Quick-release type semiconductor slot cleaning tank assembly connecting structure

Abstract

The utility model relates to the field of cleaning tank assembly connection, specifically relates to a quick detach type semiconductor tank type cleaning tank assembly connecting structure, including the number is two symmetrical distribution's connecting plate, the top of connecting plate is provided with two lifting columns, and the lifting column between two is provided with the lifting adjusting plate, one side of lifting adjusting plate is provided with the connecting slot, and the inside slide of connecting slot is provided with the plug -in board, the utility model discloses the cooperation structure of setting lifting column and lifting adjusting plate, can realize the quick adjustment of the relative height and distance between two connecting plates, thereby satisfies the height adaptation demand under different installation environment, improves the installation flexibility of equipment. The telescopic connecting structure that adopts connecting outer tube, connecting inner tube and moving rod are connected, can realize the quick connection and separation between connecting plate, simplifies the dismounting process, improves the operation efficiency, is especially suitable for the occasion that needs frequently changing or adjusting.

Description

Technical Field

[0001] This utility model relates to the field of cleaning box assembly connection, specifically to a quick-release semiconductor tank cleaning box assembly connection structure. Background Technology

[0002] A Chinese patent discloses a tank-type cleaning machine (application number CN202020899379.5), comprising a housing and an installation assembly. The housing defines a cleaning tank for containing cleaning agents. The installation assembly includes a mounting plate, a rotating frame for mounting wafers, and a rotation drive device. Both the rotation drive device and the rotating frame are mounted on the mounting plate. The output ends of the rotating frame and the rotation drive device are connected. The mounting plate is detachably mounted on the opening of the cleaning tank. The tank-type cleaning machine using this invention has a simple structure, and the cleaning solution on the wafer surface is in a flowing state, effectively improving the uniformity of wafer etching and surface cleanliness, avoiding wafer defects, and improving production efficiency and yield.

[0003] These types of trough-type cleaning machines often need to be connected to other objects, which presents many inconveniences when connecting to external equipment or supporting structures. On the one hand, the connection position cannot be flexibly adjusted, resulting in poor installation adaptability; on the other hand, traditional connection structures make it difficult to achieve precise adjustment of the relative height and distance of the connected objects, affecting the overall adaptability and ease of operation of the equipment.

[0004] Therefore, a connection structure that is simple in structure, easy to adjust, and easy to quickly disassemble and assemble is needed to improve the flexibility of use of semiconductor tank cleaning box assemblies. Utility Model Content

[0005] To address the shortcomings of existing technologies, this utility model provides a quick-release semiconductor tank cleaning box assembly connection structure.

[0006] The technical solution of this utility model is as follows: This utility model provides a quick-release semiconductor tank cleaning box assembly connection structure, including two symmetrically distributed connecting plates. Two lifting columns are symmetrically arranged on the top of the connecting plates, and a lifting adjustment plate is arranged between the two lifting columns. A connecting slot is opened on one side of the lifting adjustment plate, and an insertion plate is slidably arranged inside the connecting slot. A connecting outer cylinder is arranged on one side of the insertion plate, and a connecting inner cylinder is arranged on one side of the connecting outer cylinder. A moving rod is arranged on one side of the connecting inner cylinder, and the two moving rods are connected to each other.

[0007] Optionally, the top of the connecting plate is provided with a connecting groove, and the top of the connecting plate is fixedly connected to the lifting column.

[0008] Optionally, a lifting adjustment groove is provided on one side of the lifting column, and the lifting adjustment plate is slidably connected in the lifting adjustment groove.

[0009] Optionally, the lifting adjustment plate is provided with a stabilizing groove at the lifting adjustment slot of the lifting column, a support cap is provided on one side of the lifting adjustment plate, and a stabilizing wire is provided on one side of the lifting column, which passes through the support cap and is threadedly connected to the support cap.

[0010] Optionally, a connecting stabilizing plate is provided on one side of the connecting outer cylinder, and one side of the connecting stabilizing plate is fixedly connected to the insert plate. The insert plate is connected to the connecting slot of the lifting adjustment plate.

[0011] Optionally, a sliding inner groove is provided on one side of the connecting outer cylinder, and the connecting inner cylinder is slidably connected to the inside of the connecting outer cylinder. A sliding inner groove is provided on one side of the connecting inner cylinder, and the moving rod is slidably connected to the inside of the sliding inner groove. Fixing threads are provided on the outside of both the connecting outer cylinder and the connecting inner cylinder.

[0012] Optionally, a support and stabilizing plate is fixedly connected to the outside of the movable rod, and two adjacent support and stabilizing plates are connected by screws.

