A copper busbar punching device

Abstract

This utility model relates to a copper busbar punching device, including a connecting seat, a stamping drive mechanism, a punching die base, an upper die head assembly, a lower die head, a punching positioning assembly, a material placement plate, and a chip collection frame; the stamping drive mechanism is connected to a pressure plate, which is located above the punching die base; the punching die base includes an upper plate, a lower plate, and a connecting shaft; the upper die head assembly includes a first spring, a cutting tool, and a limiting cylinder; the punching positioning assembly includes a positioning block, a positioning ball, and a second spring; the material placement plate is provided with an "L"-shaped positioning rod; the chip collection frame is located below the pressure plate. The advantages of this utility model are: (1) the punching positioning assembly cooperates with the slot to position the lower plate, avoiding displacement during punching and affecting the punching quality; (2) the "L"-shaped positioning rod can quickly position the copper busbar to be processed, improving the punching efficiency.

Description

Technical Field

[0001] This utility model relates to the field of metal drilling technology, and in particular to a copper busbar punching device. Background Technology

[0002] Copper busbars, also called busbars or busbar arrays, are long conductors with rectangular or irregular cross-sections made of highly conductive copper. For electrical connections and mechanical fixation, holes need to be drilled in the copper busbars. Existing drilling equipment requires aligning the drilling position with a light each time, which takes a long time and affects drilling efficiency. Furthermore, if different hole sizes are needed on a single copper busbar, different punching dies must be repeatedly changed, which also affects the drilling efficiency of the production line.

[0003] Therefore, the drilling device needs to be improved to increase drilling efficiency. Utility Model Content

[0004] The purpose of this invention is to provide a copper busbar punching device that can improve punching efficiency and applicability.

[0005] To achieve the above-mentioned utility model objectives, this utility model provides a copper busbar punching device, including a connecting seat, a stamping drive mechanism, a punching die seat, an upper die head assembly, a lower die head, a punching positioning assembly, a material placement plate, and a chip collection frame.

[0006] The stamping drive mechanism is connected to a pressure plate, which is located above the punching die base;

[0007] The punching die base includes an upper plate, a lower plate, and a connecting shaft. The upper plate has a plurality of upper connecting holes arranged in a circular array, and the lower plate has a plurality of lower connecting holes arranged in a circular array. The position and number of the upper connecting holes are adapted to the position and number of the lower connecting holes. The upper plate and the lower plate are coaxially connected by the connecting shaft.

[0008] The upper die head assembly includes a first spring, a cutting tool, and a limiting cylinder. The cutting tool includes a pressure head and a punching rod. The punching rod is located at the bottom of the pressure head, and a positioning key is provided on the wall of the punching rod. The limiting cylinder has a through groove, and a positioning groove is provided on the inner wall of the through groove. The positioning groove is adapted to the positioning key. The punching rod is located in the through groove, and the positioning key is inserted into the positioning groove. The limiting cylinder is located in the upper connecting hole, and a spring connecting part is provided at the end of the limiting cylinder. The first spring is located between the spring connecting part and the upper plate.

[0009] The bottom of the lower connecting hole is provided with a mold head mounting part, and the lower mold head is connected to the lower connecting hole through the mold head mounting part. The lower mold head is provided with a mold hole.

[0010] The punching positioning assembly is located directly below the pressure plate. The punching positioning assembly includes a positioning block, a positioning ball, and a second spring. The positioning block is located on one side of the lower plate through the connecting seat. The positioning block is provided with a connecting groove. The second spring is connected to the positioning ball through the connecting groove. The positioning ball faces the lower plate. The side wall of the lower plate is provided with a slot. The position and size of the slot are adapted to the position and size of the positioning ball.

[0011] The material placement plate is located on one side of the lower plate, and the material placement plate is provided with an "L"-shaped positioning rod;

[0012] The chip collection frame is located below the pressure plate.

[0013] As a further improvement of the utility model, the material placement plate is provided with a plurality of mounting slots, the positioning rod is provided with a positioning pin, and the positioning rod is detachably connected to the mounting slot through the positioning pin.

[0014] As a further improvement of the utility model, the pressure head is an elastic buffer pad, and the two ends of the pressure head are partitions.

[0015] This utility model discloses a copper busbar punching device. A punching rod matching the required size of the workpiece's machining hole is selected. The cutting tool is inserted into a limiting cylinder, where a positioning key is inserted into a positioning groove to further position the tool, improving punching quality and preventing burrs. Subsequently, the assembled upper die head assembly is placed into the corresponding upper connecting hole, and a lower die head of the corresponding size is installed in the lower platen. The workpiece to be processed is placed on a placement plate, with one corner positioned in a positioning rod. The punching drive mechanism can be a hydraulic cylinder, controlling the pressure plate to press down. The pressure head is pressed down, causing the punching rod to descend and punch the workpiece below. The die hole acts on the positioning of the punching rod, further improving the punching accuracy. Finally, the punching rod is reset under the action of the punching drive mechanism, and debris falls into a lower chip collection frame for unified collection.

