Semiconductor wafer lifting and polishing equipment

Abstract

This utility model discloses a semiconductor wafer lifting and polishing device, relating to the field of semiconductor processing technology. The device includes a main frame, a polishing assembly, and a lifting assembly. The main frame is fixedly connected to a support platform, which includes a support plate with a support surface and a suction assembly connected to the support surface. The lifting plate can switch between a lifting state and a polishing state. When the lifting assembly is in the polishing state, the lifting plate is embedded in a mounting slot. The lifting assembly includes a lifting frame. When the lifting plate is in the lifting state, a drive rod drives the lifting frame to move towards one side of the support plate, pushing the lifting plate out of the mounting slot. The lifting plate is flush with the support surface, preventing stress concentration and cracking of the wafer due to local height differences. After inserting a mechanical claw under the wafer, lifting the mechanical claw can lift the wafer out of the lifting plate, reducing restrictions on the type of mechanical claw and the stroke requirements of the polishing assembly, thus reducing production costs.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor processing technology, and in particular to a semiconductor wafer lifting and polishing device. Background Technology

[0002] In semiconductor manufacturing, wafers, serving as substrates for transistors or integrated circuits, are typically made of crystalline silicon. They are named "wafers" because of their circular shape. Wafers are cut from large silicon wafers, and during the cutting and edge processing, surface impacts and scratches are easily caused by mechanical contact. Furthermore, the raw silicon wafer itself has a relatively high surface roughness and, without polishing, cannot meet the stringent surface flatness requirements of microelectronic device manufacturing. Therefore, wafers must undergo surface grinding and polishing before subsequent processes to eliminate damaged layers and improve surface quality.

[0003] In current common polishing processes, wafers are usually placed on the surface of a support and polished by applying pressure with a polishing disc. To ensure the wafer remains stable during polishing, its back side is often tightly attached to the support, and an air extraction device is used to firmly attach the wafer to the support. However, this method also leads to significant limitations in the wafer removal process after polishing: mechanical grippers with suction cups are commonly used to pick up the wafer from above. This method requires the polishing equipment to have a large mechanical stroke space for the gripping mechanism to enter, and it also restricts the type of mechanical gripper, increasing the complexity of the equipment and the operation time, thereby restricting the improvement of production cycle and overall efficiency. Utility Model Content

[0004] The main purpose of this invention is to propose a semiconductor wafer lifting and polishing device, which aims to improve production efficiency.

[0005] To achieve the above objectives, the present invention proposes a semiconductor wafer lifting and polishing device, which includes a main frame, a support platform fixedly connected to the main frame, a support plate, a support surface for placing the wafer, and a plurality of air suction holes connected to an air suction component.

[0006] A polishing assembly, which is slidably connected to the main frame to be close to or away from the support surface;

[0007] A lifting assembly, comprising a lifting plate, wherein the supporting surface is recessed to form an installation groove, and the lifting plate is capable of switching between a lifting state and a grinding state;

[0008] When the lifting assembly is in the polishing state, the lifting plate is embedded in the mounting groove, and the side of the lifting plate away from the support platform is flush with the support surface;

[0009] The lifting assembly includes a lifting frame, which is provided with a plurality of lifting rods. The lifting rods pass through the bottom wall of the mounting groove to connect with the lifting plate. The suction assembly is located in the middle of the lifting frame. The lifting frame is slidably connected to the support platform. The lifting frame is provided with connecting wings on opposite sides. Both connecting wings are connected to the drive rod of the lifting motor.

[0010] When the lifting plate is in the lifted state, the drive rod drives the lifting frame to move towards the support plate side, so as to push the lifting plate away from the mounting groove.

[0011] In one embodiment, the suction port includes a main suction port located at the center of the support plate and a plurality of auxiliary suction ports spaced apart around the main suction port;

[0012] The lifting plate has a mountain-shaped cross section. The lifting plate includes a connecting rod, a first insert rod, a second insert rod, and a third insert rod. The first insert rod, the second insert rod, and the third insert rod are arranged in parallel and are all integrally connected to the connecting rod. The second insert rod and the third insert rod are located at both ends of the connecting rod. The first insert rod is located between the second insert rod and the third insert rod, and there is an insertion gap between the first insert rod and the second insert rod and the third insert rod on both sides.

[0013] When the lifting component is in the polishing state, the multiple auxiliary suction holes are located within the insertion gap to avoid obstructing the auxiliary suction holes.

