A semiconductor cleaning box overflow pipe structure
Patent Information
- Application Number
- CN202521693990.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-08-11
- Publication Date
- 2026-09-01
- Estimated Expiration
- 2035-08-11
AI Technical Summary
[0005]本实用新型的目的是提供一种半导体清洗箱溢流管结构,用以解决现有的一种半导体清洗箱溢流管结构不便于调节其长度的缺陷
[0020]调节结构可调整溢流管的长度,以便其满足不同的安装需求,过滤结构可起到一定的过滤作用,避免溢流管发生堵塞的情况,防护结构可对溢流管起到一定的防护作用,提高其使用效果,延长其使用寿命。
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Figure CN224700696U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of semiconductor cleaning technology, and in particular to an overflow pipe structure for a semiconductor cleaning box. Background Technology
[0002] Semiconductors are materials whose conductivity at room temperature is between that of conductors and insulators. They can be divided into two main categories according to their chemical composition: elemental semiconductors and compound semiconductors. During semiconductor processing, they need to be cleaned. Cleaning is carried out in a cleaning tank, which is usually equipped with an overflow pipe. The overflow pipe is used to control the liquid level in the container. When the liquid level is too high, the overflow pipe is designed to drain the excess liquid to avoid overfilling or overflowing the container.
[0003] To address this, patent CN213204336U discloses an overflow pipe structure, which includes an overflow pipe body and an overflow valve installed in the overflow pipe body. The overflow valve has a soft water-passing sleeve with a normally closed water-passing gap. This invention, through the overflow valve, prevents air from the water tank from entering the toilet's drainage channel through the overflow pipe, thus avoiding affecting the drainage speed of the drainage channel.
[0004] The existing overflow pipe structure is not easy to adjust in length during use, thus failing to meet different installation requirements and resulting in poor performance. Utility Model Content
[0005] The purpose of this invention is to provide an overflow pipe structure for a semiconductor cleaning box, in order to solve the defect that the length of an existing overflow pipe structure for a semiconductor cleaning box is not easily adjustable.
[0006] To solve the above-mentioned technical problems, this utility model provides the following technical solution: a semiconductor cleaning box overflow pipe structure, including a first overflow pipe, a filter structure is provided inside the first overflow pipe, a second overflow pipe is provided at one end of the first overflow pipe, a protective structure is provided on the outer surface of both the second overflow pipe and the first overflow pipe, an adjustment structure is provided between the first overflow pipe and the second overflow pipe, the adjustment structure includes a fixing ring installed on the outside of the first overflow pipe, a limiting spring evenly installed on one end of the fixing ring, a dustproof ring installed on one end of the limiting spring, and an adjustment ring installed on one end of the second overflow pipe, the inner side of the adjustment ring is provided with an internal thread, and the outer surface of one end of the first overflow pipe is provided with an external thread that mates with the internal thread.
[0007] Preferably, the inner diameter of the adjusting ring is larger than the diameter of the first overflow pipe, and the adjusting ring and the first overflow pipe are connected by a thread.
[0008] The above structure facilitates the fixing and moving of the adjusting ring.
[0009] Preferably, the limiting springs are arranged in a ring on the outside of the first overflow pipe.
[0010] The above structure allows the dustproof ring to move until it contacts the adjusting ring.
[0011] Preferably, the filter structure includes a filter screen, a sliding groove, a locking block, a sliding block, a slot, and a limiting ring. The limiting ring is installed on the inner wall of the first overflow pipe, and a sliding block is uniformly installed at one end of the limiting ring. The filter screen is installed inside the first overflow pipe, and a sliding groove is uniformly formed on the filter screen. A locking block is uniformly installed at one end of the filter screen, and a slot that cooperates with the locking block is uniformly formed on the limiting ring.
[0012] The above structure can play a certain filtering role and prevent the overflow pipe from becoming blocked.
[0013] Preferably, the width of the groove is greater than the width of the slider, and the groove and the slider form a sliding structure.
[0014] The above structure makes it easy to pull the filter screen.
[0015] Preferably, the card block and the card slot form an engaging structure.
[0016] The above structure facilitates quick and easy fixing of the filter screen.
[0017] Preferably, the protective structure includes a wear-resistant layer and a heat insulation layer, the heat insulation layer is installed on the outer surface of the second overflow pipe and the first overflow pipe, and the outer surface of the heat insulation layer is covered with a wear-resistant layer.
