Sliding machine

Abstract

This utility model discloses a polishing machine, including a frame, a turntable assembly, a first drive assembly, an abrasive mechanism, and a second drive assembly. The turntable assembly includes a connecting shaft and turntables arranged axially opposite to each other along the connecting shaft. The two ends of the connecting shaft are respectively connected to the corresponding turntables. The turntables are rotatably mounted on the frame. The first drive assembly is mounted on the frame and is used to drive the turntables to rotate. The abrasive mechanism includes an abrasive barrel and a cover assembly. The abrasive barrel is rotatably connected to the turntables and the abrasive mechanism is located between the opposite turntables. The abrasive barrel has a receiving cavity. The cover assembly is rotatably connected to the abrasive barrel. The second drive assembly is mounted on the frame and is used to drive the abrasive barrel to rotate. A thermoelectric cooler is mounted on the cover assembly. The thermoelectric cooler has a cold end and a hot end. The hot end is away from the receiving cavity, and the cold end is towards the receiving cavity, so that the thermoelectric cooler can reduce the temperature inside the receiving cavity and prevent the surface of the workpiece from being burned and oxidized.

Description

Technical Field

[0001] This utility model relates to the field of polishing equipment technology, and in particular to a polishing machine. Background Technology

[0002] Existing polishing machines generally include a frame, a turntable assembly, an abrasive mechanism, a first motor, and a second motor. The turntable assembly is rotatably mounted on the frame, and the abrasive mechanism is rotatably mounted on the turntable assembly. The first motor is used to drive the turntable assembly to rotate, and the second motor is used to drive the abrasive mechanism to rotate, so that the abrasive in the abrasive mechanism can polish the workpiece.

[0003] During the polishing process, the abrasive rubs against the workpiece surface at high speed, generating a large amount of heat, which can easily cause surface burns and oxidation of the workpiece. Utility Model Content

[0004] This invention aims to solve at least one of the technical problems existing in the prior art. To this end, this invention proposes a polishing machine that can avoid surface burns and oxidation of workpieces.

[0005] A quenching machine according to an embodiment of the present invention includes:

[0006] frame;

[0007] A turntable assembly includes a connecting shaft and turntables arranged opposite each other along the axial direction of the connecting shaft. The two ends of the connecting shaft are respectively connected to the corresponding turntables, and the turntables are rotatably mounted on the frame.

[0008] A first drive assembly is disposed on the frame, and the first drive assembly is used to drive the turntable to rotate.

[0009] An abrasive mechanism includes an abrasive barrel and a cover assembly. The abrasive barrel is rotatably connected to the turntables, and the abrasive mechanism is located between the opposing turntables. The abrasive barrel has a receiving cavity for containing abrasive, and the cover assembly is rotatably connected to the abrasive barrel to close or open the receiving cavity.

[0010] A second drive assembly is disposed on the frame, and the second drive assembly is used to drive the abrasive barrel to rotate.

[0011] A thermoelectric cooler is disposed on the cover assembly. The thermoelectric cooler has a cold end and a hot end, the hot end being away from the receiving cavity and the cold end being towards the receiving cavity, so that the thermoelectric cooler can reduce the temperature inside the receiving cavity.

[0012] The quenching machine according to the embodiments of this utility model has at least the following beneficial effects:

[0013] When the polishing machine is working, the first drive assembly drives the turntable to rotate, so that the abrasive barrel rotates around the axis of the turntable. The second drive assembly drives the abrasive barrel to rotate, so that the abrasive barrel rotates around its rotation axis. During the movement of the abrasive barrel, the abrasive inside the barrel rubs against the surface of the workpiece. Since the cover assembly is equipped with a semiconductor cooling chip, the cold energy at the cold end can be transferred to the receiving cavity to cool the abrasive and the workpiece, which can prevent the surface of the workpiece from overheating and prevent the surface of the workpiece from being burned and oxidized.

