A circuit board cleaning mechanism

Abstract

This utility model relates to a circuit board cleaning mechanism, comprising: a workbench; a transfer assembly mounted on the workbench, including a transfer platform for placing and fixing a fixture for the circuit board; and a cleaning assembly mounted on the workbench, including a mounting frame, a housing mounted on the mounting frame, an airflow inlet disposed on the housing, a plurality of airflow outlets communicating with the airflow inlet, and a suction port communicating with a suction component. The airflow inlet is used to deliver airflow to the airflow outlets, the airflow outlets are used to deliver airflow to the vicinity of the circuit board to make particles on the circuit board float, and the suction port is used to suck out the floating particles by suction force to avoid the particles falling back onto the circuit board, thus ensuring the cleaning effect of the circuit board. Furthermore, the cleaning assembly cleans the circuit board in a non-contact manner, which not only does not damage the circuit board but can also adapt to different circuit boards.

Description

Technical Field

[0001] This utility model relates to the field of circuit board processing technology, and specifically to a circuit board cleaning mechanism. Background Technology

[0002] As electronic products evolve towards higher density and finer circuitry, the residual dust, chips, glass fibers, and metal burrs on the surface or within the vias of circuit boards (PCBs / PCBAs) significantly impact subsequent soldering and electrical reliability. To improve the quality of subsequent manufacturing processes, circuit boards need to be cleaned. However, existing cleaning mechanisms struggle to balance cleaning efficiency with performance.

[0003] Therefore, it is necessary to improve the existing technology to overcome the aforementioned defects. Utility Model Content

[0004] In view of this, embodiments of this application provide a circuit board cleaning mechanism to solve at least one problem existing in the prior art, comprising: Workbench; A transfer assembly, mounted on the workbench, includes a transfer stage for placing a fixture for fixing the circuit board; The cleaning component, installed on the workbench, includes a mounting frame, a housing mounted on the mounting frame, an airflow inlet disposed on the housing, a plurality of airflow outlets communicating with the airflow inlet, and a suction port communicating with a suction component. The airflow inlet is used to deliver airflow to the airflow outlets, the airflow outlets are used to deliver airflow to the vicinity of the circuit board to make particles on the circuit board float, and the suction port is used to suck out the floating particles by suction force.

[0005] Optionally, in the circuit board cleaning mechanism described above, the cleaning component further includes a plurality of vertical conveying channels rotatably connected to the airflow inlet, a transverse conveying channel symmetrically arranged on the conveying channel, and a nozzle arranged on the transverse conveying channel, wherein the airflow outlet is arranged on the nozzle.

[0006] Optionally, the circuit board cleaning mechanism described above has several blades arranged circumferentially inside the vertical conveying channel. The vertical conveying channel is configured such that airflow entering the vertical conveying channel from the airflow inlet can apply force to the several blades, thereby driving the vertical conveying channel to rotate the symmetrically arranged horizontal conveying channels around the vertical conveying channel, thereby driving the nozzle to rotate.

[0007] Optionally, in the circuit board cleaning mechanism described above, the nozzle is inclinedly arranged on the transverse conveying channel.

[0008] Optionally, in the circuit board cleaning mechanism described above, the cross-section of the airflow outlet is tapered.

[0009] Optionally, in the circuit board cleaning mechanism described above, the housing includes a main body mounted on the mounting bracket and an extension cover extending to both sides along the main body. The main body has a placement space, the airflow outlet is located within the placement space, and the extension cover is positioned below the airflow outlet.

[0010] Optionally, in the circuit board cleaning mechanism described above, the projected area of ​​the housing completely covers the fixture.

[0011] Optionally, in the circuit board cleaning mechanism described above, at least two ion generating rods are also provided inside the housing.

[0012] Optionally, in the circuit board cleaning mechanism described above, the transfer assembly further includes a guide rail mounted on the worktable, a slider adapted to the guide rail, and a first driving member. The slider is connected to the transfer table, and the first driving member is capable of driving the transfer table to move relative to the cleaning assembly under the action of the guide rail and the slider.