[0014] In one embodiment, the first insert extends from the connecting rod to the center of the support plate, and the end of the first insert away from the connecting rod is provided with an annular support portion for supporting the center of the wafer;

[0015] The annular support portion corresponds to the position of the main suction hole, and the annular support portion is provided with corresponding ventilation holes to avoid blocking the main suction hole.

[0016] In one embodiment, the mounting groove includes a first groove and a second groove;

[0017] When the lifting assembly is in the polishing state, the first insert is embedded in the first groove, and the connecting rod, the second insert, and the third insert are all embedded in the second groove;

[0018] The outer edge of the cross-section of the second groove is square, and the connecting rod, the second insert rod and the third insert rod have the same length to switch the installation position in the second groove.

[0019] The first groove has a T-shaped cross-section, and all three ends of the first groove are connected to the second groove.

[0020] In one embodiment, the lifting frame is provided with four lifting rods, and four lifting holes are respectively opened on the bottom wall of the four corners of the second groove. The lifting rods pass through the lifting holes and abut against the connecting rod, the second insert rod, or the third insert rod.

[0021] In one embodiment, the support platform is provided with a plurality of limiting blocks, which are respectively disposed on the periphery of the lifting frame and abut against the side wall of the lifting frame to restrict the movement direction of the lifting frame.

[0022] In one embodiment, the outer edge of the lifting frame is square, the cross-section of the limiting block is L-shaped, and a plurality of the limiting blocks are respectively disposed at the four corners of the lifting frame, the shape of the limiting blocks being adapted to the shape of the lifting frame.

[0023] In one embodiment, the semiconductor wafer lifting and polishing equipment further includes a first filling block and a second filling block, wherein the number of the first filling blocks is two;

[0024] The two first filling blocks are embedded in the first groove, and the two first filling blocks and the first insert cooperate to fill the first groove;

[0025] The second filling block is embedded in the second groove, and the second filling block, the second insert rod, the third insert rod, and the connecting rod cooperate to fill the second groove.

[0026] In one embodiment, there are two lifting motors, which are located on opposite sides of the support platform. The drive rods of the two lifting motors move synchronously to drive the lifting frame to move.

[0027] In one embodiment, the air intake assembly includes an air pump, a distribution box, and a plurality of air intake cylinders. The air pump is connected to the distribution box, the distribution box is connected to the plurality of air intake cylinders, the air intake cylinders are fixedly connected to the support plate, and the air intake end of the air intake cylinder is correspondingly arranged with the air intake hole.

[0028] The technical solution of this utility model uses the suction holes and suction components provided on the support surface to adsorb and fix the wafer during the polishing process, preventing the wafer from moving during polishing. During the polishing process, the lifting plate is flush with the support surface, forming a complete support surface together, avoiding stress concentration on the wafer caused by local height differences and resulting in cracking. The lifting process is driven and controlled by the lifting motor, reducing the risk of surface damage that may be caused by manual intervention or mechanical grippers. After the mechanical gripper is inserted under the wafer, the lifting mechanical gripper can lift the wafer off the lifting plate to complete the wafer unloading. There is no need for suction cup mechanical grippers, which reduces the restrictions on the type of mechanical gripper and the requirements for the stroke of the polishing component, thereby reducing production costs. Attached Figure Description

[0029] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0030] Figure 1 A schematic diagram of a structure of an embodiment of the semiconductor wafer lifting and polishing equipment provided by this utility model;

[0031] Figure 2 This is a schematic diagram of the support platform assembly structure;

[0032] Figure 3 This is a schematic diagram of the assembly structure of the support plate and the lifting plate;

[0033] Figure 4 This is a schematic diagram of the support plate structure;

[0034] Figure 5 A schematic diagram of the assembly structure for the lifting component and the intake component;

[0035] Figure 6 This is a schematic diagram of another embodiment of the semiconductor wafer lifting and polishing equipment provided by this utility model.

[0036] Explanation of icon numbers:

[0037] 1. Main frame; 2. Support platform; 21. Support plate; 211. Support surface; 212. Suction hole; 2121. Main suction hole; 2122. Auxiliary suction hole; 213. Mounting slot; 2131. First slot; 2132. Second slot; 2133. Lifting hole; 3. Polishing assembly; 31. Polishing motor; 32. Grinding disc; 33. Mounting bracket; 4. Lifting assembly; 41. Lifting plate; 411. Connecting rod; 412. First insert rod; 4121. Annular support part; 4122. Vent hole; 413. Second insert rod; 414. Third insert rod; 42. Lifting frame; 421. Lifting rod; 422. Connecting wing; 51. Air pump; 52. Distribution box; 53. Suction cylinder; 6. Lifting motor; 7. Limiting block; 8. First filling block; 9. Second filling block.