[0014] According to some embodiments of the present invention, the cover assembly includes a base plate and a cover plate connected to the base plate. The base plate and the cover plate enclose a receiving cavity, and the semiconductor cooling chip is housed in the receiving cavity. The cold end faces the base plate, and the hot end faces the cover plate.

[0015] According to some embodiments of the present invention, the base plate is provided with a positioning groove communicating with the receiving cavity, and at least a portion of the semiconductor cooling chip is housed in the positioning groove.

[0016] According to some embodiments of the present invention, the base plate is provided with a drainage hole, one end of which is connected to the positioning groove, and the other end of which extends to the outer periphery of the base plate. The drainage hole is used to drain the condensate generated at the cold end.

[0017] According to some embodiments of this utility model, the drainage hole is a waist-shaped hole.

[0018] According to some embodiments of the present invention, the base plate is provided with a receiving groove that communicates with the positioning groove, and the receiving groove is used to receive the wires of the semiconductor cooling chip.

[0019] According to some embodiments of the present invention, the cover plate is provided with a plurality of heat dissipation holes arranged in an array at intervals, and the heat dissipation holes are connected to the receiving cavity.

[0020] According to some embodiments of the present invention, a plurality of semiconductor cooling chips are configured, and the plurality of semiconductor cooling chips are spaced apart along the axial direction of the connecting shaft.

[0021] According to some embodiments of the present invention, a heat sink is also included, which is connected to the hot end and has multiple heat dissipation channels arranged side by side at intervals.

[0022] According to some embodiments of the present invention, the turntable assembly further includes a plurality of reinforcing columns, the two ends of which are respectively connected to the corresponding turntables. A plurality of abrasive mechanisms are configured, and the plurality of abrasive mechanisms are spaced apart around the axis of the connecting shaft. At least one reinforcing column is provided between adjacent abrasive barrels.

[0023] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0024] The above and / or additional aspects and advantages of this utility model will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0025] Figure 1 This is a schematic diagram of the structure of the slurry machine according to an embodiment of the present utility model;

[0026] Figure 2 This is a schematic diagram of the structure of the cover assembly according to an embodiment of the present utility model;

[0027] Figure 3 This is an exploded view of the cover assembly according to an embodiment of the present utility model;

[0028] Figure 4 This is a top view of the cover assembly according to an embodiment of the present utility model;

[0029] Figure 5 for Figure 4 A cross-sectional view along line AA in the middle.

[0030] Figure label:

[0031] Frame 100, turntable assembly 200, connecting shaft 210, turntable 220, reinforcing column 230, abrasive barrel 300, cover assembly 400, receiving cavity 401, base plate 410, positioning groove 411, drainage hole 412, receiving groove 413, cover plate 420, heat dissipation hole 421, semiconductor cooling chip 500, cold end 510, hot end 520, heat sink 600, heat dissipation channel 610. Detailed Implementation

[0032] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0033] In the description of this utility model, it should be understood that the directional descriptions, such as up, down, front, back, left, right, etc., indicate the directional or positional relationship based on the directional or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0034] In the description of this utility model, "several" means one or more, "multiple" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. If "first" or "second" is used in the description, it is only for the purpose of distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.

[0035] In the description of this utility model, unless otherwise explicitly defined, terms such as "setting," "installation," and "connection" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this utility model in conjunction with the specific content of the technical solution.

[0036] In related technologies, existing polishing machines generally include a frame, a turntable assembly, an abrasive mechanism, a first motor, and a second motor. The turntable assembly is rotatably mounted on the frame, and the abrasive mechanism is rotatably mounted on the turntable assembly. The first motor drives the turntable assembly to rotate, and the second motor drives the abrasive mechanism to rotate, so that the abrasive within the abrasive mechanism can polish the workpiece. During the workpiece polishing process, the high-speed friction between the abrasive and the workpiece surface generates a large amount of heat, which can easily cause surface burns and oxidation of the workpiece.