[0013] The beneficial effects achieved by this utility model are as follows: This invention, through the cooperative structure of a lifting column and a lifting adjustment plate, enables rapid adjustment of the relative height and distance between two connecting plates, thereby meeting the height adaptation requirements of different installation environments and improving the installation flexibility of the equipment. The telescopic connection structure, composed of a connecting outer cylinder, a connecting inner cylinder, and a moving rod, allows for rapid connection and separation between the connecting plates, simplifying the assembly and disassembly process, improving operational efficiency, and is particularly suitable for occasions requiring frequent replacement or adjustment. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the overall structure of this utility model; Figure 2 This is a partial structural schematic diagram of the present invention; Figure 3 yes Figure 2 Schematic diagram of the explosion of the middle structure; Figure 4 This is a cross-sectional view of the connection structure between the outer cylinder and the moving rod.

[0015] In the diagram, 1 is the connecting plate; 101 is the connecting groove; 2 is the lifting column; 201 is the lifting adjustment groove; 3 is the lifting adjustment plate; 301 is the support cap; 302 is the stabilizing wire; 303 is the connecting slot; 4 is the insertion plate; 5 is the connecting outer cylinder; 501 is the connecting stabilizing plate; 502 is the sliding inner groove one; 6 is the connecting inner cylinder; 601 is the sliding inner groove two; 7 is the moving rod; and 701 is the supporting stabilizing plate. Detailed Implementation

[0016] To facilitate understanding of this utility model by those skilled in the art, the specific embodiments of this utility model are described below with reference to the accompanying drawings. Example 1

[0017] like Figure 1-4 As shown, this utility model provides a quick-release semiconductor tank cleaning box assembly connection structure, including two symmetrically distributed connecting plates 1. Two lifting columns 2 are symmetrically arranged on the top of the connecting plates 1. A lifting adjustment plate 3 is arranged between the two lifting columns 2. A connecting slot 303 is opened on one side of the lifting adjustment plate 3. An insertion plate 4 is slidably arranged inside the connecting slot 303. A connecting outer cylinder 5 is arranged on one side of the insertion plate 4. A connecting inner cylinder 6 is arranged on one side of the connecting outer cylinder 5. A moving rod 7 is arranged on one side of the connecting inner cylinder 6. The two moving rods 7 are connected to each other.

[0018] This invention, through the cooperative structure of the lifting column 2 and the lifting adjustment plate 3, enables rapid adjustment of the relative height and distance between the two connecting plates 1, thereby meeting the height adaptation requirements of different installation environments and improving the installation flexibility of the equipment. The telescopic connection structure, composed of the connecting outer cylinder 5, the connecting inner cylinder 6, and the moving rod 7, allows for rapid connection and separation between the connecting plates 1, simplifying the assembly and disassembly process, improving operational efficiency, and is particularly suitable for occasions requiring frequent replacement or adjustment. Example 2

[0019] like Figure 1-3 As shown, a connecting groove 101 is provided on the top of the connecting plate 1, and the top of the connecting plate 1 is fixedly connected to the lifting column 2.

[0020] In this embodiment, a lifting adjustment groove 201 is provided on one side of the lifting column 2, and the lifting adjustment plate 3 is slidably connected in the lifting adjustment groove 201.

[0021] Specifically, the connecting plate 1 and the connecting groove 101 are used to connect the semiconductor tank cleaning box assembly from the bottom, and the lifting column 2 and the lifting adjustment groove 201 are used to assist in controlling the height of the lifting adjustment plate 3.

[0022] In this embodiment, the lifting adjustment plate 3 is provided with a stabilizing groove at the lifting adjustment groove 201 of the lifting column 2, and a support cap 301 is provided on one side of the lifting adjustment plate 3. A stabilizing wire 302 is provided on one side of the lifting column 2, which passes through the support cap 301 and is threadedly connected to the support cap 301.

[0023] During use, the relative rotation of the stabilizing wire 302 and the support cap 301 can fix the relative positions of the lifting adjustment plate 3 and the lifting column 2. Therefore, during use, the lifting can be controlled by adjusting the connecting plates 1 connected to the lifting column 2 on both sides, which are respectively connected to the lifting column 2. This facilitates connection to bases at different heights and enables the control of lifting of objects with low mass connected to the semiconductor tank cleaning box assembly. Example 3

[0024] like Figure 3-4 As shown, a connecting stabilizing plate 501 is provided on one side of the connecting outer cylinder 5. One side of the connecting stabilizing plate 501 is fixedly connected to the insert plate 4. The insert plate 4 is connected to the connecting slot 303 of the lifting adjustment plate 3.

