A silicon wafer cutting fluid mixing device

Abstract

The utility model relates to a mixing equipment technical field especially is concerned on a kind of silicon wafer cutting fluid mixing device, including shell, motor, first stirring subassembly and second stirring subassembly, two interval distribution's baffle are arranged in shell, two baffle will the space in shell be sequentially separated from top to bottom into upper mixing chamber, transmission cavity and lower mixing chamber, first stirring subassembly and second stirring subassembly transmission connection, the output end of motor and first stirring subassembly transmission connection;Upper mixing chamber and lower mixing chamber are connected by material conveying component between, material conveying component is used to input the silicon wafer cutting fluid of preliminary mixing in upper mixing chamber into lower mixing chamber, preliminary wetting and dispersion are carried out through upper mixing chamber, high shear fine mixing and defoaming are carried out again through lower mixing chamber, two-stage mixing process effectively solves the problem of silicon powder agglomeration and settlement, ensures the high uniformity and stability of cutting fluid.

Description

Technical Field

[0001] This utility model relates to the field of mixing equipment technology, and in particular to a silicon wafer cutting fluid mixing device. Background Technology

[0002] Silicon wafer cutting fluid is a key auxiliary material in the silicon wafer manufacturing process of the photovoltaic and semiconductor industries. Its uniformity and stability directly affect cutting efficiency and silicon wafer quality. Traditional silicon wafer cutting fluid mixing devices mostly adopt a single-chamber stirring structure, which suffers from problems such as uneven mixing, easy generation of bubbles, easy sedimentation and agglomeration of silicon powder (SiC), and low mixing efficiency. Single-motor driven single-shaft stirring is difficult to achieve efficient wetting and dispersion of high-viscosity liquids and solid powders simultaneously, and the bubbles entrained during the mixing process cannot be effectively removed, resulting in defects in the final slurry and affecting cutting performance. In addition, existing equipment is often single-function, and processes such as mixing, degassing, and curing need to be carried out intermittently in different devices, resulting in low production efficiency and the risk of cross-contamination. Summary of the Invention

[0003] The technical problem to be solved by this utility model is: in order to overcome the problem that the air bubbles entangled in the mixing process in the prior art cannot be effectively removed, resulting in defects in the final slurry and affecting the cutting performance, and that the equipment is often single-function, the mixing, degassing and maturation processes need to be carried out intermittently in different equipment, resulting in low production efficiency and the risk of cross-contamination, this utility model provides a silicon wafer cutting fluid mixing device.

[0004] The technical solution adopted by this utility model to solve its technical problem is: a silicon wafer cutting liquid mixing device, including a shell, a motor, a first stirring component and a second stirring component. Two spaced partitions are arranged inside the shell, and the two partitions divide the space inside the shell from top to bottom into an upper mixing chamber, a transmission chamber and a lower mixing chamber. The first stirring component is arranged in the upper mixing chamber and the second stirring component is arranged in the lower mixing chamber. The first stirring component and the second stirring component are connected by transmission. The output end of the motor is connected by transmission to the first stirring component. The motor is used to provide power for the operation of the first stirring component and the operation of the second stirring component. The upper and lower mixing chambers are connected by a feeding assembly. The feeding assembly is used to input the silicon wafer cutting fluid that has been initially mixed in the upper mixing chamber into the lower mixing chamber. The upper mixing chamber performs initial wetting and dispersion, and the lower mixing chamber performs high-shear fine mixing and degassing. The two-stage mixing process effectively solves the problems of silicon powder agglomeration and sedimentation, ensuring the high uniformity and stability of the cutting fluid.

[0005] The first stirring assembly includes a first stirring shaft and a first stirring paddle arranged on the first stirring shaft, wherein the output end of the motor and the first stirring shaft are connected by a coupling. The second stirring assembly includes a second stirring shaft and a second stirring paddle arranged on the second stirring shaft, and the second stirring shaft and the second stirring shaft are connected by a drive.

[0006] To address the problem of efficiently and reliably transmitting power from the upper stirring shaft to the lower stirring shaft within a sealed transmission chamber, a transmission assembly is further included within the transmission chamber. The input end of the transmission assembly is connected to the first stirring assembly, and the output end of the transmission assembly is connected to the second stirring assembly.