[0037] Reference Figures 1 to 5 According to an embodiment of the present invention, a polishing machine includes a frame 100, a turntable 220 assembly 200, a first drive assembly, an abrasive mechanism, and a second drive assembly. The turntable 220 assembly 200 includes a connecting shaft 210 and turntables 220 arranged opposite each other along the axial direction of the connecting shaft 210. The two ends of the connecting shaft 210 are respectively connected to the corresponding turntables 220. The turntables 220 are rotatably mounted on the frame 100. The first drive assembly is mounted on the frame 100 and is used to drive the turntables 220 to rotate. The abrasive mechanism includes an abrasive barrel 300 and a cover assembly 400. The abrasive barrel 300 is rotatably connected to the turntables 220. The abrasive mechanism is located on the opposite turntables. Between 220, the abrasive barrel 300 has a receiving cavity 401 for containing abrasive. The cover assembly 400 is rotatably connected to the abrasive barrel 300 to close or open the receiving cavity 401. The second drive assembly is disposed on the frame 100 and is used to drive the abrasive barrel 300 to rotate. The semiconductor cooling chip 500 is disposed on the cover assembly 400. The semiconductor cooling chip 500 has a cold end 510 and a hot end 520. The hot end 520 is away from the receiving cavity 401, and the cold end 510 is towards the receiving cavity 401, so that the semiconductor cooling chip 500 can reduce the temperature inside the receiving cavity 401 and avoid overheating of the workpiece surface to prevent the workpiece surface from being burned and oxidized.

[0038] For example, when the polishing machine is working, the first drive assembly drives the turntable 220 to rotate, so that the abrasive barrel 300 rotates around the axis of the turntable 220. The second drive assembly drives the abrasive barrel 300 to rotate, so that the abrasive barrel 300 rotates around its rotation axis. During the movement of the abrasive barrel 300, the abrasive inside the abrasive barrel 300 rubs against the surface of the workpiece. Since the cover assembly 400 is provided with a semiconductor cooling chip 500, the cold energy of the cold end 510 can be transferred to the receiving cavity 401 to cool the abrasive and the workpiece, thereby preventing the surface of the workpiece from overheating and preventing the surface of the workpiece from being burned and oxidized.

[0039] It should be noted that the first drive assembly includes a first motor and a first transmission structure. The first transmission structure includes a first transmission wheel, a second transmission wheel, and a first transmission belt. The first transmission wheel is located on the output shaft of the first motor, the second transmission wheel is connected to the corresponding turntable 220, and the first transmission belt is wound around the first and second transmission wheels to enable the first motor to drive the turntable 220 to rotate. As another embodiment, the first motor may directly drive the turntable 220 to rotate, which is not limited here.

[0040] It should be noted that the second drive assembly includes a second motor and a second transmission structure. The second transmission structure includes a third transmission wheel, a fourth transmission wheel, and a second transmission belt. The third transmission wheel is located on the output shaft of the second motor, and the fourth transmission wheel is connected to the corresponding abrasive barrel 300. The second transmission belt is wound around the third and fourth transmission wheels so that the second motor can drive the turntable 220 to rotate. As another embodiment, the second motor can also directly drive the abrasive barrel 300 to rotate; this is not a limitation.

[0041] In some embodiments of this utility model, the cover assembly 400 includes a base plate 410 and a cover plate 420 connected to the base plate 410. The base plate 410 and the cover plate 420 enclose a receiving cavity 401. The thermoelectric cooler 500 is housed in the receiving cavity 401, with the cold end 510 facing the base plate 410 and the hot end 520 facing the cover plate 420. This allows the thermoelectric cooler 500 to be hidden, so as to prevent the condensate generated by the cold end 510 of the thermoelectric cooler 500 from flowing into the receiving cavity 401.

[0042] It should be noted that the base plate 410 and the cover plate 420 are detachably connected. The detachable connection between the base plate 410 and the cover plate 420 is achieved through fasteners or snap-fit ​​structures, which are not limited here.

[0043] In some embodiments of this utility model, the base plate 410 is provided with a positioning groove 411 that communicates with the receiving cavity 401. At least a portion of the semiconductor cooling chip 500 is accommodated in the positioning groove 411, which facilitates the positioning of the semiconductor cooling chip 500 and makes it easier to install the semiconductor cooling chip 500.