[0038] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0039] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present utility model.

[0040] It should be noted that if the embodiments of this utility model involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indicators will also change accordingly.

[0041] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the use of "and / or" or "and / or" throughout the text includes three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0042] In semiconductor manufacturing, wafers, serving as substrates for transistors or integrated circuits, are typically made of crystalline silicon. They are named "wafers" because of their circular shape. Wafers are cut from large silicon wafers, and during the cutting and edge processing, surface impacts and scratches are easily caused by mechanical contact. Furthermore, the raw silicon wafer itself has a relatively high surface roughness and, without polishing, cannot meet the stringent surface flatness requirements of microelectronic device manufacturing. Therefore, wafers must undergo surface grinding and polishing before subsequent processes to eliminate damaged layers and improve surface quality.

[0043] In current common polishing processes, wafers are usually placed on the surface of a support and polished by applying pressure with a polishing disc. To ensure the wafer remains stable during polishing, its back side is often tightly attached to the support, and an air extraction device is used to firmly attach the wafer to the support. However, this method also leads to significant limitations in the wafer removal process after polishing: mechanical grippers with suction cups are commonly used to pick up the wafer from above. This method requires the polishing equipment to have a large mechanical stroke space for the gripping mechanism to enter, and it also restricts the type of mechanical gripper, increasing the complexity of the equipment and the operation time, thereby restricting the improvement of production cycle and overall efficiency.

[0044] This utility model proposes a semiconductor wafer lifting and polishing device.

[0045] Please see Figures 1 to 6 In one embodiment of this utility model, the semiconductor wafer lifting and polishing device includes:

[0046] Main frame 1, the main frame 1 is fixedly connected to a support platform 2, the support platform 2 includes a support plate 21, the support plate 21 is provided with a support surface 211 for placing wafers, and the support surface 211 has a plurality of air suction holes 212, the air suction holes 212 are connected to an air suction component;

[0047] Polishing assembly 3, which is slidably connected to the main frame 1 to be close to or away from the support surface 211;

[0048] The lifting assembly 4 includes a lifting plate 41, and the support surface 211 has a recessed mounting groove 213. The lifting plate 41 can switch between a lifting state and a grinding state.

[0049] When the lifting component 4 is in the polishing state, the lifting plate 41 is embedded in the mounting groove 213, and the side of the lifting plate 41 away from the support platform 2 is flush with the support surface 211.

[0050] The lifting assembly 4 includes a lifting frame 42, which is provided with a plurality of lifting rods 421. The lifting rods 421 pass through the bottom wall of the mounting groove 213 to connect with the lifting plate 41. The suction assembly is located in the middle of the lifting frame 42. The lifting frame 42 is slidably connected to the support platform 2. The lifting frame 42 is provided with connecting wings 422 on opposite sides. Both connecting wings 422 are connected to the drive rod of the lifting motor 6.

[0051] When the lifting plate 41 is in the lifting state, the driving rod drives the lifting frame 42 to move toward the support plate 21 to push the lifting plate 41 away from the mounting groove 213;

[0052] like Figure 1As shown, it can be understood that the polishing component 3 is slidably connected to the main frame 1. During polishing, the polishing component 3 moves close to the support surface 211 to polish the wafer placed on the support surface 211. After polishing is completed, the polishing component 3 is lifted.

[0053] The technical solution of this utility model uses the suction hole 212 and the suction component provided on the support surface 211 to adsorb and fix the wafer during the polishing process, preventing the wafer from moving during polishing. During the polishing process, the lifting plate 41 is flush with the support surface 211, forming a complete support surface together, avoiding stress concentration on the wafer caused by local height differences and resulting in cracking. The lifting process is driven and controlled by the lifting motor 6, reducing the risk of surface damage that may be caused by manual intervention or mechanical grippers. After the mechanical gripper is inserted under the wafer, the lifting mechanical gripper can lift the wafer off the lifting plate 41 to complete the wafer unloading. There is no need for suction cup mechanical grippers, which reduces the restriction on the type of mechanical gripper and also reduces the stroke requirement of the polishing component 3, thus reducing production costs.

