A high-degree-of-freedom wafer handling robot

Abstract

This utility model discloses a high-degree-of-freedom wafer handling robot, including a frame, a lifting module, an arm module, a vacuum suction gripper, and a control system module. The lifting module is installed inside the frame and is used to drive the arm module to lift vertically. The arm module rotates and extends via a rotary motor, driving the vacuum suction gripper to pick up and grasp the wafer. The control system module is used for the logic and functional control of the wafer handling robot. This high-degree-of-freedom wafer handling robot uses a pure motor structure for its joints, replacing the traditional gear and belt structure with a hollow rotary platform (miniature right-angle reducer). Because there are no belts or gears inside, it avoids the maintenance costs of regularly replacing belts or adding lubricating oil, and also avoids the difficulty of equipment maintenance caused by complex internal structures. If a fault occurs, the present invention can directly replace the motor to complete the repair, effectively reducing maintenance waiting time.

Description

Technical Field

[0001] This utility model relates to the field of wafer manufacturing and testing technology, specifically to a high-degree-of-freedom wafer handling robot. Background Technology

[0002] With technological advancements, in order to improve production efficiency and further prevent wafers from being contaminated or damaged during testing, it is necessary to use robotic arms to move wafers from carriers (such as FOUP and Cassette) to precision testing stands (Chuck) and put them back after testing.

[0003] Defects and shortcomings of existing technology:

[0004] The testing equipment has a small internal space, and existing robotic arms cannot perfectly adapt to the loading and unloading tasks in such a confined space.

[0005] The communication methods are outdated and cannot meet the current demand for fast and stable communication.

[0006] Its internal structure is complex, making it prone to malfunctions or difficult to maintain. Utility Model Content

[0007] The technical problem solved by this utility model is to provide a solution.

[0008] The technical solution adopted by this utility model to solve its technical problem is:

[0009] A high-degree-of-freedom wafer handling robot includes a frame, a lifting module, an arm module, a vacuum suction gripper, and a control system module.

[0010] The frame includes a base plate, a top plate, and several linear guide rails connecting the base plate and the top plate. The base plate, the top plate, and the several linear guide rails constitute the main frame of the frame.

[0011] The lifting module includes a lifting motor, a ball screw, and a hollow lifting column. The lifting motor drives the ball screw to rotate, and the ball screw converts the rotational motion of the lifting motor into the linear motion of the lifting column.

[0012] The arm module includes a front arm, a middle arm, finger components, and joint components connecting them. The joint components utilize hollow rotating platforms. The front arm is mounted on the upper end of the lifting column via a first hollow rotating platform, which drives the front arm to rotate on the upper end of the lifting column. The middle arm is mounted on the upper front part of the front arm via a second hollow rotating platform, which drives the middle arm to rotate on the upper front part of the front arm. The finger components are mounted on the upper front part of the middle arm via a third hollow rotating platform, which drives the finger components to rotate on the upper front part of the middle arm.

[0013] The front end of the finger component is also fitted with a vacuum adsorption gripper for adsorbing and grasping wafers.

[0014] The control system module includes a main controller for logic and function control, and several motor drivers for driving the various motors in the lifting module and the arm module.

[0015] Preferably, the lifting motor is located next to the ball screw, and the lifting motor and the ball screw are connected and power transmitted through pulleys and belts.

[0016] Furthermore, the lifting motor is inverted and mounted on the upper end of the base plate via a motor base, and the motor base is regularly provided with receiving grooves to accommodate the pulleys; the ball screw is mounted and fixed on the upper end of the base plate via a screw base, and the screw base is also regularly provided with receiving grooves to accommodate the pulleys.

[0017] Furthermore, the ball screw nut and the lifting column are connected together by an adapter plate. The adapter plate is installed and fixed at the bottom end of the lifting column and sleeved on the ball screw nut. The ball screw nut drives the lifting column to move vertically up and down through the adapter plate.

[0018] Furthermore, the adapter plate is slidably connected to the plurality of linear guide rails via a bushing.

[0019] Furthermore, the plurality of motor drivers are suspended from the lower end of the top plate or fixed to the upper end of the bottom plate via driver brackets.

[0020] Furthermore, it also includes a communication interface module, which includes at least one type of communication interface. The communication interface module is electrically connected and communicates with the main controller via a cable. The communication interface module is suspended from the lower end of the top plate or fixed to the upper end of the bottom plate via an interface bracket.