[0025] Specifically, when needed, screws can be connected to the outside of the insertion plate 4 and extend through to the lifting adjustment plate 3, so as to fix the positions of the lifting adjustment plate 3 and the insertion plate 4 relatively, which facilitates the subsequent fixation of objects.

[0026] In this embodiment, a sliding inner groove 502 is provided on one side of the connecting outer cylinder 5, and the connecting inner cylinder 6 is slidably connected to the inside of the connecting outer cylinder 5. A sliding inner groove 601 is provided on one side of the connecting inner cylinder 6, and the moving rod 7 is slidably connected to the inside of the sliding inner groove 601. Fixing threads are provided on the outside of both the connecting outer cylinder 5 and the connecting inner cylinder 6.

[0027] Specifically, the sliding inner groove 502 and the sliding inner groove 601 are connected to the connecting inner cylinder 6 and the moving rod 7 respectively, which facilitates their extension. The fixed screws also facilitate the positioning of the extended length.

[0028] In this embodiment, a support and stabilizing plate 701 is fixedly connected to the outside of the movable rod 7, and two adjacent support and stabilizing plates 701 are connected by screws.

[0029] Specifically, the connection structure allows for easy control of the moving rods 7 on both sides, which can be relatively fixed to facilitate a stable connection to the object later.

[0030] In summary, the two connecting plates 1 are respectively connected to the other side of the semiconductor tank cleaning box assembly to connect to the object to be connected. The connection between the lifting adjustment plate 3 and the lifting column 2 allows for easy control of the relative height of the two connecting plates 1, thereby adjusting the relative height of the object connected to the outside of the semiconductor tank cleaning box assembly. Furthermore, the connecting outer cylinder 5, in sequence with the connecting inner cylinder 6 and the moving rod 7, connects the two connecting plates 1, allowing for adjustment of the relative distance between the two connecting plates 1, thus facilitating control of the relative distance between the semiconductor tank cleaning box assembly and the connected object.

[0031] The embodiments of this utility model described above do not constitute a limitation on the scope of protection of this utility model. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the scope of protection of the claims of this utility model.

Claims

1. A quick-release semiconductor tank cleaning box assembly connection structure, characterized in that: The device includes two symmetrically distributed connecting plates (1), with two lifting columns (2) symmetrically arranged on the top of the connecting plates (1). A lifting adjustment plate (3) is arranged between the two lifting columns (2). A connecting slot (303) is provided on one side of the lifting adjustment plate (3). An insertion plate (4) is slidably arranged inside the connecting slot (303). A connecting outer cylinder (5) is provided on one side of the insertion plate (4). A connecting inner cylinder (6) is provided on one side of the connecting outer cylinder (5). A moving rod (7) is provided on one side of the connecting inner cylinder (6). The two moving rods (7) are connected to each other.

2. The quick-release semiconductor tank cleaning box assembly connection structure according to claim 1, characterized in that: The top of the connecting plate (1) is provided with a connecting groove (101), and the top of the connecting plate (1) is fixedly connected to the lifting column (2).

3. The quick-release semiconductor tank cleaning box assembly connection structure according to claim 1, characterized in that: The lifting column (2) has a lifting adjustment groove (201) on one side, and the lifting adjustment plate (3) is slidably connected in the lifting adjustment groove (201).

4. The quick-release semiconductor tank cleaning box assembly connection structure according to claim 3, characterized in that: The lifting adjustment plate (3) is provided with a stabilizing groove at the lifting adjustment groove (201) of the lifting column (2). A support cap (301) is provided on one side of the lifting adjustment plate (3), and a stabilizing wire (302) is provided on one side of the lifting column (2) that passes through the support cap (301) and is threadedly connected to the support cap (301).

5. The quick-release semiconductor tank cleaning box assembly connection structure according to claim 1, characterized in that: A connecting stabilizing plate (501) is provided on one side of the connecting outer cylinder (5). One side of the connecting stabilizing plate (501) is fixedly connected to the insert plate (4). The insert plate (4) is connected to the connecting slot (303) of the lifting adjustment plate (3).

6. The quick-release semiconductor tank cleaning box assembly connection structure according to claim 1, characterized in that: The outer connecting cylinder (5) has a sliding inner groove (502) on one side, and the inner connecting cylinder (6) is slidably connected to the inner connecting cylinder (5). The inner connecting cylinder (6) has a sliding inner groove (601) on one side, and the moving rod (7) is slidably connected to the inner sliding inner groove (601). The outer connecting cylinder (5) and the inner connecting cylinder (6) are both provided with fixing wires.

7. The quick-release semiconductor tank cleaning box assembly connection structure according to claim 1, characterized in that: The movable rod (7) is externally fixedly connected to a support stabilizing plate (701), and two adjacent support stabilizing plates (701) are connected by screws.

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