A chip thinning grinding disc

CN224701846UActive Publication Date: 2026-09-01ZHEJIANG LINGZHOU INTELLIGENCE EQUIP CO LTD
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Patent Information

Application Number
CN202522018278.8
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-09-19
Publication Date
2026-09-01
Estimated Expiration
2035-09-19

AI Technical Summary

Technical Problem

减薄常用的磨盘,采用磨石通过粘合剂固定在盘体上,为了设置更多的磨石,磨石间的间隙小,导致打磨过程中的磨削液和磨削产生的废物无法及时排出

Benefits of technology

[0013]本实用新型的有益效果是:安装部的长度大于打磨部的长度,使得相邻两个打磨部的侧壁之间的间距大于相邻两个安装部的侧壁之间的间距,既能确保相邻两个磨石之间的间距足够小,紧密排列,又能磨削液和磨削产生的废物及时排出。

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Abstract

This utility model discloses a chip thinning grinding disc, including a mounting disc with an annular mounting groove on its upper part. Several grinding stones are evenly distributed within the mounting groove, each grinding stone comprising a mounting portion and a grinding portion connected to the upper part of the mounting portion. The distance between the sidewalls of two adjacent grinding portions is greater than the distance between the sidewalls of two adjacent mounting portions. A through hole is provided at the grinding stone mounting position, connecting the lower end face of the mounting disc and the mounting groove. When the mounting disc needs to be retrieved, a metal rod can be inserted through the through hole from the back of the mounting disc to hold the grinding stones. Striking the metal rod breaks up any adhering grinding stone portions, making it easier to remove the remaining grinding stones from the mounting disc.
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Description

Technical Field

[0001] This utility model relates to the field of polishing tools, and more specifically, to a chip thinning polishing disc. Background Technology

[0002] In the front-end fabrication process of chip manufacturing, wafers need to maintain a certain thickness to ensure structural stability and ease of operation during the fabrication process. Currently, wafers of different diameters are cut into thin sheets with a thickness of 400–775 μm using diamond-plated saw wires. After one side is polished, the wafer fabrication process begins. After fabrication, the back side needs to be thinned by 120–300 μm to facilitate chip thinning and miniaturization during packaging and to improve heat dissipation. The commonly used thinning process involves using grinding stones fixed to the disc body with adhesive. To accommodate more grinding stones, the gaps between them are small, resulting in the inability to promptly remove grinding fluid and waste generated during the grinding process. Utility Model Content

[0003] The purpose of this invention is to overcome the shortcomings of the prior art and provide a chip thinning grinding disc.

[0004] To achieve the above objectives, the present invention adopts the following technical solution:

[0005] This utility model discloses a chip thinning grinding disc, including a mounting disc. The upper part of the mounting disc has a mounting groove, which is annular. Several grinding stones are installed in the mounting groove and are evenly distributed in the mounting groove. Each grinding stone includes a mounting part and a grinding part. The grinding part is connected to the upper part of the mounting part. The distance between the side walls of two adjacent grinding parts is greater than the distance between the side walls of two adjacent mounting parts.

[0006] Furthermore, the distance between the sidewalls of two adjacent mounting parts is 0.2-0.5 mm.

[0007] Furthermore, the distance between the sidewalls of two adjacent grinding sections is 1.5-2mm.

[0008] Furthermore, the mounting plate has several through holes, which are arranged along the axial direction of the mounting plate. The through holes connect the lower end face of the mounting plate and the mounting groove, and one end of the through hole that connects to the mounting groove corresponds to the installation position of each grinding stone.

[0009] Furthermore, the width of the mounting section is 0.1-0.3mm wider than the width of the grinding section.

[0010] Furthermore, the mounting plate includes a plate body and a mounting block. The plate body has an opening that matches the mounting block, and the plate body and the mounting block are connected by bolts.

[0011] Furthermore, stepped holes are provided on the outer periphery and upper part of the mounting block, and threaded holes are provided on the main body of the disc corresponding to the stepped holes. Bolts are screwed into the threaded holes through the stepped holes.