[0016] The advantages of this copper busbar punching device compared to existing technologies are as follows:

[0017] (1) The punching positioning component works with the slot to position the lower plate and prevent displacement during punching, which would affect the punching quality.

[0018] (2) The “L” shaped positioning rod can quickly position the copper busbar to be processed, improving the drilling efficiency. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of a copper busbar punching device according to the present invention;

[0020] Figure 2 This is a schematic diagram of the stamping drive mechanism.

[0021] Figure 3 This is a schematic diagram of the die head mounting section.

[0022] Figure 4 This is a schematic diagram of the punching positioning component structure;

[0023] Figure 5 A cross-sectional view of the punching positioning assembly;

[0024] Figure 6 This is a schematic diagram of the card slot structure;

[0025] Figure 7 This is a schematic diagram of the positioning rod structure;

[0026] Figure 8 This is a schematic diagram showing the location of the machined holes on the workpiece. Detailed Implementation

[0027] The specific embodiments of this utility model will be further described in detail below with reference to the accompanying drawings.

[0028] like Figure 1 As shown, a copper busbar punching device of the present invention includes a connecting seat 1, a stamping drive mechanism 2, a punching die seat 3, an upper die head assembly 4, a lower die head 5, a punching positioning assembly 6, a material placement plate 7, and a chip collection frame 8.

[0029] The stamping drive mechanism 2 is connected to a pressure plate 21, which is located above the punching die base 3;

[0030] The punching die base 3 includes an upper plate 31, a lower plate 32, and a connecting shaft 33. The upper plate 31 has a number of upper connecting holes 311 arranged in a circular array, and the lower plate 32 has a number of lower connecting holes 321 arranged in a circular array. The position and number of the upper connecting holes 311 are adapted to the position and number of the lower connecting holes 321. The upper plate 31 and the lower plate 32 are coaxially connected by the connecting shaft 33.

[0031] like Figure 2-3 As shown, the upper die head assembly 4 includes a first spring 41, a cutter 42, and a limiting cylinder 43. The cutter 42 includes a pressure head 421 and a punching rod 423. The punching rod 423 is located at the bottom of the pressure head 421, and a positioning key 424 is provided on the wall of the punching rod 423. The limiting cylinder 43 is provided with a through groove 433, and a positioning groove 431 is provided on the inner wall of the through groove 433. The positioning groove 431 is adapted to the positioning key 424. The punching rod 423 is located in the through groove 433, and the positioning key 424 is inserted into the positioning groove 431. The limiting cylinder 43 is located in the upper connecting hole 311, and a spring connecting part 432 is provided at the end of the limiting cylinder 43. The first spring 41 is located between the spring connecting part 432 and the upper plate 31.

[0032] The bottom of the lower connecting hole 321 is provided with a mold head mounting part 322, and the lower mold head 5 is connected to the lower connecting hole 321 through the mold head mounting part 322. The lower mold head 5 is provided with a mold hole 51.

[0033] The punching positioning assembly 6 is located directly below the pressure plate 21, such as... Figure 4-6 As shown, the punching positioning assembly 6 includes a positioning block 61, a positioning ball 62, and a second spring 64. The positioning block 61 is located on one side of the lower plate 32 via a connecting seat 1. The positioning block 61 is provided with a connecting groove 63. The second spring 64 is connected to the positioning ball 62 via the connecting groove 63. The positioning ball 62 faces the lower plate 32. The side wall of the lower plate 32 is provided with a slot 323. The position and size of the slot 323 are adapted to the position and size of the positioning ball 62.

[0034] like Figure 7 As shown, the material placement plate 7 is located on one side of the lower plate 32. The material placement plate 7 is equipped with an "L"-shaped positioning rod 71. The material placement plate 7 has several mounting slots 73, and the positioning rod 71 is equipped with a positioning pin 72. The positioning rod 71 is detachably connected to the mounting slot 73 through the positioning pin 72. Different positions of the positioning rod 71 can be quickly changed through the positioning pin 72, thereby positioning different drilling positions on the workpiece.

[0035] The chip collection frame 8 is located below the pressure plate 21.