[0021] Furthermore, it also includes a cooling fan for dissipating heat from the inside of the rack.

[0022] Furthermore, the rack is also encapsulated and packaged by an outer shell.

[0023] The beneficial effects of this utility model are:

[0024] This invention discloses a high-degree-of-freedom wafer handling robot. Its joints utilize a pure electric motor structure, replacing the traditional gear and belt structure with a hollow rotating platform (miniature right-angle reducer). The rotation angle of the motor controls each joint and arm to perform different movements, solving the problem of traditional robots only being able to follow fixed paths. This effectively improves operating efficiency in confined and complex spaces, while also enabling actions that traditional robots cannot perform. Furthermore, because there are no internal belts or gears, the maintenance costs associated with periodic belt replacements or increased lubrication are avoided, as are the difficulties in equipment repair caused by complex internal structures. If a fault occurs, the invention can be repaired simply by replacing the motor, effectively reducing repair waiting time. Attached Figure Description

[0025] Figure 1 This is a structural diagram of the present invention after the outer shell is concealed;

[0026] Figure 2 for Figure 1 Back structure diagram;

[0027] Figure 3 This is a view of the overall appearance of the present invention;

[0028] Figure 4 for Figure 1 Exploded view of the middle arm module;

[0029] The diagram is marked as follows:

[0030] 10. Wafers;

[0031] 11. Base plate; 12. Top plate; 13. Linear guide rail; 14. Housing.

[0032] 21. Lifting motor; 22. Ball screw; 23. Lifting column; 24. Belt; 25. Adapter plate; 26. Bushing.

[0033] 31. Rotary motor; 32. Front arm; 3101. Motor; 3102. Rotary table; 3201. Motor mounting slot;

[0034] 41. Central motor; 42. Central arm;

[0035] 51. Finger motor; 52. Finger components; 53. Vacuum suction gripper;

[0036] 61. Motor driver; 611. Driver bracket;

[0037] 71. Communication interface; 711. Interface bracket;

[0038] 81. Cooling fan;

[0039] 91. Main controller. Detailed Implementation

[0040] To make the above-mentioned objects, features, and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a full understanding of this utility model. However, this utility model can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this utility model. Therefore, this utility model is not limited to the specific embodiments disclosed below.

[0041] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0042] like Figures 1-4 As shown, this utility model provides a high-degree-of-freedom wafer handling robot, including a frame, a lifting module, an arm module, a vacuum suction gripper, and a control system module. The lifting module is installed inside the frame and is used to drive the arm module to move vertically up and down, thus realizing the lifting action of the arm module. The arm module rotates and extends via a rotary motor, driving the vacuum suction gripper to pick up and grasp the wafer 10. The control system module is used for the logic and functional control of the wafer handling robot.

[0043] like Figure 1 As shown, the frame includes a base plate 11, a top plate 12, and several linear guide rails 13 connecting the base plate and the top plate. The base plate 11, the top plate 12, and the several linear guide rails 13 constitute the main frame of the frame.

[0044] Furthermore, such as Figure 3 As shown, the rack is also encapsulated and packaged by the outer shell 14.

[0045] like Figure 1As shown, the lifting module includes a lifting motor 21, a ball screw 22, and a lifting column 23. The lifting motor 21 drives the ball screw 22 to rotate, and the ball screw 22 converts the rotational motion of the lifting motor 21 into the linear motion of the lifting column 23.

[0046] Furthermore, such as Figure 1 As shown, in one embodiment, the lifting motor 21 is positioned next to the ball screw 22, and the lifting motor 21 and the ball screw 22 are connected and power transmitted via pulleys and a belt 24. In this embodiment, the lifting motor 21 is invertedly mounted on the upper end of the base plate 11 via a motor base 211, and the motor base 211 has regularly arranged receiving grooves for accommodating pulleys. Correspondingly, the ball screw 22 is mounted and fixed to the upper end of the base plate 11 via a screw base 221, which also has regularly arranged receiving grooves for accommodating pulleys.

[0047] In another embodiment, the lifting motor 21 is located at the rear end of the ball screw 22 and is directly connected and transmits power via a coupling.