[0054] Optionally, the polishing assembly 3 includes a polishing motor 31, a grinding disc 32, and a mounting frame 33. The polishing motor 31 is mounted on the mounting frame 33 to be fixed to the mounting frame 33. The mounting frame 33 is provided with a slider, and the mounting frame 33 is slidably connected to the main frame 1 through the slider.

[0055] The main frame 1 is equipped with a lead screw, the slider is threadedly connected to the lead screw, and the main frame 1 is also equipped with a drive motor to drive the lead screw to rotate, thereby moving the slider.

[0056] It should be noted that, for ease of understanding, such as Figure 1 As shown, the side of the support platform 2 facing the polishing component 3 is defined as upward, the side of the support platform 2 away from the polishing component 3 is defined as downward, the side of the polishing motor 31 facing the mounting bracket 33 is defined as backward, and the side of the polishing motor 31 away from the mounting bracket 33 is defined as forward.

[0057] like Figure 2 As shown, the suction component is located below the support plate 21 and occupies a certain area. The suction component is located in the middle of the lifting frame 42. The lifting frame 42 will not collide with the suction component when it moves up and down. The free movement of the lifting frame 42 can be achieved without modifying the position of the suction component.

[0058] like Figure 3 and Figure 4 As shown, the suction hole 212 includes a main suction hole 2121 located at the center of the support plate 21 and a plurality of auxiliary suction holes 2122 arranged at intervals around the main suction hole 2121;

[0059] The lifting plate 41 has a mountain-shaped cross section. The lifting plate 41 includes a connecting rod 411, a first insert rod 412, a second insert rod 413, and a third insert rod 414. The first insert rod 412, the second insert rod 413, and the third insert rod 414 are arranged in parallel and are all integrally connected to the connecting rod 411. The second insert rod 413 and the third insert rod 414 are located at both ends of the connecting rod 411. The first insert rod 412 is located between the second insert rod 413 and the third insert rod 414, and there is an insertion gap between the first insert rod 412 and the second insert rod 413 and the third insert rod 414 on both sides.

[0060] When the lifting component 4 is in the polishing state, the plurality of auxiliary suction holes 2122 are located within the insertion gap to avoid obstructing the auxiliary suction holes 2122.

[0061] It is understood that the main suction hole 2121 is located in the center to provide the main suction force, and the circumferential auxiliary suction hole 2122 forms multiple auxiliary suction forces in the insertion gap, so that the wafer obtains a uniform negative pressure on the entire support surface 211 and prevents the wafer from shifting.

[0062] Furthermore, the insertion gap between the first insertion rod 412, the second insertion rod 413, and the third insertion rod 414 not only prevents the auxiliary suction hole 2122 from being blocked, but also provides clearance for the mechanical gripper to move up and down relative to the lifting plate 41. It can be understood that if the wafer needs to be unloaded after the lifting plate 41 is raised, the mechanical gripper needs to be moved below the wafer first, and the mechanical gripper needs to be moved upward to make the wafer detach from the lifting plate 41. The insertion gap provides space for the upward movement of the mechanical gripper and avoids interference. As long as the movement direction of the mechanical gripper is parallel to the extension direction of the first insertion rod 412, the movement of the mechanical gripper in the horizontal plane can be realized.

[0063] Optionally, the auxiliary suction hole 2122 is symmetrically arranged around the main suction hole 2121 to ensure uniform suction force.

[0064] In some embodiments, the mechanical claw has a C-shaped cross-section, corresponding to the lifting plate 41, and can be partially inserted into the insertion gap.

[0065] Optionally, the first insertion rod 412 extends from the connecting rod 411 to the center of the support plate 21, and the end of the first insertion rod 412 away from the connecting rod 411 is provided with an annular support portion 4121 to support the center of the wafer;

[0066] The annular support portion 4121 is positioned corresponding to the main suction hole 2121, and the annular support portion 4121 is provided with a corresponding vent hole 4122 to avoid obstructing the main suction hole 2121.

[0067] Understandably, when lifting the wafer, the second insertion rod 413 and the third insertion rod 414 support the side of the wafer away from the center of the wafer. The annular support part 4121 can support the center of the wafer, preventing the wafer from bending during the lifting process. Furthermore, the vent hole 4122 ensures that the negative pressure airflow of the main suction hole 2121 can pass through without obstruction.

