Laser isolation and de-junction processing module and laser processing equipment

Abstract

This utility model belongs to the field of laser processing technology, specifically relating to a laser isolation junction removal module and laser processing equipment. The laser isolation junction removal module of this utility model includes: several feeding conveyors and several unloading conveyors connected in series for conveying silicon wafers with their front faces down; a laser processing gap is provided between adjacent feeding and unloading conveyors; an X-axis translational transport device, which includes several silicon wafer gripping components for simultaneously translating silicon wafers from the feeding conveyors to the corresponding unloading conveyors; and a laser isolation processing device, disposed below the laser processing gap, for performing laser isolation processing on the front face of the silicon wafers that have translated along the X-axis through the laser processing gap. This laser isolation junction removal module can perform laser isolation processing on the front face of silicon wafers that have translated along the X-axis through the laser processing gap, and is applicable to laser isolation junction removal technology while seamlessly integrating with existing Polyfin laser processing systems without requiring wafer flipping.

Description

Technical Field

[0001] This utility model belongs to the field of laser processing technology, specifically relating to a laser isolation and dejunction processing module and laser processing equipment. Background Technology

[0002] Since the introduction of the half-cell cutting process in the module industry, the power loss caused by dicing and cutting has been a pain point that module manufacturers have been trying to solve. To address this issue, most manufacturers currently use ALD (Alternating Layer) aluminum oxide coating. However, ALD equipment is expensive, so many manufacturers have been in a wait-and-see state.

[0003] A new process has emerged to address the power loss in modules caused by dicing. Through simulation and experimental verification, the power loss caused by dicing mainly comes from the damage to the dicing surface, which is primarily located in the PN junction region of the cell. Therefore, the new process involves using laser patterning after boron diffusion in the cell manufacturing process to remove the PN junction in the dicing area. After the finished cell is formed, the dicing is performed again. Since there is no PN junction in the dicing area, there is no high damage to the PN junction region. This new process is called laser isolation junction removal technology.

[0004] Although a brand-new process has emerged, the ability to mass-produce this new process at low cost requires suitable laser processing equipment. Utility Model Content

[0005] The purpose of this invention is to provide a laser isolation de-junction processing module and laser processing equipment, which are suitable for laser isolation de-junction technology.

[0006] This application provides a laser isolation dejunction processing module, including: A series of feeding and unloading conveyors are used to transport silicon wafers with the front side facing down; and a laser processing gap is provided between adjacent feeding and unloading conveyors. An X-axis translational conveying device includes several silicon wafer gripping assemblies for simultaneously transferring silicon wafers from several loading conveyors to corresponding unloading conveyors; and A laser isolation processing device is installed below the laser processing gap and is used to perform laser isolation processing on the front side of a silicon wafer that is translated along the X-axis through the laser processing gap.

[0007] In one embodiment of this application, the number of the feeding conveyor, the unloading conveyor, and the silicon wafer gripping assembly are all two.

[0008] In one embodiment of this application, the silicon wafer gripping component is a Bernoulli effect chuck or a Coanda effect chuck.

[0009] In one embodiment of this application, a positioning camera is provided above the feeding and conveying device, and a light source is provided below the feeding and conveying device.

[0010] In one embodiment of this application, the laser isolation processing device includes: a moving module and a laser isolation processing head; The moving module is used to move the laser isolation processing head.

[0011] Accordingly, this application provides a laser processing device, comprising: A first and a second conveyor line, arranged in parallel and with opposite conveying directions, are used to convey silicon wafers with the front side facing down. The laser isolation and de-junction processing module described above is installed at the loading end of the first conveyor line; A polyfin laser processing system, positioned between the unloading end of the first conveyor line and the loading end of the second conveyor line, is used for laser processing of the back side of silicon wafers; and The T-shaped rotary conveying device is installed on one side of the Polyfinger laser processing system and is used for loading and unloading materials from the Polyfinger laser processing system.

[0012] In one embodiment of this application, the Polyfin laser processing system includes: A first rotating platform is provided with a rotating plate, and several silicon wafer carriers are provided at both ends of the rotating plate; A laser processing device is positioned above the first rotating platform and is used to process silicon wafers on a silicon wafer carrier at the processing position.

[0013] In one embodiment of this application, the T-shaped rotary conveying device includes: a second rotary platform on which a T-shaped rotary plate is disposed, and a plurality of silicon wafer picking devices are disposed on each of the three ends of the T-shaped rotary plate.