[0048] Furthermore, such as Figure 1 As shown, the lifting column adopts a hollow tube design, which facilitates the routing and arrangement of cables. The cables pass through the lifting column and are electrically connected to the control system module inside the frame.

[0049] Furthermore, the ball screw nut of the ball screw 22 is connected to the lifting column 23 via an adapter plate 25. The adapter plate 25 is fixed to the bottom end of the lifting column 23 and fitted onto the ball screw nut. The ball screw nut drives the lifting column 23 to move vertically up and down via the adapter plate 25.

[0050] Furthermore, in order to improve the stability of the lifting column movement, the lifting column 23 is also slidably connected to several linear guide rails 13 through an adapter plate and a bushing 26.

[0051] like Figure 1 and Figure 2 As shown, the control system module includes several motor drivers 6 and a main controller 9. The motor drivers 6 are electrically connected and communicate with each motor in the lifting module and the arm module via cables. The main controller 9 is used for the logic and functional control of the wafer handling robot, and is electrically connected and communicates with the several motor drivers 6 via cables.

[0052] like Figure 1 and Figure 4As shown, the arm module includes a front arm 32, a middle arm 42, and a finger component 52. The front arm 32 is mounted on the upper end of the lifting column 23 via a rotary motor 31, which drives the front arm 32 to rotate on the upper end of the lifting column 23. The middle arm 42 is mounted on the upper front part of the front arm 32 via a middle motor 41, which drives the middle arm 42 to rotate on the upper front part of the front arm 32. The finger component 52 is mounted on the upper front part of the middle arm 42 via a finger motor 51, which drives the finger component 52 to rotate on the upper front part of the middle arm 42.

[0053] Furthermore, a vacuum adsorption gripper 53 is also installed and fixed at the front end of the finger component 52. The vacuum adsorption gripper 53 is used to adsorb and grasp the wafer 10.

[0054] Furthermore, such as Figure 4 As shown, the rotary motor 31, the central motor 41, and the finger motor 51 all adopt a hollow rotary platform. The hollow rotary platform includes a servo motor 3101, a reducer, gears, and a rotary table 3102. The rotary table 3102 has a through hole in the middle to facilitate the passage of cables and pipes.

[0055] This invention discloses a high-degree-of-freedom wafer handling robot. Its joints (31, 41, 51) utilize a pure electric motor structure, replacing the traditional gear and belt structure with a hollow rotating platform (miniature right-angle reducer). The rotation angle of the motor controls each joint and arm to perform different movements, solving the problem of traditional robots only being able to follow fixed paths. This effectively improves operating efficiency in confined and complex spaces, while also enabling the robot to perform actions that traditional robots cannot. Furthermore, because there are no internal belts or gears, the maintenance costs associated with periodic belt replacements or increased lubrication are avoided, as are the difficulties in equipment repair caused by complex internal structures. If a fault occurs, the invention can be repaired simply by replacing the motor, effectively reducing repair waiting time.

[0056] Furthermore, such as Figure 4 As shown, the front arm 32 and the middle arm 42 have the same structure. The front end is regularly provided with a motor mounting base 3201 to facilitate the installation and fixation of the middle motor 41 and the finger motor 51. The rear end is regularly provided with a rotary table fixing base to facilitate the connection of the rotary table 3102. The middle part is regularly provided with a hollow cavity to facilitate the passage of cables and pipes.

[0057] The technical solutions for the finger component 53 and the vacuum adsorption gripper 53 can be found in the patent application for an automated wafer handling device (publication number: CN221459155U).

[0058] like Figure 1As shown, several motor drivers 61 are suspended from the lower end of the top plate 12 or fixed to the upper end of the bottom plate 11 via driver brackets 611.

[0059] like Figure 2 As shown, the main controller 91 is disposed between several linear guide rails 13 and is fixedly mounted on the upper end of the base plate 11.

[0060] Furthermore, such as Figure 2 As shown, the high-degree-of-freedom wafer handling robot of this utility model also includes a communication interface module 71. The communication interface module 71 includes at least one type of communication interface. The communication interface module 71 is electrically connected and communicates with the main controller 91 via a cable. The communication interface module 71 is suspended at the lower end of the top plate 12 or fixed to the upper end of the base plate 11 via an interface bracket 711.

[0061] Furthermore, such as Figure 3 As shown, the communication interface module 71 is installed through the housing 14, which facilitates electrical connection and communication with the host computer.