[0068] Optionally, the mounting groove 213 includes a first groove 2131 and a second groove 2132;

[0069] When the lifting component 4 is in the polishing state, the first insert rod 412 is embedded in the first groove 2131, and the connecting rod 411, the second insert rod 413 and the third insert rod 414 are all embedded in the second groove 2132.

[0070] The outer edge of the cross-section of the second groove 2132 is square, and the lengths of the connecting rod 411, the second insert rod 413 and the third insert rod 414 are the same, so as to switch the installation position in the second groove 2132.

[0071] The first groove 2131 has a T-shaped cross section, and all three ends of the first groove 2131 are connected to the second groove 2132.

[0072] It should be noted that in actual use, in order to ensure that the mechanical claw can be smoothly inserted into the insertion gap and move up and down normally, the insertion direction of the mechanical claw must be parallel to the extension direction of the first insertion rod 412. If the insertion direction of the mechanical claw is perpendicular to the extension direction of the first insertion rod 412, the mechanical claw may collide with the lifting plate 41, affecting its use. This would require changing the shape of the mechanical claw or changing the position of the equipment, which is very inconvenient.

[0073] Furthermore, the outer edge of the cross-section of the second groove 2132 is square, and the lengths of the connecting rod 411, the second insert rod 413, and the third insert rod 414 are the same. The four sides of the second groove 2132 are defined as the first side, the second side, the third side, and the fourth side connected in sequence. The connecting rod 411 can be installed in the first side. At this time, the second connecting rod 411 and the third connecting rod 411 are located in the fourth side and the second side, respectively. At this time, the insertion interface of the insertion gap is oriented in the direction corresponding to the third side.

[0074] If the connecting rod 411 is installed inside the second side, the second connecting rod 411 and the third connecting rod 411 are located inside the third side and the first side, respectively. At this time, the insertion interface of the insertion gap is oriented in the direction of the fourth side. If the third side corresponds to the front side and the fourth side corresponds to the right side, by changing the installation direction of the lifting plate 41, it can be adapted to mechanical claws in different directions, which is convenient for adjustment according to the production environment.

[0075] It should be noted that, since the connecting rod 411, the second insert rod 413 and the third insert rod 414 have the same length, taking the connecting rod 411 as an example, the connecting rod 411 is adapted to the first side, the second side, the third side and the fourth side of the second groove 2132. The second insert rod and the third insert rod are similar.

[0076] It is understandable that when the installation position of the lifting plate 41 changes, the position of the first insertion rod 412 will also change. The T-shaped first groove 2131 provides three interchangeable directions for the first insertion rod 412. Since the main frame 1 needs to slide to connect the polishing component 3, the rear side of the support platform 2 is provided with a connecting platform connected to the polishing component 3. The mechanical claw is not easy to extend from the rear side. Therefore, the T-shaped first groove 2131 can meet the adjustment requirements.

[0077] like Figure 1 and Figure 6 As shown, the installation angle of the lifting plate 41 is variable to adapt to different usage scenarios.

[0078] like Figure 5 As shown, the lifting frame 42 is provided with four lifting rods 421, and the bottom wall of the four corners of the second groove 2132 is respectively provided with four lifting holes 2133. The lifting rods 421 pass through the lifting holes 2133, and the lifting rods 421 abut against the connecting rod 411, the second insert rod 413 or the third insert rod 414.

[0079] It is understood that the outer edge of the cross-section of the second groove 2132 is square, and the lifting holes 2133 at the four corners are evenly distributed. The spacing between any two adjacent lifting holes 2133 is fixed. No matter how the installation position of the lifting plate 41 is changed, it can always cover the four lifting holes 2133. That is, when the lifting rod 421 is lifted, the lifting plate 41 can be lifted by the lifting rod 421 to adapt to the switching of the installation direction of the lifting plate 41.

[0080] In one embodiment, the lifting plate 41 is provided with a corresponding insertion hole, and the lifting rod 421 is inserted into the insertion hole to achieve connection with the lifting plate 41.

[0081] In another embodiment, the end of the lifting rod 421 is provided with a first magnetic attraction element, and the bottom end of the lifting plate 41 is provided with four second magnetic attraction elements, and the lifting rod 421 is magnetically fixed to the lifting plate 41.

[0082] Optionally, the support platform 2 is provided with a plurality of limiting blocks 7, which are respectively located on the periphery of the lifting frame 42 and abut against the side wall of the lifting frame 42 to restrict the movement direction of the lifting frame 42.