[0018] The above structure can provide some protection for the overflow pipe, improve its performance, and extend its service life.
[0019] The overflow pipe structure of the semiconductor cleaning box provided by this utility model has the following advantages:
[0020] The adjustable structure allows for adjustment of the overflow pipe's length to meet different installation requirements. The filter structure provides a certain degree of filtration to prevent the overflow pipe from becoming clogged. The protective structure provides a certain degree of protection for the overflow pipe, improving its performance and extending its service life.
[0021] By rotating the adjustment ring, the second overflow pipe moves in the direction of the first overflow pipe, adjusting the distance between the first and second overflow pipes to adjust the length of the overflow pipe. The limit spring moves the dustproof ring until it contacts the adjustment ring, covering the external thread of the first overflow pipe to achieve the purpose of dust prevention.
[0022] With the filter structure in place, the filter screen can play a certain filtering role, preventing the first overflow pipe from becoming blocked. Pulling the filter screen will loosen the locking block and slot, releasing the fixing restriction on the filter screen. Pulling out the filter screen will allow it to be replaced.
[0023] The protective structure improves the wear resistance of the first and second overflow pipes, extending their service life. The insulation layer provides insulation, effectively preventing the first and second overflow pipes from freezing in cold winters. Attached Figure Description
[0024] Figure 1 This is a front view structural diagram of the present utility model;
[0025] Figure 2 This is a frontal cross-sectional view of the present invention.
[0026] Figure 3 This is a front view of the exploded structure of this utility model;
[0027] Figure 4 This is a side view of the protective structure of this utility model;
[0028] Figure 5 This is a front view schematic diagram of the filter structure of this utility model.
[0029] The following are the annotations in the figure: 1. Adjustment structure; 11. Fixing ring; 12. Limiting spring; 13. Dustproof ring; 14. Adjustment ring; 141. Internal thread; 2. First overflow pipe; 21. External thread; 3. Filter structure; 31. Filter screen; 32. Slide groove; 33. Locking block; 34. Sliding block; 35. Locking groove; 36. Limiting ring; 4. Second overflow pipe; 5. Protective structure; 51. Wear-resistant layer; 52. Insulation layer. Detailed Implementation
[0030] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0031] Please see Figures 1-5 The present invention provides a semiconductor cleaning box overflow pipe structure, including a first overflow pipe 2.
[0032] Reference Figures 1-5As shown, a second overflow pipe 4 is provided at one end of the first overflow pipe 2. An adjustment structure 1 is provided between the first overflow pipe 2 and the second overflow pipe 4. The adjustment structure 1 includes a fixing ring 11 installed on the outside of the first overflow pipe 2, a limiting spring 12 evenly installed on one end of the fixing ring 11, the limiting spring 12 being distributed in a ring on the outside of the first overflow pipe 2, a dustproof ring 13 installed on one end of the limiting spring 12, and an adjustment ring 14 installed on one end of the second overflow pipe 4. The inner diameter of the adjustment ring 14 is larger than the diameter of the first overflow pipe 2. The adjustment ring 14 and the first overflow pipe 2 are connected by a thread. An internal thread 141 is provided on the inner side of the adjustment ring 14, and an external thread 21 that mates with the internal thread 141 is provided on the outer surface of one end of the first overflow pipe 2.
[0033] Rotating the adjusting ring 14 causes the second overflow pipe 4 to move along the direction of the first overflow pipe 2 due to the threaded connection. This adjusts the distance between the first overflow pipe 2 and the second overflow pipe 4, thereby adjusting the length of the overflow pipe to meet different installation requirements and improve the performance. During the adjustment process, the limiting spring 12 moves the dustproof ring 13 until it contacts the adjusting ring 14. The dustproof ring 13 cooperates with the adjusting ring 14 to cover the external thread 21 of the first overflow pipe 2, preventing dust from falling on the external thread 21 and causing the inability to adjust.
[0034] Reference Figure 1 and Figure 5 As shown, a filter structure 3 is provided inside the first overflow pipe 2. The filter structure 3 includes a filter screen 31, a sliding groove 32, a locking block 33, a sliding block 34, a locking groove 35, and a limiting ring 36. The limiting ring 36 is installed on the inner wall of the first overflow pipe 2. A sliding block 34 is evenly installed at one end of the limiting ring 36. The filter screen 31 is installed inside the first overflow pipe 2. The filter screen 31 has a sliding groove 32 evenly opened on it. The width of the sliding groove 32 is greater than the width of the sliding block 34. The sliding groove 32 and the sliding block 34 form a sliding structure. A locking block 33 is evenly installed at one end of the filter screen 31. A locking groove 35 that cooperates with the locking block 33 is evenly opened on the limiting ring 36. The locking block 33 and the locking groove 35 form a locking structure for fixing the filter screen 31.