[0062] Furthermore, a power interface is also provided on the interface bracket 71.

[0063] Furthermore, the high-degree-of-freedom wafer handling robot of this utility model also includes a cooling fan 81, which is fixed to the base plate 11 by a bracket. The cooling fan 81 is disposed through the outer casing 14.

[0064] This utility model provides two control actions:

[0065] The first method is the traditional R-θ-Z coordinate control method, in which the θ axis is rotated by the rotary motor 31, the R axis is moved by the joint motors (31, 41, 51) in linkage, and the Z axis is moved by the lifting motor 21. This control method can meet the control requirements of all traditional robotic arms and complete the wafer handling action.

[0066] The second method is the XYZ coordinate control method, which can realize the movement of the arm tip in the XY plane through the linkage of joint motors (31, 41, 51), or the movement of point-to-point straight lines, arcs and other trajectories through interpolation algorithms. This method can realize wafer handling work of a single arm at multiple workstations.

[0067] The above specific embodiments further illustrate the purpose, technical solution, and beneficial effects of this utility model. It should be understood that the above are only specific embodiments of this utility model and are not intended to limit this utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A high-degree-of-freedom wafer handling robot, comprising a frame, a lifting module, an arm module, a vacuum suction gripper, and a control system module, characterized in that: The frame includes a base plate, a top plate, and several linear guide rails connecting the base plate and the top plate. The base plate, the top plate, and the several linear guide rails constitute the main frame of the frame. The lifting module includes a lifting motor, a ball screw, and a hollow lifting column. The lifting motor drives the ball screw to rotate, and the ball screw converts the rotational motion of the lifting motor into the linear motion of the lifting column. The arm module includes a front arm, a middle arm, finger components, and joint components connecting them. The joint components employ hollow rotating platforms. The front arm is mounted on the upper end of the lifting column via a first hollow rotating platform, which drives the front arm to rotate on the upper end of the lifting column. The middle arm is mounted on the upper front part of the front arm via a second hollow rotating platform, which drives the middle arm to rotate on the upper front part of the front arm. The finger components are mounted on the upper front part of the middle arm via a third hollow rotating platform, which drives the finger components to rotate on the upper front part of the middle arm. The front end of the finger component is also fitted with a vacuum adsorption gripper for adsorbing and grasping wafers. The control system module includes a main controller for logic and function control, and several motor drivers for driving the various motors in the lifting module and the arm module.

2. The high-degree-of-freedom wafer handling robot according to claim 1, characterized in that: The lifting motor is located next to the ball screw, and the lifting motor and the ball screw are connected and power transmitted through pulleys and belts.

3. The high-degree-of-freedom wafer handling robot according to claim 2, characterized in that: The lifting motor is mounted upside down on the upper end of the base plate via a motor base, and the motor base has regularly arranged receiving grooves for accommodating the pulleys; the ball screw is mounted and fixed on the upper end of the base plate via a screw base, and the screw base also has regularly arranged receiving grooves for accommodating the pulleys.

4. The high-degree-of-freedom wafer handling robot according to claim 1, characterized in that: The ball screw nut and the lifting column are connected together by an adapter plate. The adapter plate is installed and fixed at the bottom end of the lifting column and is sleeved on the ball screw nut. The ball screw nut drives the lifting column to move vertically up and down through the adapter plate.

5. A high-degree-of-freedom wafer handling robot according to claim 4, characterized in that: The adapter plate is slidably connected to the plurality of linear guide rails via a bushing.

6. The high-degree-of-freedom wafer handling robot according to claim 1, characterized in that: The plurality of motor drivers are suspended from the lower end of the top plate or fixed to the upper end of the bottom plate via driver brackets.

7. The high-degree-of-freedom wafer handling robot according to claim 1, characterized in that: It also includes a communication interface module, which includes at least one type of communication interface. The communication interface module is electrically connected and communicates with the main controller via a cable. The communication interface module is suspended from the lower end of the top plate or fixed to the upper end of the bottom plate via an interface bracket.

8. The high-degree-of-freedom wafer handling robot according to claim 1, characterized in that: It also includes a cooling fan for dissipating heat from the inside of the rack.

9. A high-degree-of-freedom wafer handling robot according to any one of claims 1-8, characterized in that: The frame is also encapsulated and packaged by an outer shell.

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