[0083] It is understood that by setting multiple limiting blocks 7 around the lifting frame 42 and directly abutting against the side wall of the lifting frame 42, precise physical guidance and constraint are provided for the up and down movement of the lifting frame 42, preventing the lifting frame 42 from shifting, rotating or swaying in the horizontal direction during the lifting process, ensuring that the lifting force is strictly transmitted in the vertical direction, thereby ensuring that the wafer is lifted and lowered smoothly and straight, and avoiding wafer jamming, friction or damage caused by skewed lifting trajectory.

[0084] Optionally, the outer edge of the lifting frame 42 is square, the cross-section of the limiting block 7 is L-shaped, and multiple limiting blocks 7 are respectively disposed at the four corners of the lifting frame 42. The shape of the limiting block 7 is adapted to the shape of the lifting frame 42.

[0085] Understandably, multiple limiting blocks 7 are arranged at the four corners of the lifting frame 42, forming a wrap-around limiting structure. The limiting blocks 7 abut against the corners of the square lifting frame 42, constraining the movement and rotation of the lifting frame 42 in two vertical directions within the horizontal plane, thereby ensuring that the lifting frame 42 can only move vertically, improving the stability and accuracy of the movement.

[0086] like Figure 3 As shown, the semiconductor wafer lifting and polishing equipment also includes a first filling block 8 and a second filling block 9, wherein the number of the first filling blocks 8 is two;

[0087] The two first filling blocks 8 are embedded in the first groove 2131, and the two first filling blocks 8 cooperate with the first insert rod 412 to fill the first groove 2131.

[0088] The second filling block 9 is embedded in the second groove 2132, and the second filling block 9, the second insert rod 413, the third insert rod 414 and the connecting rod 411 cooperate to fill the second groove 2132.

[0089] It should be noted that, taking the example of the connecting rod 411 being installed inside the first side, and the second connecting rod 411 and the third connecting rod 411 being located on the fourth side and the second side respectively, the third side is empty at this time. During the polishing process, it cannot effectively support the wafer. By installing the second filling block 9 inside the third side, the gap can be filled and the wafer can be effectively supported.

[0090] It is understood that the first filling block 8 is similar to the second filling block 9, and is used to fill the remaining gap when the first insert 412 switches positions, ensuring that the back side of the wafer can obtain uniform support throughout the polishing process, thereby preventing wafer deformation, vibration or breakage due to insufficient support, and providing a basis for obtaining a polished surface with high flatness.

[0091] Optionally, there are two lifting motors 6, which are located on opposite sides of the support platform 2. The drive rods of the two lifting motors 6 move synchronously to drive the lifting frame 42 to move.

[0092] It is understandable that by symmetrically arranging two lifting motors 6 on opposite sides of the support platform 2 and keeping the drive rod moving synchronously, the lifting frame 42 can be driven synchronously and equally from both sides of the equipment, effectively preventing the lifting frame 42 from jamming, vibrating, or tilting of the wafer due to uneven force on one side, and improving the stability and positioning accuracy of the wafer picking and placing process.

[0093] Optionally, the air intake assembly includes an air pump 51, a distribution box 52, and a plurality of air intake cylinders 53. The air pump 51 is connected to the distribution box 52, and the distribution box 52 is connected to the plurality of air intake cylinders 53. The air intake cylinders 53 are fixedly connected to the support plate 21, and the air intake end of the air intake cylinder 53 is correspondingly arranged with the air intake hole 212.

[0094] It is understood that by using one of the aforementioned air pumps 51 connected to the distribution box 52, and then connecting multiple independent air suction cylinders 53 in parallel through the distribution box 52, a centralized air source and distributed air suction vacuum system is formed, which can generate a uniformly distributed adsorption force on the back side of the wafer.

[0095] The above description is merely an exemplary embodiment of the present utility model and does not limit the scope of protection of the present utility model. Any equivalent structural transformations made based on the technical concept of the present utility model and the contents of the present utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the scope of protection of the present utility model.