[0013] Optionally, in the circuit board cleaning mechanism described above, the transfer assembly further includes a second drive member mounted on the transfer table and a centering member and a manually adjustable limiting member disposed on both sides of the fixture. The centering member protrudes from the manually adjustable limiting member, and the second drive member is capable of driving the centering members on both sides to move closer or further apart from each other.

[0014] Compared with the prior art, this application has the following advantages: by providing a worktable, a transfer component and a cleaning component on the worktable, the transfer component is used to place the fixture for fixing the circuit board, and the cleaning component includes an airflow inlet, several airflow outlets connected to the airflow inlet and a suction port. The airflow blown out from the several airflow outlets can peel the particles on the circuit board on the fixture from the circuit board so that they float, and the suction port sucks out the particles in the floating state to avoid the particles falling back onto the circuit board, thus ensuring the cleaning effect of the circuit board; in addition, the cleaning component and the circuit board are non-contact cleaning, which not only does not damage the circuit board, but can also adapt to different circuit boards. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the circuit board cleaning mechanism shown in this application; Figure 2 for Figure 1 The diagram shows the structure of the cleaning components in the circuit board cleaning mechanism. Figure 3 for Figure 2 A schematic diagram of the cleaning components in the circuit board cleaning mechanism from another direction; Figure 4 for Figure 2A cross-sectional view of the cleaning components in the circuit board cleaning mechanism shown; Figure 5 for Figure 1 A schematic diagram of the transfer assembly in the circuit board cleaning mechanism shown; Figure 6 for Figure 5 A schematic diagram of the transfer component in the circuit board cleaning mechanism from another direction.

[0016] Reference numerals: A. Circuit board; 10. Worktable; 20. Transfer assembly; 21. Transfer stage; 22. Guide rail; 23. Slider; 24. First drive unit; 25. Second drive unit; 26. Centering unit; 27. Manually adjustable limit unit; 30. Cleaning assembly; 31. Mounting bracket; 32. Housing; 321. Main body; 322. Extension cover; 33. Airflow inlet; 34. Airflow outlet; 35. Suction port; 36. Vertical conveying channel; 37. Horizontal conveying channel; 38. Nozzle; 40. Fixture; 50. Ion generator rod. Detailed Implementation

[0017] The exemplary embodiments disclosed in this application will now be described in more detail. Numerous specific details are set forth in the following description to provide a more thorough understanding of this application. However, it will be apparent to those skilled in the art that this application can be implemented without one or more of these details. In other instances, to avoid confusion with this application, some technical features well-known in the art have not been described; that is, not all features of actual embodiments are described herein, nor are well-known functions and structures described in detail.

[0018] It should be understood that when an element or layer is referred to as "on," "adjacent to," "connected to," or "coupled to" other elements or layers, it may be directly on, adjacent to, connected to, or coupled to other elements or layers, or there may be intervening elements or layers. Conversely, when an element is referred to as "directly on," "directly adjacent to," "directly connected to," or "directly coupled to" other elements or layers, there are no intervening elements or layers. It should be understood that although the terms first, second, third, etc., may be used to describe various elements, components, areas, layers, and / or portions, these elements, components, areas, layers, and / or portions should not be limited by these terms. These terms are only used to distinguish one element, component, area, layer, or portion from another element, component, area, layer, or portion. Therefore, without departing from the teachings of this application, the first element, component, area, layer, or portion discussed below may be referred to as a second element, component, area, layer, or portion. And the discussion of a second element, component, area, layer, or portion does not imply that the first element, component, area, layer, or portion necessarily exists in this application.

[0019] Spatial relation terms such as “below,” “under,” “below,” “under,” “above,” “above,” etc., are used here for convenience to describe the relationship between one element or feature shown in the figure and other elements or features. It should be understood that, in addition to the orientation shown in the figure, spatial relation terms are intended to also include different orientations of devices in use and operation.