[0014] The beneficial effects of this utility model are: Unlike existing technologies, this application provides a laser isolation junction removal module, comprising: a plurality of feeding conveyors and a plurality of unloading conveyors connected in series for conveying silicon wafers with their front faces down; and a laser processing gap is provided between adjacent feeding and unloading conveyors; an X-axis translational conveying device, comprising a plurality of silicon wafer gripping components for simultaneously translating silicon wafers from the feeding conveyors to the corresponding unloading conveyors; and a laser isolation processing device, disposed below the laser processing gap, for performing laser isolation processing on the front face of the silicon wafers that have translated along the X-axis through the laser processing gap. This laser isolation junction removal module can perform laser isolation processing on the front face of silicon wafers that have translated along the X-axis through the laser processing gap, and is applicable to laser isolation junction removal technology processes while seamlessly integrating with existing Polyfin laser processing systems without requiring wafer flipping.

[0015] Other features and advantages of this invention will be set forth in the description which follows, and will be apparent in part from the description, or may be learned by practicing the invention. The objectives and other advantages of this invention are realized and obtained through the structures particularly pointed out in the description and the accompanying drawings.

[0016] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description

[0017] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0018] Figure 1 This is a perspective view of a laser isolation dejunction processing module according to a preferred embodiment of the present invention; Figure 2 This is a top view of a laser processing device according to a preferred embodiment of the present invention; Figure 3 This is a perspective view of a laser processing device according to a preferred embodiment of the present invention; Figure 4 This is a schematic diagram of a preferred embodiment of the Poly finger laser processing system of this utility model; Figure 5 This is a top view of a preferred embodiment of the T-shaped rotary conveying device of the present invention.

[0019] In the picture: 1. Feeding conveyor device, 11. Positioning camera, 12. Light source, 2. Unloading conveyor device, 3. X-axis translational conveying device, 31. Silicon wafer gripping assembly, 4. Laser isolation processing device, 41. Moving module, 42. Laser isolation processing head; First conveyor line 100, second conveyor line 200, laser isolation and dejunction processing module 300, Polyfin laser processing system 400, first rotating platform 410, rotating plate 420, silicon wafer carrier 430, laser processing device 440, T-shaped rotating conveying device 500, second rotating platform 510, T-shaped rotating plate 520, silicon wafer picking device 530. Detailed Implementation

[0020] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0021] This application provides a laser isolation and dejunction processing module and a laser processing equipment, which are described in detail below. It should be noted that the order of description of the following embodiments is not intended to limit the preferred order of the embodiments of this application. Furthermore, in the following embodiments, the descriptions of each embodiment have their own emphasis; parts not described in detail in a certain embodiment can be referred to in the relevant descriptions of other embodiments.

[0022] See Figure 1 In one embodiment, the laser isolation junction removal module includes: a plurality of feeding conveyors 1 and a plurality of unloading conveyors 2 connected in series for conveying silicon wafers with their front faces down; and a laser processing gap is provided between adjacent feeding conveyors 1 and unloading conveyors 2; an X-axis translational conveying device 3, which includes a plurality of silicon wafer gripping components 31 for simultaneously translating silicon wafers on the plurality of feeding conveyors 1 to the corresponding unloading conveyors 2; and a laser isolation processing device 4, disposed below the laser processing gap, for performing laser isolation processing on the front face of the silicon wafer that has been translated along the X-axis through the laser processing gap.

[0023] In this embodiment, several feeding conveyors 1 are connected in series, and several unloading conveyors 2 are also connected in series. There is a laser processing gap between the last feeding conveyor 1 and the first unloading conveyor 2 to allow the laser to pass through. During processing, after the silicon wafers are fed face down onto the feeding conveyors 1, the X-axis translational conveying device 3 can simultaneously remove the silicon wafers from the feeding conveyors 1 and then move them to the corresponding unloading conveyor 2. During the translation process, the silicon wafers will pass through the laser processing gap one by one. The laser emitted by the laser isolation processing device 4 located below the gap performs laser isolation processing on the face of the silicon wafer. After the silicon wafers picked up by the X-axis translational conveying device 3 are moved above the corresponding unloading conveyor 2, they are placed on the corresponding unloading conveyor 2.

[0024] The laser isolation junction removal module of this embodiment is applicable to laser isolation junction removal technology and does not require silicon wafer flipping, allowing it to be integrated with a polyfin laser processing system. It should be noted that laser isolation junction removal technology is prior art, and this application aims to design processing equipment applicable to this technology.