[0035] The filter screen 31 can play a certain filtering role and prevent the first overflow pipe 2 from being blocked. When the filter screen 31 needs to be replaced, pull the filter screen 31, the locking block 33 and the locking groove 35 will be released, the fixing restriction on the filter screen 31 will be released, the slider 34 will move along the direction of the sliding groove 32, and the filter screen 31 will be pulled out for replacement.
[0036] Reference Figure 4As shown, the outer surfaces of the second overflow pipe 4 and the first overflow pipe 2 are both provided with a protective structure 5. The protective structure 5 includes a wear-resistant layer 51 and a heat insulation layer 52. The heat insulation layer 52 is installed on the outer surfaces of the second overflow pipe 4 and the first overflow pipe 2. The wear-resistant layer 51 is installed on the outer surface of the heat insulation layer 52. The wear-resistant layer 51 is a rubber wear-resistant material.
[0037] The wear-resistant layer 51 can improve the wear resistance of the first overflow pipe 2 and the second overflow pipe 4 and extend their service life. The insulation layer 52 can play a certain role in heat preservation and can effectively prevent the first overflow pipe 2 and the second overflow pipe 4 from freezing in winter.
[0038] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.
Claims
1. A semiconductor cleaning box overflow pipe structure, comprising a first overflow pipe (2); Its features are: The first overflow pipe (2) is provided with a filter structure (3) inside, and a second overflow pipe (4) is provided at one end of the first overflow pipe (2). The outer surfaces of the second overflow pipe (4) and the first overflow pipe (2) are both provided with a protective structure (5). An adjustment structure (1) is provided between the first overflow pipe (2) and the second overflow pipe (4); The adjustment structure (1) includes a fixing ring (11) installed on the outside of the first overflow pipe (2), a limiting spring (12) evenly installed on one end of the fixing ring (11), a dustproof ring (13) installed on one end of the limiting spring (12), and an adjustment ring (14) installed on one end of the second overflow pipe (4). The inner side of the adjustment ring (14) is provided with an internal thread (141), and the outer surface of one end of the first overflow pipe (2) is provided with an external thread (21) that matches the internal thread (141).
2. The overflow pipe structure of a semiconductor cleaning box according to claim 1, characterized in that: The inner diameter of the adjusting ring (14) is larger than the diameter of the first overflow pipe (2), and the adjusting ring (14) and the first overflow pipe (2) are connected by a thread.
3. The overflow pipe structure of a semiconductor cleaning box according to claim 1, characterized in that: The limiting spring (12) is arranged in a ring on the outside of the first overflow pipe (2).
4. The overflow pipe structure of a semiconductor cleaning box according to claim 1, characterized in that: The filter structure (3) includes a filter screen (31), a sliding groove (32), a locking block (33), a sliding block (34), a slot (35), and a limiting ring (36). The limiting ring (36) is installed on the inner wall of the first overflow pipe (2). A sliding block (34) is evenly installed on one end of the limiting ring (36). The filter screen (31) is installed inside the first overflow pipe (2). A sliding groove (32) is evenly opened on the filter screen (31). A locking block (33) is evenly installed on one end of the filter screen (31). A slot (35) that cooperates with the locking block (33) is evenly opened on the limiting ring (36).
5. The overflow pipe structure of a semiconductor cleaning box according to claim 4, characterized in that: The width of the groove (32) is greater than the width of the slider (34), and the groove (32) and the slider (34) form a sliding structure.
6. The overflow pipe structure of a semiconductor cleaning box according to claim 4, characterized in that: The card block (33) and the card slot (35) form a locking structure.
7. The overflow pipe structure of a semiconductor cleaning box according to claim 1, characterized in that: The protective structure (5) includes a wear-resistant layer (51) and a heat insulation layer (52). The heat insulation layer (52) is installed on the outer surface of the second overflow pipe (4) and the first overflow pipe (2). The wear-resistant layer (51) is installed on the outer surface of the heat insulation layer (52).
Citation Information
Patent Citations
Overflow pipe structure
CN213204336U