A chip fluid circulation device for silicon wafer cutting

Abstract

This invention provides a cutting fluid circulation device for silicon wafer cutting, relating to the field of silicon wafer cutting machine technology. It includes a cutting fluid circulation assembly, which is equipped with a fine filter assembly and an installation / removal assembly. The cutting fluid circulation assembly includes a collection tank and a cooling tank. This invention facilitates the installation of a filter screen on the collection tank by inserting a plug block inside the mounting frame, which is beneficial for filtering large particles in the cutting fluid. During the insertion of the plug block, the spring is compressed by the squeezing force. After the plug block is installed, the elasticity of the spring causes a limiting block to be positioned inside the plug block, thus providing a certain degree of limitation. Finally, a limiting plate is movably installed inside the fixed frame, causing the limiting plate to block and limit the plug block. The operation is convenient, eliminating the need for frequent installation and removal of bolts, shortening installation and removal time, and thus improving maintenance efficiency.

Description

Technical Field

[0001] This utility model relates to the field of silicon wafer cutting machine technology, and in particular to a chip fluid circulation device for silicon wafer cutting. Background Technology

[0002] A silicon wafer cutting machine, also known as a silicon wafer laser cutting machine or laser scribing machine, works by using a high-energy laser beam to irradiate the surface of a workpiece, causing the irradiated area to locally melt and vaporize, thereby cutting the silicon material. Cutting fluid is essential during the cutting process.

[0003] In the prior art, such as the patent application CN219113209U "A Chip Fluid Circulation Device", a waste liquid tank is included. The waste liquid tank is characterized in that the bottom of the waste liquid tank is connected to the inlet of a pneumatic diaphragm pump through a drain pipe with a drain valve, the outlet of the pneumatic diaphragm pump is connected to one end of a filter box, the other end of the filter box is connected to the chip fluid inlet of a cooling box through a suction pump, and the chip fluid outlet of the cooling box is connected to a chip fluid storage tank through a return pipe.

[0004] Existing cutting fluid circulation devices need to filter impurities such as silicon chips generated during silicon wafer cutting. However, existing filters are usually installed with a large number of bolts. When maintenance is required, each bolt needs to be unscrewed, which is cumbersome and prone to disassembly due to bolt corrosion, thus reducing maintenance efficiency. Utility Model Content

[0005] The purpose of this invention is to solve the problem that existing filters are usually installed with a large number of bolts. When maintenance is required, each bolt needs to be unscrewed, which is cumbersome and easy to cause disassembly difficulties due to bolt corrosion, thus reducing maintenance efficiency. Therefore, this invention proposes a chip fluid circulation device for silicon wafer cutting.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: a chip fluid circulation device for silicon wafer cutting, comprising a chip fluid circulation assembly, wherein a fine filter assembly and a mounting / removing assembly are provided on the chip fluid circulation assembly, the chip fluid circulation assembly includes a collection tank and a cooling tank, a flow pipe is connected to the bottom of the collection tank, the mounting / removing assembly includes a filter screen, a mounting bracket is fixedly installed on the outside of the collection tank, insert blocks are installed on both sides of the filter screen, the insert blocks are inserted into the inside of the mounting bracket, connecting plates are installed on both sides of the mounting bracket, a spring is connected to the side of the connecting plate, and a limit block is connected to one end of the spring.

[0007] Preferably, the fine filtration assembly includes two connecting pipes, each with a valve in the middle, and a fine filtration box installed at the bottom of each connecting pipe, with a filter element installed inside the fine filtration box.

[0008] Preferably, the limiting block is movably disposed inside the insert block, and a fixing frame is symmetrically installed on the top of the mounting frame, with a limiting plate movably installed inside the fixing frame.

[0009] Preferably, a sealing gasket is installed on the side of the fine filter box, and bolts are threaded on both sides of the filter element.

[0010] Preferably, the cooling tank is provided with a cooling water inlet and a cooling water outlet, and a pump is installed at one end of the cooling tank.

[0011] Preferably, a delivery pipe is installed on the side of the pump, and a nozzle is installed at one end of the delivery pipe.

[0012] Compared with the prior art, the advantages and positive effects of this utility model are as follows:

[0013] 1. In this utility model, by inserting the insert block inside the mounting bracket, it is convenient to install the filter screen on the collection box, which is beneficial for filtering large particles in the cutting fluid. During the insertion of the insert block, the spring is compressed by the squeezing force. After the insert block is installed, the elasticity of the spring causes the limiting block to be set inside the insert block, which helps to limit the insertion block. Finally, the limiting plate is movably installed inside the fixed bracket, which causes the limiting plate to block and limit the insertion block. The operation is convenient and does not require frequent installation and removal of bolts, which shortens the installation and removal time and improves maintenance efficiency.