[0020] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the scope of this application. When used herein, the singular forms “a,” “an,” and “ / the” are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the terms “compose” and / or “comprising,” when used in this specification, identify the presence of features, integers, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups. When used herein, the term “and / or” includes any and all combinations of the associated listed items.

[0021] To fully understand this application, detailed steps and structures will be presented in the following description to illustrate the technical solution of this application. Preferred embodiments of this application are described in detail below; however, in addition to these detailed descriptions, this application may have other implementation methods.

[0022] refer to Figure 1 As shown in the preferred embodiment of this application, the circuit board cleaning mechanism includes a workbench 10, a transfer assembly 20 mounted on the workbench 10, and a cleaning assembly 30. The transfer assembly 20 includes a transfer platform 21 for placing a fixture 40 for fixing the circuit board A. The cleaning assembly 30 includes a mounting frame 31, a housing 32 mounted on the mounting frame 31, an airflow inlet 33 disposed on the housing 32, a plurality of airflow outlets 34 communicating with the airflow inlet 33, and a suction port 35 communicating with a suction component. The airflow inlet 33 is used to deliver airflow to the airflow outlets 34, and the airflow outlets 34 are used to deliver airflow to the vicinity of the circuit board to make particles on the circuit board float. The suction port 35 is used to suck out the floating particles by suction force, thereby preventing the floating particles from falling back onto the circuit board and effectively removing particles from the circuit board. It should be noted that the particles include dust particles, organic particles, fibrous particles, etc.

[0023] For details, please refer to Figures 1-4As shown, the cleaning assembly 30 also includes a plurality of vertical conveying channels 36 rotatably connected to the airflow inlet 33, a transverse conveying channel 37 symmetrically arranged on the vertical conveying channel 36, and a nozzle 38 arranged on the transverse conveying channel 37. The airflow outlet 34 is arranged on the nozzle 38. More specifically, a plurality of blades are arranged circumferentially inside the vertical conveying channel 36. The vertical conveying channel 36 is configured such that when airflow enters the vertical conveying channel 36 from the airflow inlet 33, it can apply a force to the blades to drive the vertical conveying channel 36 to rotate the symmetrically arranged transverse conveying channel 37 around the vertical conveying channel 36, thereby driving the nozzle 38 to rotate.

[0024] Understandably, the rotating nozzle 38 can cover a larger area of ​​the circuit board through rotational movement, forming a scanning cleaning, and avoiding blind spots in local cleaning caused by the fixed direction of the nozzle 38, such as the edges, corners or gaps between components of the circuit board.

[0025] Understandably, the rotating nozzle 38 can cause the direction of the blown airflow to change continuously, so as to impact the particles from multiple angles, thereby blowing up the particles hidden in the irregular components or gaps of the circuit board, and preventing the particles from being pressed into the hidden places by the airflow in a single direction.

[0026] Understandably, the dynamic airflow generated by the rotating nozzle 38 can produce more uniform disturbance on the surface of the circuit board, so that particles at different positions are blown to a floating state more evenly, rather than concentrated in a certain area. This uniform floating state can form a more efficient cooperation with the suction port 35, reduce the problem of particles being difficult to be completely sucked away due to local accumulation, and reduce the probability of secondary sedimentation.

[0027] Understandably, by setting several blades (not shown) in the vertical conveying channel 36, the airflow energy itself drives the blades to rotate the nozzle 38, eliminating the need for additional driving components such as motors, simplifying the structure of the entire cleaning mechanism, and reducing equipment costs and energy consumption; at the same time, the rotation speed driven by the airflow is linked to the airflow intensity (the greater the airflow, the higher the rotation speed), which can adaptively adjust the cleaning intensity and avoid over- or under-cleaning caused by the fixed rotation speed of mechanical drive.

