, The first positioning component also includes, A base and a punch, wherein the punch is detachably protruding from the surface of the base near the second positioning component, and the positioning groove is provided on the punch; And / or, The contour marking area includes a main area and an extension area. Along the length direction of the extension area, one end of the extension area communicates with the main area, and the other end extends to the outer edge of the second positioning component away from the main area. Along the first direction, the projected outer contour of the through-hole array is located within the projected outer contour of the main area; and / or The surface roughness of the second positioning component away from the first positioning component is no greater than 0.1 μm.

9. The welding positioning device according to claim 8, characterized in that, The second positioning component also includes, A clamping component, detachably clamping the outer periphery of the positioning plate, and forming a limiting groove with the positioning plate, the limiting groove being adapted to the punch and being sleeved on the punch and conforming to the surface of the punch; and / or, The through-hole array includes a plurality of first through holes, and a chamfer structure is provided at the opening of at least one side of the first through hole along the axial direction of the first through hole.

10. The welding positioning device according to claim 7, characterized in that, The first positioning component includes at least one first groove, which is recessed into the inner wall surface of at least one side of the positioning groove and communicates with the positioning groove; and / or The first positioning component includes at least one second groove, which is disposed on at least one side of the positioning groove and communicates with the positioning groove, and does not overlap with the first groove.

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