[0014] 2. In this utility model, two connecting pipes are provided on the upper part of the flow pipe, which is beneficial to close one valve when the filter element needs maintenance, so that the cutting fluid can be finely filtered through the other connecting pipe without interrupting silicon wafer processing for replacement and maintenance, thus ensuring the continuity of the processing process and improving processing efficiency. Attached Figure Description

[0015] Figure 1 This invention provides a three-dimensional structural schematic diagram of a chip fluid circulation device for silicon wafer cutting;

[0016] Figure 2 This utility model presents a schematic diagram of another angle of the structure of a chip fluid circulation device for silicon wafer cutting;

[0017] Figure 3 This invention provides a partially exploded structural diagram of a chip fluid circulation device for silicon wafer cutting.

[0018] Figure 4 A partial structural schematic diagram of a chip fluid circulation device for silicon wafer cutting is provided for this utility model;

[0019] Figure 5 This invention presents a partially exploded structural diagram of a chip fluid circulation device for silicon wafer cutting.

[0020] Legend: 1. Cutting fluid circulation assembly; 101. Collection tank; 102. Flow pipe; 103. Cooling tank; 104. Cooling water inlet; 105. Cooling water outlet; 106. Pump; 107. Delivery pipe; 108. Nozzle; 2. Fine filter assembly; 201. Connecting pipe; 202. Valve; 203. Fine filter box; 204. Sealing gasket; 205. Filter element; 206. Bolt; 3. Installation and removal assembly; 301. Filter screen; 302. Insert block; 303. Mounting bracket; 304. Fixing bracket; 305. Limiting plate; 306. Connecting plate; 307. Spring; 308. Limiting block. Detailed Implementation

[0021] To better understand the above-mentioned objectives, features, and advantages of this utility model, the present utility model will be further described below with reference to the accompanying drawings and embodiments. It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other.

[0022] Many specific details are set forth in the following description in order to provide a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Therefore, the present invention is not limited to the specific embodiments disclosed in the following specification.

[0023] Example 1: As Figures 1-5 As shown, this utility model provides a technical solution: a chip fluid circulation device for silicon wafer cutting, including a chip fluid circulation assembly 1, a fine filter assembly 2 and a mounting / removing assembly 3. The chip fluid circulation assembly 1 includes a collection tank 101 and a cooling tank 103. A flow pipe 102 is connected to the bottom of the collection tank 101. The mounting / removing assembly 3 includes a filter screen 301. A mounting bracket 303 is fixedly installed on the outside of the collection tank 101. Insert blocks 302 are installed on both sides of the filter screen 301. The insert blocks 302 are inserted into the inside of the mounting bracket 303. Connecting plates 306 are installed on both sides, and springs 307 are connected to the sides of the connecting plates 306. One end of the springs 307 is connected to a limiting block 308. The limiting block 308 is movably disposed inside the insert block 302. Fixing frames 304 are symmetrically installed on the top of the mounting frame 303. A limiting plate 305 is movably installed inside the fixing frame 304. Cooling tank 103 is provided with a cooling water inlet 104 and a cooling water outlet 105. A pump 106 is installed at one end of the cooling tank 103. A delivery pipe 107 is installed on the side of the pump 106. A nozzle 108 is installed at one end of the delivery pipe 107.

[0024] In this embodiment, by inserting the insert block 302 inside the mounting bracket 303, it is convenient to install the filter screen 301 on the collection box 101, which is beneficial for filtering large particles in the cutting fluid. During the insertion of the insert block 302, the spring 307 is compressed by the squeezing force. After the insert block 302 is installed, the elasticity of the spring 307 causes the limiting block 308 to be placed inside the insert block 302, thereby providing a certain limit for the insert block 302. Finally, the limiting plate 308 is used. The 5-movable device is installed inside the fixed frame 304, causing the limiting plate 305 to block and limit the insertion block 302. The operation is convenient and does not require frequent installation and removal of bolts, which shortens the installation and removal time and improves maintenance efficiency. The cooling tank 103 is equipped with a cooling water inlet 104 and a cooling water outlet 105, which is conducive to cooling the filtered cutting fluid. After cooling, the pump 106 works to transport the cutting fluid through the delivery pipe 107 to the nozzle 108 and spray it out, thereby realizing the recycling of the cutting fluid.

[0025] Example 2: As Figures 1-5 As shown, the fine filter assembly 2 includes two connecting pipes 201, each with a valve 202 in the middle, a fine filter box 203 installed at the bottom of each connecting pipe 201, a filter element 205 installed inside the fine filter box 203, a sealing gasket 204 installed on the side of the fine filter box 203, and bolts 206 threaded on both sides of the filter element 205.