[0028] Furthermore, the nozzle 38 is angled on the transverse conveying channel 37. This arrangement allows the angled nozzle 38 to change the airflow angle, enabling the airflow to blow obliquely towards hard-to-reach areas such as gaps and sides of solder joints on the circuit board surface, thus lifting particles hidden in these locations (instead of potentially pressing particles into gaps during vertical blowing). Compared to horizontally or vertically positioned nozzles 38, the angled design further enhances the ability to remove hidden particles and improves the thoroughness of the cleaning effect.

[0029] In this embodiment, the ratio of the diameter of the suction port 35 to the diameter of the airflow outlet 34 is in the range of 8-12, ensuring that the suction force coverage and strength of the suction port 35 are sufficient to efficiently capture particles blown up by the airflow outlet 34. In other embodiments, the diameters of the suction port 35 and the airflow outlet 34 are not specifically limited, as long as the above-mentioned effect can be achieved.

[0030] In this embodiment, the cross-section of the airflow outlet 34 is tapered. Specifically, the airflow outlet 34 is tapered to increase the jet velocity of the airflow outlet 34 and enhance the blowing force on the particles.

[0031] Furthermore, the housing 32 includes a body portion 321 mounted on the mounting bracket 31 and an extension cover 322 extending to both sides along the body portion 321. The body portion 321 has a placement space, the airflow outlet 34 is located within the placement space, and the extension cover 322 is positioned below the airflow outlet 34.

[0032] Understandably, the extension hood 322 is lower than the airflow outlet 34, forming a semi-enclosed cleaning space. The extension hood 322 can prevent the blown particles from drifting outward and confine the particles within the coverage area of ​​the shell 32. Combined with the adsorption of the suction port 35, it can improve the particle capture rate. At the same time, the placement space of the main body 321 provides a reasonable layout position for the airflow outlet 34 and the suction port 35, avoiding external airflow from interfering with the airflow field of the cleaning area and ensuring the synergistic stability of blowing and adsorption.

[0033] Furthermore, the projected area of ​​the housing 32 completely covers the fixture 40, so that the effective range of the cleaning component 30 can fully cover the circuit board (including the edge area) placed on the fixture 40, ensuring that the airflow blowing and suction effects are all performed without any edge omissions, thus guaranteeing the overall cleaning integrity.

[0034] Furthermore, at least two ion generating rods 50 are also provided inside the housing 32.

[0035] Understandably, during the production or transportation of circuit boards, dust, fibers and other particles (especially tiny particles) are easily attracted by static electricity. These particles are tightly attached to the board surface due to electrostatic forces. By setting up the ion generator 50, the charged ions generated can eliminate the static electricity on the surface of the circuit board, weaken the adsorption force between the particles and the surface of the circuit board, and make the particles easier to be blown away by the airflow.

[0036] Understandably, if the ions released by the ion generator 50 only diffuse locally, the effective range is limited (especially since there may be dead zones in the airflow inside the housing 32). However, the airflow blown out by the air outlet 34 has strong fluidity, which can carry the charged ions generated by the ion generator 50 to a farther and wider area, so that the ions can evenly cover the entire circuit board and fully neutralize static electricity. This solves the problem of the limited natural diffusion range of ions, and makes the static neutralization effect of ions and the blowing effect of airflow complement each other, further improving the particle detachment efficiency.

[0037] Further, refer to Figure 1 , Figure 5 as well as Figure 6 As shown, the transfer assembly 20 also includes a guide rail 22 mounted on the worktable 10, a slider 23 adapted to the guide rail 22, and a first drive member 24. The slider 23 is connected to the transfer stage 21. The first drive member 24 can drive the transfer stage 21 to move relative to the cleaning assembly 30 under the action of the guide rail 22 and the slider 23, so as to ensure that each circuit board is in the same position relative to the cleaning assembly 30 during cleaning, thereby improving the controllability and consistency of the cleaning process and also improving the cleaning efficiency of the circuit boards.