[0044] For example, along the direction perpendicular to the thickness of the thermoelectric cooler 500, the cross-section of the thermoelectric cooler 500 is rectangular, the cross-section of the positioning groove 411 matches the cross-section of the thermoelectric cooler 500, and the outer peripheral surface of the thermoelectric cooler 500 abuts against the side wall of the positioning groove 411, which facilitates the positioning of the thermoelectric cooler 500 and makes it easier to install the thermoelectric cooler 500.

[0045] In some embodiments of this utility model, the base plate 410 is provided with a drain hole 412. One end of the drain hole 412 is connected to the positioning groove 411, and the other end of the drain hole 412 extends to the outer periphery of the base plate 410. The drain hole 412 is used to drain the condensate generated by the cold end 510 and can prevent the condensate from flowing into the receiving cavity 401.

[0046] For example, each positioning groove 411 has a drain hole 412 on its opposite sidewall. The end of the drain hole 412 away from the positioning groove 411 extends through to the corresponding outer peripheral surface of the base plate 410. The drain hole 412 can drain the condensate generated by the cold end 510 and prevent the condensate from flowing into the receiving cavity 401.

[0047] In some embodiments of this utility model, the drain hole 412 is an oblong hole, which can increase the effective flow area of ​​the drain hole 412 and discharge the condensate in the positioning groove 411 in a timely manner.

[0048] As another implementation, the cross-section of the drain hole 412 can also be a rectangular structure, as long as it can increase the effective flow area of ​​the drain hole 412, and there is no limitation here.

[0049] In some embodiments of this utility model, the base plate 410 is provided with a receiving groove 413 that connects to the positioning groove 411. The receiving groove 413 is used to receive the wires of the semiconductor cooling chip 500, which can facilitate the lead-out of the wires.

[0050] For example, there are two receiving slots 413, in which the wires connected to the positive terminal of the thermoelectric cooler 500 and the wires connected to the negative terminal of the thermoelectric cooler 500 are housed, which makes it easy to lead out the wires.

[0051] It should be noted that the two receiving slots 413 are located on both sides of the corresponding drain hole 412 along the length direction, and this is not restricted here.

[0052] In some embodiments of this utility model, the cover plate 420 is provided with a plurality of heat dissipation holes 421 arranged in an array at intervals. The heat dissipation holes 421 are connected to the receiving cavity 401 and can dissipate the heat generated by the hot end 520 of the semiconductor in a timely manner.

[0053] In some embodiments of this utility model, multiple semiconductor cooling chips 500 are configured, and the multiple semiconductor cooling chips 500 are spaced apart along the axial direction of the connecting shaft 210. On the one hand, this can increase the overall cooling effect of the cover assembly 400, and on the other hand, it can ensure uniform cooling of the abrasive and the surface cooling of the workpiece, so as to avoid local overheating of the workpiece surface.

[0054] In some embodiments of this utility model, a heat sink 600 is also included. The heat sink 600 is connected to the hot end 520. The heat sink 600 is provided with a plurality of heat dissipation channels 610 arranged side by side at intervals, which can dissipate the heat generated by the hot end 520 of the semiconductor in a timely manner.

[0055] In some embodiments of this utility model, the turntable 220 assembly 200 further includes multiple reinforcing columns 230, with each end of the reinforcing column 230 connected to a corresponding turntable 220. Multiple abrasive mechanisms are configured, and these mechanisms are spaced apart around the axis of the connecting shaft 210. At least one reinforcing column 230 is provided between adjacent abrasive barrels 300, which can improve the structural strength of the turntable 220 assembly 200. The reinforcing column 230 can assist the connecting shaft 210 in bearing force, thereby preventing the connecting shaft 210 from breaking or cracking, and improving the service life of the polishing machine.