[0012] Furthermore, the mounting groove is a dovetail-shaped recess, and the shape of the mounting part matches the mounting groove.

[0013] The beneficial effects of this utility model are: the length of the mounting part is greater than the length of the grinding part, so that the distance between the side walls of two adjacent grinding parts is greater than the distance between the side walls of two adjacent mounting parts. This ensures that the distance between two adjacent grinding stones is small enough and they are closely arranged, and that the grinding fluid and grinding waste are discharged in a timely manner. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of one structure of the chip thinning grinding disc in this embodiment;

[0015] Figure 2 This is a top view of the chip thinning grinding disc in this embodiment;

[0016] Figure 3 for Figure 2 AA section view;

[0017] Figure 4 for Figure 2 Enlarged view of point B in the middle;

[0018] Figure 5 This is a partial cross-sectional view of the chip thinning grinding disk in another embodiment;

[0019] Figure 6 This is a partial cross-sectional view of the chip thinning grinding disc in another embodiment;

[0020] Figure 7 This is a top view of the chip thinning grinding disc in another embodiment;

[0021] Figure 8 This is a side view of the chip thinning grinding disc in another embodiment.

[0022] Reference numerals: 1. Mounting disc; 2. Grinding stone; 3. Through hole; 4. Mounting groove; 5. Mounting part; 6. Grinding part; 7. Disc body; 8. Opening; 9. Mounting block; 10. Stepped hole. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0024] like Figures 1-4 As shown, a chip thinning grinding disc includes a mounting disc 1, which is circular in shape and made of aluminum alloy. A mounting groove 4 is formed on the upper part of the mounting disc 1. The mounting groove 4 is annular, and several grinding stones 2 are installed within the mounting groove 4, evenly distributed within it. Each grinding stone 2 includes a mounting part 5 and a grinding part 6. The grinding part 6 is connected to the middle of the upper part of the mounting part 5. The mounting part 5 and the grinding part 6 are integrally molded. The mounting part 5 is located within the mounting groove 4, and the grinding part 6 extends out of the mounting groove 4. The bottom of the mounting part 5 and the bottom of the mounting groove 4 are connected by an adhesive. The length of the mounting part 5 is greater than the length of the grinding part 6, allowing for a larger contact area between the mounting part 5 and the mounting groove 4, thereby strengthening the adhesion. Simultaneously, the distance between the sidewalls of two adjacent grinding parts 6 is greater than the distance between the sidewalls of two adjacent mounting parts 5. The distance between the sidewalls of two adjacent mounting parts 5 is 0.2-0.5 mm, a small distance that ensures a sufficiently small and tightly arranged spacing between adjacent grinding stones 2. The distance between the sidewalls of two adjacent grinding sections 6 is 1.5-2mm. This relatively large distance facilitates the timely discharge of grinding fluid and grinding waste from the gap.

[0025] Furthermore, after the grinding stone 2 reaches its specified lifespan, it is scrapped, but the mounting plate 1 remains intact and can be reused with proper treatment. Currently, domestic companies remove the scrapped grinding stone parts using a lathe, but cutting the grinding stone with a lathe tool causes severe tool wear. Moreover, the removed grinding stone causes significant damage to the machine tool, and coupled with labor and time costs, the recycling cost is not ideal. By creating several through holes 3 within the mounting plate 1, with the through holes 3 arranged axially along the mounting plate 1, connecting the lower end face of the mounting plate 1 to the mounting groove 4, and with one end of the through hole 3 corresponding to the mounting position of each grinding stone 2, during scrapping, a metal rod can be passed through the through hole 3 to hold the grinding stone 2, and the adhered grinding stone 2 can be knocked off by striking the metal rod. The remaining grinding stone 2 can then be removed from the mounting plate 1 through machining, significantly improving the efficiency of removing residual grinding stone, reducing tool wear and labor costs, and facilitating the recycling of the mounting plate 1.