[0026] In this embodiment, opening valve 202 facilitates the coarsely filtered cutting fluid to be transported through one of the connecting pipes 201 to the interior of the fine filter box 203. The cutting fluid undergoes further fine filtration through the filter element 205, further reducing the accumulation of impurities inside the equipment. Bolts 206 facilitate the installation and removal of the filter element 205, and the sealing gasket 204 provides a sealing effect. Two connecting pipes 201 are provided on the flow pipe 102, which allows one valve 202 to be closed when maintenance of the filter element 205 is required, causing the cutting fluid to undergo fine filtration through the other connecting pipe 201. This eliminates the need to interrupt silicon wafer processing for replacement and maintenance, ensuring the continuity of the processing process and thus improving processing efficiency.

[0027] The working principle of this embodiment is as follows: In use, the insert block 302 is first inserted into the mounting bracket 303, facilitating the installation of the filter screen 301 on the collection box 101. This is beneficial for filtering large particles in the cutting fluid. During the insertion of the insert block 302, the spring 307 is compressed by the squeezing force. After the insert block 302 is installed, the elasticity of the spring 307 causes the limiting block 308 to be positioned inside the insert block 302, thus providing a certain limit for the insert block 302. Finally, the limiting plate 305 is movably installed inside the fixing bracket 304, causing the limiting plate 305 to block and limit the insert block 302. Then, the valve 202 is opened to allow the coarsely filtered cutting fluid to pass through one of the connecting valves. The fluid is fed into the fine filter box 203 via the pipe 201. The fluid is further finely filtered by the filter element 205. The flow pipe 102 is equipped with two connecting pipes 201, which allows the fluid to be finely filtered through the other connecting pipe 201 when maintenance of the filter element 205 is required. This eliminates the need to interrupt silicon wafer processing for replacement and maintenance. The finely filtered fluid flows into the cooling box 103, which is equipped with a cooling water inlet 104 and a cooling water outlet 105 to cool the filtered fluid. After cooling, the fluid is pumped by the pump 106, which delivers the fluid through the conveying pipe 107 to the nozzle 108 and sprays it out, thus realizing the recycling of the fluid.

[0028] The cooling box 103, pump 106 and valve 202 in this utility model are common knowledge in the field. Their working principle is a well-known technology. The appropriate model is selected according to actual use. Therefore, the cooling box 103, pump 106 and valve 202 will not be explained in detail.

[0029] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model in any other way. Any person skilled in the art may make changes or modifications to the above-disclosed technical content to create equivalent embodiments for application in other fields. However, any simple modifications, equivalent changes, and modifications made to the above embodiments based on the technical essence of the present utility model without departing from the technical solution of the present utility model shall still fall within the protection scope of the technical solution of the present utility model.

Claims

1. A cutting fluid circulation device for silicon wafer cutting, comprising a cutting fluid circulation assembly (1), characterized in that: The cutting fluid circulation assembly (1) is provided with a fine filter assembly (2) and a disassembly assembly (3). The cutting fluid circulation assembly (1) includes a collection tank (101) and a cooling tank (103). The bottom of the collection tank (101) is connected to a flow pipe (102). The disassembly assembly (3) includes a filter screen (301). A mounting bracket (303) is fixedly installed on the outside of the collection tank (101). Insert blocks (302) are installed on both sides of the filter screen (301). The insert blocks (302) are inserted into the inside of the mounting bracket (303). Connecting plates (306) are installed on both sides of the mounting bracket (303). A spring (307) is connected to the side of the connecting plate (306). One end of the spring (307) is connected to a limit block (308).

2. The chip fluid circulation device for silicon wafer cutting according to claim 1, characterized in that: The fine filter assembly (2) includes two connecting pipes (201), each with a valve (202) in the middle, and a fine filter box (203) installed at the bottom of each connecting pipe (201). A filter element (205) is installed inside the fine filter box (203).

3. The chip fluid circulation device for silicon wafer cutting according to claim 1, characterized in that: The limiting block (308) is movably disposed inside the insert block (302), and a fixing frame (304) is symmetrically mounted on the top of the mounting frame (303). A limiting plate (305) is movably installed inside the fixing frame (304).

4. The chip fluid circulation device for silicon wafer cutting according to claim 2, characterized in that: A sealing gasket (204) is installed on the side of the fine filter box (203), and bolts (206) are threaded on both sides of the filter element (205).

5. The chip fluid circulation device for silicon wafer cutting according to claim 1, characterized in that: The cooling tank (103) is provided with a cooling water inlet (104) and a cooling water outlet (105), and a pump (106) is installed at one end of the cooling tank (103).

6. The chip fluid circulation device for silicon wafer cutting according to claim 5, characterized in that: A delivery pipe (107) is installed on the side of the pump (106), and a nozzle (108) is installed at one end of the delivery pipe (107).

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