[0007] To address the issue of how to transmit power through a transmission assembly while also enabling differentiated rotational speeds of the upper and lower stirring shafts, the transmission assembly further includes a first transmission tooth and a second transmission tooth meshing with the first transmission tooth. The first transmission tooth is mounted on the first stirring shaft, and the second transmission tooth is arranged on the second stirring shaft. The diameter of the first transmission tooth is larger than that of the second transmission tooth.

[0008] To address the issue of achieving controlled and sealed material transfer between the upper and lower chambers, and avoiding leakage, splashing, or contamination during the transfer process, a further material conveying assembly is included, comprising a conveying pipe, a valve core, and a hydraulic cylinder. The inlet of the conveying pipe is located on its top surface and communicates with the upper mixing chamber. The outlet of the conveying pipe is located on its side and communicates with the lower mixing chamber. The valve core is slidably arranged inside the conveying pipe. The hydraulic cylinder is fixedly connected to the housing, and the piston rod of the hydraulic cylinder is fixedly connected to the valve core. The hydraulic cylinder provides power for the movement of the valve core along the conveying pipe.

[0009] To address the problem of air bubbles being difficult to remove during mixing, and to improve the overall mixing effect by utilizing the gas inside the system, the mixing device further includes an air pump and an aeration pipe. The input end of the air pump is connected to the lower mixing chamber, and the output end of the air pump is connected to the aeration pipe. The aeration pipe is located at the bottom of the upper mixing chamber and has aeration holes.

[0010] The beneficial effects of this utility model are: the silicon wafer cutting fluid mixing device provided by this utility model performs preliminary wetting and dispersion through the upper mixing chamber, and then performs high-shear fine mixing and degassing through the lower mixing chamber. The two-stage mixing process effectively solves the problems of silicon powder agglomeration and sedimentation, and ensures the high uniformity and stability of the cutting fluid. Attached Figure Description

[0011] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0012] Figure 1 This is a schematic diagram of the structure of this utility model; Figure 2 This is a utility model Figure 1 A magnified structural diagram of point A in the middle.

[0013] In the diagram: 1. Shell, 11. Partition, 12. Upper mixing chamber, 13. Transmission chamber, 14. Lower mixing chamber, 2. Motor, 3. First stirring assembly, 31. First stirring shaft, 32. First stirring paddle, 4. Second stirring assembly, 41. Second stirring shaft, 42. Second stirring paddle, 5. Transmission assembly, 51. First transmission gear, 52. Second transmission gear, 6. Material conveying assembly, 61. Material conveying pipe, 62. Valve core, 63. Hydraulic cylinder, 7. Air pump, 8. Aeration pipe. Detailed Implementation

[0014] The present invention will now be described in further detail with reference to the accompanying drawings. These drawings are simplified schematic diagrams, illustrating only the basic structure of the present invention, and therefore only show the components relevant to the present invention.

[0015] like Figure 1 This is a schematic diagram of the structure of the present invention. A silicon wafer cutting fluid mixing device includes a housing 1, a motor 2, a first stirring assembly 3, and a second stirring assembly 4. Two spaced partitions 11 are arranged inside the housing 1. A feed inlet is arranged on the top surface of the housing 1, and a discharge outlet is arranged on the bottom surface of the housing 1. The two partitions 11 divide the space inside the housing 1 from top to bottom into an upper mixing chamber 12, a transmission chamber 13, and a lower mixing chamber 14. The first stirring assembly 3 is arranged in the upper mixing chamber 12, and the second stirring assembly 4 is arranged in the lower mixing chamber 14. The first stirring assembly 3 and the second stirring assembly 4 are connected by a transmission. The output end of the motor 2 is connected by a transmission to the first stirring assembly 3. The motor 2 is used to provide power for the operation of the first stirring assembly 3 and the second stirring assembly 4. The upper mixing chamber 12 and the lower mixing chamber 14 are connected by a feeding assembly 6. The feeding assembly 6 is used to input the silicon wafer cutting fluid that has been initially mixed in the upper mixing chamber 12 into the lower mixing chamber 14. The fluid is initially wetted and dispersed in the upper mixing chamber 12, and then subjected to high-shear fine mixing and degassing in the lower mixing chamber 14. The two-stage mixing process effectively solves the problems of silicon powder agglomeration and sedimentation, and ensures the high uniformity and stability of the cutting fluid.