[0056] For example, one end of the reinforcing column 230 is connected to one of the turntables 220, and the other end of the reinforcing column 230 is connected to another turntable 220. Since the reinforcing column 230 is located between adjacent abrasive barrels 300, on the one hand, the reinforcing column 230 can reduce the deformation of the turntable 220 near the abrasive barrel 300, and on the other hand, it can improve the structural strength of the turntable 220 assembly 200. The reinforcing column 230 can assist the connecting shaft 210 in bearing the force, so as to avoid the connecting shaft 210 from breaking or cracking, and can improve the service life of the polishing machine.

[0057] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0058] The present invention has been described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the invention.

Claims

1. A sizing machine, characterized in that, include: Rack (100); The turntable (220) assembly (200) includes a connecting shaft (210) and turntables (220) arranged opposite to each other along the axial direction of the connecting shaft (210). The two ends of the connecting shaft (210) are respectively connected to the corresponding turntables (220), and the turntables (220) are rotatably mounted on the frame (100). A first drive assembly is disposed on the frame (100), and the first drive assembly is used to drive the turntable (220) to rotate; An abrasive mechanism includes an abrasive barrel (300) and a cover assembly (400), the abrasive barrel (300) being rotatably connected to the turntable (220), the abrasive mechanism being located between opposing turntables (220), the abrasive barrel (300) having a receiving cavity (401) for receiving abrasive, and the cover assembly (400) being rotatably connected to the abrasive barrel (300) to close or open the receiving cavity (401); A second drive assembly is disposed on the frame (100), and the second drive assembly is used to drive the abrasive barrel (300) to rotate; A thermoelectric cooler (500) is disposed on the cover assembly (400). The thermoelectric cooler (500) has a cold end (510) and a hot end (520). The hot end (520) is away from the receiving cavity (401), and the cold end (510) is towards the receiving cavity (401), so that the thermoelectric cooler (500) can reduce the temperature inside the receiving cavity (401).

2. The sintering machine according to claim 1, characterized in that, The cover assembly (400) includes a base plate (410) and a cover plate (420) connected to the base plate (410). The base plate (410) and the cover plate (420) enclose a receiving cavity (401). The semiconductor cooling chip (500) is housed in the receiving cavity (401). The cold end (510) faces the base plate (410), and the hot end (520) faces the cover plate (420).

3. The sizing machine according to claim 2, characterized in that, The base plate (410) is provided with a positioning groove (411) communicating with the receiving cavity (401), and at least a portion of the semiconductor cooling chip (500) is accommodated in the positioning groove (411).

4. The sizing machine according to claim 3, characterized in that, The base plate (410) is provided with a drain hole (412). One end of the drain hole (412) is connected to the positioning groove (411), and the other end of the drain hole (412) extends to the outer periphery of the base plate (410). The drain hole (412) is used to drain the condensate generated by the cold end (510).

5. The sizing machine according to claim 4, characterized in that, The drainage hole (412) is a waist-shaped hole.

6. The sizing machine according to claim 3, characterized in that, The base plate (410) is provided with a receiving groove (413) that communicates with the positioning groove (411), and the receiving groove (413) is used to receive the wires of the semiconductor cooling chip (500).

7. The sintering machine according to claim 2, characterized in that, The cover plate (420) is provided with a plurality of heat dissipation holes (421) arranged in an array, and the heat dissipation holes (421) are connected to the receiving cavity (401).

8. The sizing machine according to claim 1, characterized in that, Multiple semiconductor cooling chips (500) are configured, and the multiple semiconductor cooling chips (500) are spaced apart along the axial direction of the connecting shaft (210).

9. The sintering machine according to claim 1, characterized in that, It also includes a heat sink (600), which is connected to the hot end (520), and the heat sink (600) is provided with a plurality of heat dissipation channels (610) arranged side by side at intervals.

10. The sintering machine according to claim 1, characterized in that, The turntable (220) assembly (200) also includes a plurality of reinforcing columns (230), the two ends of which are respectively connected to the corresponding turntable (220). A plurality of abrasive mechanisms are configured, and the plurality of abrasive mechanisms are spaced apart around the axis of the connecting shaft (210). At least one reinforcing column (230) is provided between adjacent abrasive barrels (300).

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