[0025] Optionally, the number of the feeding conveyor 1, the unloading conveyor 2, and the silicon wafer gripping assembly 31 are all two.

[0026] Furthermore, the silicon wafer gripping component 31 is a Bernoulli effect chuck or a Coanda effect chuck, which can pick up silicon wafers remotely without requiring the silicon wafer gripping component 31 to move up and down.

[0027] Furthermore, a positioning camera 11 is disposed above the feeding and conveying device 1, and a light source 12 is disposed below the feeding and conveying device 1. In some application scenarios, the light source 12 can provide illumination, and the positioning camera 11 can capture corresponding silicon wafer images for positioning. It should be noted that visual positioning is existing technology and will not be elaborated upon here.

[0028] Optionally, the laser isolation processing device 4 includes a moving module 41 and a laser isolation processing head 42; the moving module 41 is used to drive the laser isolation processing head 42 to move. In some embodiments, the moving module 41 can be a Y-axis moving module, or a moving module that can be used in both the X and Y axes. In this embodiment, both the moving module 41 and the X-axis translational conveying device 3 can be commercially available moving modules. During processing, the laser isolation processing head 42 can move back and forth and / or left and right according to the position of the incoming processing material.

[0029] Optionally, both the feeding conveyor 1 and the unloading conveyor 2 can be belt conveyors in the prior art.

[0030] In one application scenario, the laser parameters of the laser isolation processing device 4 can be matched according to existing laser isolation dejunction technology processes. For example, the laser can be a solid-state laser with a wavelength range of 355nm-1064nm, a pulse width of nanosecond, picosecond, or femtosecond lasers, and an energy density range >150mJ / cm². 2 .

[0031] Based on the above embodiments, see Figure 2 and Figure 3 One embodiment of this application provides a laser processing apparatus, including: a first conveyor line 100 and a second conveyor line 200 arranged in parallel and with opposite conveying directions for conveying silicon wafers with the front side facing down; a laser isolation junction removal module 300 as described above, disposed at the loading end of the first conveyor line 100; a Polyfinger process laser processing system 400, disposed between the unloading end of the first conveyor line 100 and the loading end of the second conveyor line 200, for performing laser processing on the back side of the silicon wafer; and a T-shaped rotary conveying device 500, disposed on one side of the Polyfinger process laser processing system 400, for loading and unloading the Polyfinger process laser processing system 400.

[0032] See Figure 2 For example, the first conveyor line 100 can convey silicon wafers from right to left, and the second conveyor line 200 can convey them from left to right. The silicon wafers first undergo laser isolation and junction removal technology on the front (bottom) side at the laser isolation and junction removal module 300, and then are conveyed to the Polyfin process laser processing system for Polyfin process laser processing on the back (top) side. It should be noted that the Polyfin process is also an existing technology.

[0033] See Figure 4 Optionally, the Polyfin laser processing system 400 includes: a first rotating platform 410 on which a rotating plate 420 is disposed, and a plurality of silicon wafer carriers 430 are disposed at both ends of the rotating plate 420; and a laser processing device 440 disposed above the first rotating platform 410 for processing silicon wafers on the silicon wafer carriers 430 at the processing position.

[0034] In this embodiment, one end of the rotating plate 420 can correspond to the loading and unloading position, and the other end can correspond to the processing position; two silicon wafer carriers 430 can be set at both ends; when the silicon wafer at one end is being processed, the other end can be used for unloading and loading.

[0035] See Figure 5Optionally, the T-shaped rotary conveying device 500 includes: a second rotary platform 510 on which a T-shaped rotary plate 520 is disposed, and a plurality of silicon wafer picking devices 530 are disposed at each of the three ends of the T-shaped rotary plate 520. In this embodiment, the T-shaped rotary conveying device 500 can transfer silicon wafers between the unloading end of the first conveyor line 100, the loading and unloading positions of the Polyfin process laser processing system 400, and the loading end of the second conveyor line 200.

[0036] In one application scenario, the laser in the Polyfin laser processing system 400 can be a solid-state laser. This laser can have a wavelength range of 355nm-1064nm, a pulse width of nanosecond, picosecond, or femtosecond, and an energy density range >150mJ / cm². 2 The optical path system may include field mirrors and galvanometers for patterning, as well as beam expanders, reflectors, and dot-of-extension (DOE) for beam shaping.