[0016] The first stirring assembly 3 includes a first stirring shaft 31 and a first stirring blade 32 arranged on the first stirring shaft 31. The output end of the motor 2 is connected to the first stirring shaft 31 by a coupling. The second stirring assembly 4 includes a second stirring shaft 41 and a second stirring paddle 42 arranged on the second stirring shaft 41, and the second stirring shaft 41 and the second stirring shaft 41 are connected in a driving connection.

[0017] like Figure 2As shown, a transmission assembly 5 is arranged inside the transmission chamber 13. The input end of the transmission assembly 5 is connected to the first stirring assembly 3, and the output end of the transmission assembly 5 is connected to the second stirring assembly 4. By adding an independent transmission assembly 5, the power is transmitted in the isolated chamber, preventing the impact of material leakage on the transmission mechanism 5, and avoiding contamination of the material by lubricating oil, etc., thus ensuring the stability of the transmission and the purity of the product.

[0018] like Figure 2 As shown, the transmission assembly 5 includes a first transmission tooth 51 and a second transmission tooth 52 meshing with the first transmission tooth 51. The first transmission tooth 51 is mounted on the first stirring shaft 31, and the second transmission tooth 52 is arranged on the second stirring shaft 41. The diameter of the first transmission tooth 51 is larger than that of the second transmission tooth 52. By using gear meshing transmission and setting different tooth ratios (the diameter of the first transmission tooth 51 is larger than that of the second transmission tooth 52), the speed-increasing effect is achieved, enabling the second stirring shaft 41 to obtain a higher rotational speed, thereby meeting the high shear dispersion process requirements of the lower mixing chamber 14. The structure is simple and reliable.

[0019] like Figure 2 As shown, the material conveying assembly 6 includes a material conveying pipe 61, a valve core 62, and a hydraulic cylinder 63. The inlet of the material conveying pipe 61 is located on the top surface of the material conveying pipe 61 and is connected to the upper mixing chamber 12. The outlet of the material conveying pipe 61 is located on its side and is connected to the lower mixing chamber 14. The valve core 62 is slidably arranged inside the material conveying pipe 61. The hydraulic cylinder 63 is fixedly connected to the housing 1. The piston rod of the hydraulic cylinder 63 is fixedly connected to the valve core 62. The hydraulic cylinder 63 is used to provide power for the movement of the valve core 62 along the material conveying pipe 61. The slide valve type material conveying assembly controlled by the hydraulic cylinder 63 realizes the automatic and precise opening and closing of the transfer channel, ensuring the airtightness and controllability of the transfer process, and improving the automation level and production continuity of the equipment.

[0020] like Figure 2 As shown, the mixing device also includes an air pump 7 and an aeration pipe 8. The input end of the air pump 7 is connected to the lower mixing chamber 14, and the output end of the air pump 7 is connected to the aeration pipe 8. The aeration pipe 8 is arranged at the bottom of the upper mixing chamber 12 and has aeration holes, which increases the air circulation system. It draws the material from the lower mixing chamber 14 to the upper mixing chamber 12 and aerates it, which can promote the mixing of materials in the upper mixing chamber 12, reduce the bubble content in the slurry in the lower mixing chamber 14, and improve the product quality.

[0021] Working process: The base liquid PEG and silicon carbide micro powder and other raw materials are put into the upper mixing chamber 12. The motor 2 is started. The motor 2 drives the first stirring paddle 32 to rotate through the first stirring shaft 31 to perform preliminary stirring and wetting of the material at medium and low speed to prevent powder from flying and agglomerating. After the preliminary mixing is completed, the hydraulic cylinder 63 is activated, pulling the valve core 62 to move in the conveying pipe 61 and opening the channel. The slurry initially mixed in the upper mixing chamber 12 enters the lower mixing chamber 14 under the action of gravity or pressure through the conveying assembly 6. At the same time as the material enters the lower mixing chamber 14, the first stirring shaft 31 drives the second stirring shaft 41 to rotate at high speed through the first transmission gear 51 and the second transmission gear 52 in the transmission assembly 5 in the transmission chamber 13. Due to the transmission ratio design, the speed of the second stirring shaft 41 is higher than that of the first stirring shaft 31, which drives the second stirring paddle 42 to perform high shear dispersion of the slurry and thoroughly break up the agglomerates. At the same time, the air pump 7 extracts the gas, including the entrained air, from the top space of the lower mixing chamber 14 and releases it at the bottom of the upper mixing chamber 12 through the aeration pipe 8. The aeration process promotes the mixing of the materials in the upper mixing chamber 12 on the one hand, and avoids the generation of bubbles in the silicon wafer cutting fluid by using negative pressure exhaust on the other hand. After the mixing is completed, the final high-quality silicon wafer cutting fluid is discharged from the outlet of the lower mixing chamber 14.