Claims

1. A semiconductor wafer lifting and polishing device, characterized in that, include: The main frame is fixedly connected to a support platform. The support platform includes a support plate, which has a support surface for placing the wafer. The support surface has multiple air suction holes, which are connected to an air suction component. A polishing assembly, which is slidably connected to the main frame to be close to or away from the support surface; A lifting assembly, comprising a lifting plate, wherein the supporting surface is recessed to form an installation groove, and the lifting plate is capable of switching between a lifting state and a grinding state; When the lifting assembly is in the polishing state, the lifting plate is embedded in the mounting groove, and the side of the lifting plate away from the support platform is flush with the support surface; The lifting assembly includes a lifting frame, which is provided with a plurality of lifting rods. The lifting rods pass through the bottom wall of the mounting groove to connect with the lifting plate. The suction assembly is located in the middle of the lifting frame. The lifting frame is slidably connected to the support platform. The lifting frame is provided with connecting wings on opposite sides. Both connecting wings are connected to the drive rod of the lifting motor. When the lifting plate is in the lifted state, the drive rod drives the lifting frame to move towards the support plate side, so as to push the lifting plate away from the mounting groove.

2. The semiconductor wafer lifting and polishing equipment as described in claim 1, characterized in that, The air intake includes a main air intake located at the center of the support plate and a plurality of auxiliary air intakes spaced around the main air intake. The lifting plate has a mountain-shaped cross section. The lifting plate includes a connecting rod, a first insert rod, a second insert rod, and a third insert rod. The first insert rod, the second insert rod, and the third insert rod are arranged in parallel and are all integrally connected to the connecting rod. The second insert rod and the third insert rod are located at both ends of the connecting rod. The first insert rod is located between the second insert rod and the third insert rod, and there is an insertion gap between the first insert rod and the second insert rod and the third insert rod on both sides. When the lifting component is in the polishing state, the multiple auxiliary suction holes are located within the insertion gap to avoid obstructing the auxiliary suction holes.

3. The semiconductor wafer lifting and polishing equipment as described in claim 2, characterized in that, The first insertion rod extends from the connecting rod to the center of the support plate, and the end of the first insertion rod away from the connecting rod is provided with an annular support portion to support the center of the wafer; The annular support portion corresponds to the position of the main suction hole, and the annular support portion is provided with corresponding ventilation holes to avoid blocking the main suction hole.

4. The semiconductor wafer lifting and polishing equipment as described in claim 3, characterized in that, The mounting slot includes a first slot and a second slot; When the lifting assembly is in the polishing state, the first insert is embedded in the first groove, and the connecting rod, the second insert, and the third insert are all embedded in the second groove; The outer edge of the cross-section of the second groove is square, and the connecting rod, the second insert rod and the third insert rod have the same length to switch the installation position in the second groove. The first groove has a T-shaped cross-section, and all three ends of the first groove are connected to the second groove.

5. The semiconductor wafer lifting and polishing equipment as described in claim 4, characterized in that, The lifting frame is provided with four lifting rods, and the bottom wall of the four corners of the second groove is respectively provided with four lifting holes. The lifting rods pass through the lifting holes and abut against the connecting rod, the second insert rod, or the third insert rod.

6. The semiconductor wafer lifting and polishing equipment as described in claim 5, characterized in that, The support platform is provided with multiple limiting blocks, which are respectively located on the periphery of the lifting frame and abut against the side wall of the lifting frame to restrict the movement direction of the lifting frame.

7. The semiconductor wafer lifting and polishing equipment as described in claim 6, characterized in that, The outer edge of the lifting frame is square, the cross-section of the limiting block is L-shaped, and multiple limiting blocks are respectively located at the four corners of the lifting frame. The shape of the limiting blocks is adapted to the shape of the lifting frame.

8. The semiconductor wafer lifting and polishing equipment as described in claim 4, characterized in that, The semiconductor wafer lifting and polishing equipment further includes a first filling block and a second filling block, wherein the number of the first filling blocks is two; The two first filling blocks are embedded in the first groove, and the two first filling blocks and the first insert cooperate to fill the first groove; The second filling block is embedded in the second groove, and the second filling block, the second insert rod, the third insert rod, and the connecting rod cooperate to fill the second groove.

9. The semiconductor wafer lifting and polishing equipment as described in claim 1, characterized in that, There are two lifting motors, which are located on opposite sides of the support platform. The drive rods of the two lifting motors move synchronously to drive the lifting frame to move.

10. The semiconductor wafer lifting and polishing equipment as described in claim 1, characterized in that, The air intake assembly includes an air pump, a distribution box, and multiple air intake cylinders. The air pump is connected to the distribution box, and the distribution box is connected to the multiple air intake cylinders. The air intake cylinders are fixedly connected to the support plate, and the air intake end of the air intake cylinder is correspondingly set with the air intake hole.

Images