[0037] The following is an example of the working process of laser processing equipment in an application scenario: Step 1: The incoming silicon wafers are placed face down and conveyed to several feeding conveyor devices 1 of the laser isolation junction removal module via a belt conveyor system. Step 2: The silicon wafer is adsorbed by the suction cup of the X-axis translational conveying device 3 and taken away from the feeding conveying device 1. Then, the silicon wafer is translated from the feeding conveying device 1 to the feeding conveying device 2 by the translational arm. Step 3: During the translation process, the silicon wafer passes through the laser processing gap, and the laser isolation processing device 4 processes the silicon wafer; Step 4: The first conveyor line 100 carries the silicon wafer away from the laser isolation and junction removal module; Step 5: The silicon wafer is conveyed to the unloading end of the first conveyor line 100. The T-shaped rotary conveying device 500 places the silicon wafer at the loading position of the Polyfinger laser processing system 400 to accurately position the silicon wafer in preparation for the subsequent precise pattern processing of the polyfinger. Step 6: Using the first rotating platform 410, place the silicon wafer at the laser processing platform position; Step 7: Perform a patterned polyfin processing on the back of the solar cell. Here, the laser system is placed above the silicon wafer, with the front side facing down and the back side facing up. The processing surface is the back side. Step 8: Using the first rotating platform 410, the processed silicon wafer is rotated out of the processing system. The T-shaped rotating conveying device 500 moves the silicon wafer to the loading end of the second conveyor line 200 and conveys it outward.

[0038] It should be noted that all the devices (parts whose specific structures are not specified) selected in this application are general standard parts or parts known to those skilled in the art, and their structures and principles can be known to those skilled in the art through technical manuals or conventional experimental methods.

[0039] In the description of the embodiments of this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0040] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0041] Based on the above-described preferred embodiments of this utility model, and through the foregoing description, those skilled in the art can make various changes and modifications without departing from the technical concept of this utility model. The technical scope of this utility model is not limited to the contents of the specification.

Claims

1. A laser isolation dejunction processing module, characterized in that, include: A series of feeding conveyors (1) and feeding conveyors (2) are used to convey silicon wafers facing down; and a laser processing gap is provided between adjacent feeding conveyors (1) and feeding conveyors (2). X-axis translational conveying device (3), comprising a plurality of silicon wafer gripping assemblies (31) for simultaneously translating silicon wafers from a plurality of loading conveyors (1) to corresponding unloading conveyors (2); and The laser isolation processing device (4) is set below the laser processing gap and is used to perform laser isolation processing on the front side of the silicon wafer that has been translated along the X direction through the laser processing gap.

2. The laser isolation dejunction processing module according to claim 1, characterized in that, The number of the feeding conveyor (1), the unloading conveyor (2), and the silicon wafer gripping assembly (31) are all two.

3. The laser isolation dejunction processing module according to claim 1, characterized in that, The silicon wafer gripping component (31) is a Bernoulli effect chuck or a Coanda effect chuck.

4. The laser isolation dejunction processing module according to claim 1, characterized in that, A positioning camera (11) is provided above the feeding conveyor (1), and a light source (12) is provided below the feeding conveyor (1).

5. The laser isolation dejunction processing module according to claim 1, characterized in that, The laser isolation processing device (4) includes: a moving module (41) and a laser isolation processing head (42). The moving module (41) is used to move the laser isolation processing head (42).

6. A laser processing device, characterized in that, include: A first conveyor line (100) and a second conveyor line (200) arranged in parallel and with opposite conveying directions are used to convey silicon wafers with the front side facing down; The laser isolation de-junction processing module (300) as described in any one of claims 1-5 is disposed at the loading end of the first conveyor line (100); A polyfin laser processing system (400) is disposed between the unloading end of the first conveyor line (100) and the loading end of the second conveyor line (200) for laser processing of the back side of a silicon wafer; and A T-shaped rotary conveying device (500) is installed on one side of the Polyfin laser processing system (400) for loading and unloading materials from the Polyfin laser processing system (400).

7. The laser processing equipment according to claim 6, characterized in that, The Polyfin laser processing system (400) includes: A first rotating platform (410) is provided with a rotating plate (420), and a plurality of silicon wafer carriers (430) are provided at both ends of the rotating plate (420). A laser processing apparatus (440) is disposed above a first rotating platform (410) for processing silicon wafers on a silicon wafer carrier (430) in the processing position.

8. The laser processing equipment according to claim 7, characterized in that, The T-shaped rotary conveying device (500) includes: a second rotary platform (510) on which a T-shaped rotary plate (520) is provided, and a plurality of silicon wafer picking devices (530) are provided on each of the three ends of the T-shaped rotary plate (520).

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