[0022] Based on the above-described preferred embodiments of this utility model, and through the foregoing description, those skilled in the art can make various changes and modifications without departing from the technical concept of this utility model. The technical scope of this utility model is not limited to the contents of the specification, but must be determined according to the scope of the claims.

Claims

1. A silicon wafer dicing liquid mixing device, characterized by comprising: The device includes a housing (1), a motor (2), a first stirring assembly (3), and a second stirring assembly (4). The housing (1) has two spaced partitions (11) arranged inside. The two partitions (11) divide the space inside the housing (1) from top to bottom into an upper mixing chamber (12), a transmission chamber (13), and a lower mixing chamber (14). The first stirring assembly (3) is arranged in the upper mixing chamber (12), and the second stirring assembly (4) is arranged in the lower mixing chamber (14). The first stirring assembly (3) and the second stirring assembly (4) are connected by a drive. The output end of the motor (2) is connected by a drive to the first stirring assembly (3). The motor (2) is used to provide power for the operation of the first stirring assembly (3) and the operation of the second stirring assembly (4). The upper mixing chamber (12) and the lower mixing chamber (14) are connected by a feeding assembly (6), which is used to feed the silicon wafer cutting liquid initially mixed in the upper mixing chamber (12) into the lower mixing chamber (14).

2. The silicon wafer cutting fluid mixing device as described in claim 1, characterized in that: The first stirring assembly (3) includes a first stirring shaft (31) and a first stirring paddle (32) arranged on the first stirring shaft (31). The output end of the motor (2) and the first stirring shaft (31) are connected by a coupling. The second stirring assembly (4) includes a second stirring shaft (41) and a second stirring paddle (42) arranged on the second stirring shaft (41), and the second stirring shaft (41) and the second stirring shaft (41) are connected in a driving manner.

3. The silicon wafer cutting fluid mixing device as described in claim 2, characterized in that: A transmission assembly (5) is arranged inside the transmission cavity (13). The input end of the transmission assembly (5) is connected to the first stirring assembly (3), and the output end of the transmission assembly (5) is connected to the second stirring assembly (4).

4. The silicon wafer cutting fluid mixing device as described in claim 3, characterized in that: The transmission assembly (5) includes a first transmission tooth (51) and a second transmission tooth (52) meshing with the first transmission tooth (51). The first transmission tooth (51) is mounted on the first stirring shaft (31), and the second transmission tooth (52) is arranged on the second stirring shaft (41). The diameter of the first transmission tooth (51) is larger than that of the second transmission tooth (52).

5. The silicon wafer cutting fluid mixing device as described in claim 1, characterized in that: The feeding assembly (6) includes a feeding pipe (61), a valve core (62), and a hydraulic cylinder (63). The inlet of the feeding pipe (61) is located on the top surface of the feeding pipe (61). The inlet of the feeding pipe (61) is connected to the upper mixing chamber (12). The outlet of the feeding pipe (61) is located on its side. The outlet of the feeding pipe (61) is connected to the lower mixing chamber (14). The valve core (62) is slidably arranged inside the feeding pipe (61). The hydraulic cylinder (63) is fixedly connected to the housing (1). The piston rod of the hydraulic cylinder (63) is fixedly connected to the valve core (62). The hydraulic cylinder (63) is used to provide power for the movement of the valve core (62) along the feeding pipe (61).

6. The silicon wafer cutting fluid mixing device as described in claim 1, characterized in that: The mixing device also includes an air pump (7) and an aeration pipe (8). The input end of the air pump (7) is connected to the lower mixing chamber (14), and the output end of the air pump (7) is connected to the aeration pipe (8). The aeration pipe (8) is arranged at the bottom of the upper mixing chamber (12) and has aeration holes.

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