[0038] Furthermore, the transfer assembly 20 also includes a second drive member 25 mounted on the transfer stage 21 and centering members 26 and manually adjustable limiting members 27 disposed on both sides of the fixture 40. The centering members 26 protrude from the manually adjustable limiting members 27, and the second drive member 25 can drive the centering members 26 on both sides to move closer or further apart from each other.

[0039] Understandably, by setting the second driving component 25 to drive the centering component 26, the centering component 26 can automatically center and align the circuit board, ensuring that the effective range of the cleaning component 30 matches the center of the circuit board. The purpose of extending the centering component 26 out of the manual adjustment limit component 27 is to allow for fine-tuning by manually operating the manual adjustment limit component 27 after the centering component 26 has quickly centered and positioned the circuit board, in order to compensate for the positioning deviation of the centering component 26 on the circuit board, such as minor deformations caused by wear and tear or assembly errors during long-term use of the fixture 40.

[0040] The above is only one specific implementation of this application, and any other improvements made based on the concept of this application shall be considered within the scope of protection of this application.

Claims

1. A circuit board cleaning mechanism, characterized in that, include: Workbench; A transfer assembly, mounted on the workbench, includes a transfer stage for placing a fixture for fixing the circuit board; The cleaning component, installed on the workbench, includes a mounting frame, a housing mounted on the mounting frame, an airflow inlet disposed on the housing, a plurality of airflow outlets communicating with the airflow inlet, and a suction port communicating with a suction component. The airflow inlet is used to deliver airflow to the airflow outlets, the airflow outlets are used to deliver airflow to the vicinity of the circuit board to make particles on the circuit board float, and the suction port is used to suck out the floating particles by suction force.

2. The circuit board cleaning mechanism according to claim 1, characterized in that, The cleaning assembly also includes a plurality of vertical conveying channels rotatably connected to the airflow inlet, a transverse conveying channel symmetrically arranged on the conveying channels, and a nozzle arranged on the transverse conveying channel, with the airflow outlet arranged on the nozzle.

3. The circuit board cleaning mechanism according to claim 2, characterized in that, Several blades are arranged circumferentially inside the vertical conveying channel. The vertical conveying channel is configured such that airflow entering the vertical conveying channel from the airflow inlet can apply force to the blades, thereby driving the vertical conveying channel to rotate the symmetrically arranged transverse conveying channels around the vertical conveying channel, thereby driving the nozzle to rotate.

4. The circuit board cleaning mechanism according to claim 2, characterized in that, The nozzle is inclinedly disposed on the transverse conveying channel.

5. The circuit board cleaning mechanism according to claim 1, characterized in that, The cross-section of the airflow outlet is conical.

6. The circuit board cleaning mechanism according to claim 1, characterized in that, The housing includes a body portion mounted on the mounting bracket and extension covers extending to both sides along the body portion. The body portion has a placement space, the airflow outlet is located within the placement space, and the extension covers are positioned below the airflow outlet.

7. The circuit board cleaning mechanism according to claim 6, characterized in that, The projected area of ​​the housing completely covers the fixture.

8. The circuit board cleaning mechanism according to claim 6, characterized in that, The housing also contains at least two ion generating rods.

9. The circuit board cleaning mechanism according to claim 1, characterized in that, The transfer assembly further includes a guide rail mounted on the worktable, a slider adapted to the guide rail, and a first driving member. The slider is connected to the transfer table, and the first driving member is capable of driving the transfer table to move relative to the cleaning assembly under the action of the guide rail and the slider.

10. The circuit board cleaning mechanism according to claim 1, characterized in that, The transfer assembly further includes a second drive unit mounted on the transfer platform and centering members and manually adjustable limiting members disposed on both sides of the fixture. The centering members protrude from the manually adjustable limiting members, and the second drive unit is capable of driving the centering members on both sides to move closer or further apart from each other.

Images