[0026] In another embodiment, such as Figure 5As shown, the width of the mounting part 5 is 0.1-0.3mm wider than the width of the grinding part 6. The increased area of ​​the mounting part 5 can better support the grinding part 6 and also increase the contact area with the mounting groove 4 to increase the bonding strength.

[0027] The cross-section of the mounting slot 4 can be set to a rectangle to facilitate the insertion of the mounting part 5.

[0028] In another embodiment, such as Figure 6 As shown, the mounting groove 4 is a dovetail-shaped groove, and the shape of the mounting part 5 matches the mounting groove 4. This shape allows the mounting groove 4 to have a certain limiting ability on the mounting part 5, which reduces the requirements for the bonding performance of the adhesive while still meeting the requirements for bonding strength.

[0029] The structure of the mounting slot 4 prevents the grinding stone 2 from being inserted from above the mounting slot 4, thus requiring the mounting plate 1 to be split into two parts, such as... Figure 7 , Figure 8 As shown, the mounting plate 1 is formed by assembling the plate body 7 and the mounting block 9. The plate body 7 has an opening 8 that matches the mounting block 9, and the plate body 7 and the mounting block 9 are connected by bolts.

[0030] The opening 8 is larger than the length of the mounting part 5, so that the mounting part 5 can be inserted into the mounting slot 4 on the disk body 7 through the opening 8.

[0031] Stepped holes 10 are provided on the outer periphery and upper part of the mounting block 9. Threaded holes are provided on the disk body 7 corresponding to the positions of the stepped holes 10. Bolts are passed through the stepped holes 10 and screwed into the threaded holes. Using multiple bolts to fix the two together enhances the strength of the connection between the disk body 7 and the mounting block 9.

[0032] The above description is merely a preferred embodiment of this utility model. The protection scope of this utility model is not limited to the above embodiments. All technical solutions falling within the scope of this utility model's concept are protected. It should be noted that for those skilled in the art, any improvements and modifications made without departing from the principle of this utility model should also be considered within the protection scope of this utility model.

Claims

1. A chip thinning grinding disc, characterized in that, The device includes a mounting plate (1), which has a mounting groove (4) on its upper part. The mounting groove (4) is annular and contains several grinding stones (2). The grinding stones (2) are evenly distributed in the mounting groove (4). Each grinding stone (2) includes a mounting part (5) and a polishing part (6). The polishing part (6) is connected to the upper part of the mounting part (5). The distance between the side walls of two adjacent polishing parts (6) is greater than the distance between the side walls of two adjacent mounting parts (5).

2. The chip thinning grinding disc according to claim 1, characterized in that, The distance between the sidewalls of two adjacent mounting parts (5) is 0.2-0.5mm.

3. The chip thinning grinding disc according to claim 2, characterized in that, The distance between the sidewalls of two adjacent grinding sections (6) is 1.5-2mm.

4. The chip thinning grinding disc according to claim 1, characterized in that, The mounting plate (1) has several through holes (3) arranged along the axial direction of the mounting plate (1). The through holes (3) connect the lower end face of the mounting plate (1) and the mounting groove (4). One end of the through hole (3) connected to the mounting groove (4) corresponds to the installation position of each grinding stone (2).

5. The chip thinning grinding disc according to claim 1, characterized in that, The width of the mounting part (5) is 0.1-0.3 mm greater than the width of the grinding part (6).

6. The chip thinning grinding disc according to claim 1, characterized in that, The mounting plate (1) includes a plate body (7) and a mounting block (9). The plate body (7) has an opening (8) that matches the mounting block (9). The plate body (7) and the mounting block (9) are connected by bolts.

7. The chip thinning grinding disc according to claim 6, characterized in that, The mounting block (9) has stepped holes (10) on its outer periphery and upper part. The disc body (7) has threaded holes at the positions corresponding to the stepped holes (10). Bolts pass through the stepped holes (10) and are screwed into the threaded holes.

8. The chip thinning grinding disc according to claim 7, characterized in that, The mounting groove (4) is a dovetail-shaped groove, and the shape of the mounting part (5) matches the mounting groove (4).