[0036] like Figure 8 As shown, this utility model discloses a copper busbar punching device. A punching rod 423 is selected that matches the required size of the machining hole 91 on the workpiece 9. A cutting tool 42 is inserted into a limiting cylinder 43, where a positioning key 424 is inserted into a positioning groove 431 to further position the cutting tool 42, improving punching quality and preventing burrs. Then, the assembled upper die head assembly 4 is placed into the corresponding upper connecting hole 311, and a lower die head 5 of the corresponding size is installed in the lower platen 32. The workpiece 9 to be processed is placed on the material placement plate 7, with one corner of the workpiece 9 positioned in the positioning rod 71. The stamping drive mechanism 2 can be a hydraulic cylinder, controlling the pressure plate 21 to press down, causing the pressure head 421 to be pressed down. The punching rod 423 then descends and punches the workpiece 9 below. The die hole 51 acts on the positioning of the punching rod 423, further improving the accuracy of the punching. Finally, the punching rod 423 is reset under the action of the stamping drive mechanism 2, and the debris falls into the lower chip collection frame 8 for unified collection.

[0037] The pressure head 421 is an elastic buffer pad. The two ends of the pressure head 421 are partitions 422. The pressure plate 21 directly contacts the partitions 422 and presses down the pressure head 421. First, the punching rod 423 descends along the through groove 433, and the limiting cylinder 43 also descends a certain distance. The elastic buffer pad and the first spring 41 both play a buffering and shock-absorbing role in punching.

[0038] The upper plate 31 and lower plate 32 are provided with multiple connecting holes, allowing for the pre-assembly of multiple upper die head assemblies 4, which are placed in the upper connecting holes 311 of the upper plate 31. Matching lower die heads 5 are placed in corresponding positions on the lower plate 32. By rotating the upper plate 31 and lower plate 32 according to different opening sizes, the required upper die head assembly 4 and lower die head 5 are rotated directly below the pressure plate 21, i.e., rotated to the target punching station, enabling rapid switching between dies with different opening sizes. The punching positioning assembly 6 positions the upper plate 31 and lower plate 32. When rotating the upper plate 31 and lower plate 32, the lower plate 32 compresses the positioning ball 62. Under the action of the second spring 64, the positioning ball 62 retracts into the connecting groove 63. After the lower plate 32 rotates to the target position, the positioning ball 62 resets and engages with the corresponding slot 323, achieving positioning of the lower plate 32 and preventing misalignment that could affect punching.

[0039] The preferred embodiments of this utility model have been described in detail above, but this utility model is not limited to the embodiments described. Those skilled in the art can make various equivalent modifications or substitutions without departing from the spirit of this utility model, and these equivalent modifications or substitutions are all included within the scope defined by the claims of this application.

Claims

1. A copper busbar punching device, characterized in that, It includes a connecting seat, a stamping drive mechanism, a punching die base, an upper die head assembly, a lower die head, a punching positioning assembly, a material placement plate, and a chip collection frame; The stamping drive mechanism is connected to a pressure plate, which is located above the punching die base; The punching die base includes an upper plate, a lower plate, and a connecting shaft. The upper plate has a plurality of upper connecting holes arranged in a circular array, and the lower plate has a plurality of lower connecting holes arranged in a circular array. The position and number of the upper connecting holes are adapted to the position and number of the lower connecting holes. The upper plate and the lower plate are coaxially connected by the connecting shaft. The upper die head assembly includes a first spring, a cutting tool, and a limiting cylinder. The cutting tool includes a pressure head and a punching rod. The punching rod is located at the bottom of the pressure head, and a positioning key is provided on the wall of the punching rod. The limiting cylinder has a through groove, and a positioning groove is provided on the inner wall of the through groove. The positioning groove is adapted to the positioning key. The punching rod is located in the through groove, and the positioning key is inserted into the positioning groove. The limiting cylinder is located in the upper connecting hole, and a spring connecting part is provided at the end of the limiting cylinder. The first spring is located between the spring connecting part and the upper plate. The bottom of the lower connecting hole is provided with a mold head mounting part, and the lower mold head is connected to the lower connecting hole through the mold head mounting part. The lower mold head is provided with a mold hole. The punching positioning assembly is located directly below the pressure plate. The punching positioning assembly includes a positioning block, a positioning ball, and a second spring. The positioning block is located on one side of the lower plate through the connecting seat. The positioning block is provided with a connecting groove. The second spring is connected to the positioning ball through the connecting groove. The positioning ball faces the lower plate. The side wall of the lower plate is provided with a slot. The position and size of the slot are adapted to the position and size of the positioning ball. The material placement plate is located on one side of the lower plate, and the material placement plate is provided with an "L"-shaped positioning rod; The chip collection frame is located below the pressure plate.

2. The copper busbar punching device as described in claim 1, characterized in that, The material placement plate is provided with several mounting slots, and the positioning rod is provided with a positioning pin. The positioning rod is detachably connected to the mounting slot through the positioning pin.

3. The copper busbar punching device as described in claim 1, characterized in that, The pressure head is an elastic buffer pad, and the two ends of the pressure head are partitions.

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